JPH09214093A - Mounting circuit device and manufacture of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower the mounting face of an electronic component by providing the electronic component installed and mounted on the notch part of a board and a conductive material which is applied in the notch part and electrically connects the connection terminal parts of the electronic component to connection pads. SOLUTION: The through hole-type notch part 2 corresponding to the form and the size of the electronic component 4 is formed on an area where the electronic component is installed and mounted is formed on the wiring board 1. A pair of holes 2a whose diameters do not exceed 1.00mm being the length of the shorter side of the electronic component 4 are provided through the notch part 2 with the long side end part of the electronic part 4 as a center point in the prescribed areas of the wiring board 1. Then, an area straddling the through holes 2a is punched and formed. Solder paste 5 is applied to a connection pad 3 forming face, the electronic component 4 is positioned, installed and arranged in the notch part 2 and a heat processing is executed. Then, the electrode terminals 4a of the electronic component 4 are electrically connected to the corresponding connection pads 3 and are mechanically fixed to the wiring board. Thus, the mounting face of the electronic component can be lowered.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounted circuit device and a method of manufacturing the same, and more particularly to a light, thin and miniaturized mounted circuit device and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, as electronic devices have become more compact, the mounted circuit devices, which are the main electronic components of those electronic devices, are also being made higher in capacity and thinner. By the way, in this type of mounted circuit device, a semiconductor chip or a resistor element is surface-mounted on a wiring substrate surface having a wiring pattern on one main surface, or a semiconductor package or a semiconductor package is provided in a conductive type pin insertion hole which is provided in advance. After the lead pin of the resistor element is inserted and mounted by soldering, the mounting surface is sealed with a resin mold or the like.

[0003]

The mounted circuit device having the above structure has the advantage that the manufacturing or assembling process is relatively simple, but has the following disadvantages. That is, in the mounting circuit device of the lead pin insertion type,
Although accurate mounting and placement of electronic components can be easily performed, there is a problem in that it is not possible to reduce the thickness and size of the device as a whole by making it three-dimensional. On the other hand, in the case of the surface mount type, the electronic components are mounted on a flat substrate surface, so not only must careful attention be paid to ensure highly accurate positioning and placement, but the thickness of the mounted circuit device is also the minimum This is the sum of the thickness of the board and the thickness of the electronic component, which is still insufficient in terms of thinning.

With respect to the problem of thinning the mounted circuit device,
A configuration has been developed in which an electronic component mounting area of a wiring board is made concave and mounting components are mounted and arranged on the concave surface. That is, for example, a semiconductor chip is mounted face-up on the recessed surface while the input / output terminals of the semiconductor chip and connection pads on the main surface are wire-bonded substantially horizontally, or a resistance element or a capacitor is mounted. Arrangements have been developed that are arranged and electrically connected to a predetermined wiring pattern.

However, in the case of a thinned mounting circuit device in which the electronic parts are embedded in a wiring board, practically,
There are the following inconvenient problems. That is, there are advantages that the embedded electronic components can be made thinner and the length of the bonding wire can be reduced. On the other hand, when a wiring board on which electronic components are mounted and mounted is molded by a transfer molding method with, for example, an epoxy resin, a bonding wire may be cut off, which is a concern for reliability. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a highly reliable mounting circuit device that is thin and compact, and a method capable of manufacturing the mounting circuit device with high yield.

[0006]

According to a first aspect of the present invention, there is provided a wiring board having at least a wiring pattern on one main surface thereof, and a notch portion penetrating in a thickness direction for mounting and mounting electronic components. A connection pad that is connected to the wiring pattern of the wiring board and extends on the inner wall of the cutout portion; an electronic component that is mounted and mounted in the cutout portion of the wiring board; A mounted circuit device comprising: a conductor that electrically connects a connection terminal portion of a component to a connection pad.

According to a second aspect of the present invention, in the mounted circuit device according to the first aspect, a part of the electronic component mounted and mounted in the cutout portion of the wiring board is separated from a side wall of the cutout portion. To do.

According to a third aspect of the present invention, there is provided a step of forming a wiring board having at least a wiring pattern on one main surface and having a notch portion penetrating in a thickness direction for mounting and mounting electronic components, A step of forming connection pads connected to the wiring pattern on the inner wall surface of the cutout portion of the wiring board; a step of positioning and mounting and arranging an electronic component in the cutout portion of the wiring board; and a connection terminal of the positioning and mounting and arranging electronic component And a step of electrically connecting the parts to corresponding connection pads.

According to a fourth aspect of the present invention, in the method of manufacturing the mounted circuit device according to the third aspect, the formation of the notch in the wiring board is performed.
After drilling a pair of holes with a diameter not exceeding 1.0 mm, which is the short side length of the electronic component to be mounted and arranged, and with the long side end as the center point, punch out the area that spans both holes. It is characterized in that it is formed by penetrating in the vertical direction.

According to a fifth aspect of the present invention, in the method of manufacturing the mounted circuit device according to the third or fourth aspect, a part of the electronic component is mounted and arranged in the cutout portion of the wiring board while being separated from the side wall of the cutout portion. It is characterized by

In the mounting circuit device according to the present invention, the electronic component mounting region of the wiring board is notched in a through hole type, the electronic component is mounted and arranged in the notched portion, and the mounting surface of the electronic component is lowered. The overall thickness is thin. Here, the electronic component is a passive component such as a semiconductor package, a chip capacitor, or a chip resistor, and at least one of them is to be mounted in order to achieve high functionality or high capacity. You can also

Further, the electrical connection on the wiring pattern side to the input / output terminals of the electronic component is performed by soldering or attaching a conductive paste to a connection pad extended on the side wall of the notch. Although the extension of the connection pad to the side wall of the cutout portion varies depending on the degree of miniaturization of the wiring pattern, the pitch of the connection pad, and the like, in general, electroless plating,
It is performed by electroplating or a combination of these.

In the structure of the mounting circuit device according to the present invention, in order to ensure overall environmental resistance, the mounting surface of the electronic component is generally covered with a sealing resin, such as an epoxy resin. It can also be molded) sealed.

In the mounting circuit device and the manufacturing method thereof according to the present invention, the means for forming the electronic component mounting notch of the wiring board is not particularly limited, but the short side length of the electronic component to be mounted and arranged exceeds 1.0 mm. After forming a pair of holes with a non-diameter and having the long side end as the center point in the wiring board, the region extending over both holes is punched in the thickness direction to form the required notch. In addition, the risk of damaging the wiring board is reduced, and more preferable mounting and mounting of electronic components can be achieved. The pair of holes serving as the punching base may be formed by assembling a plurality of holes each having a small outer diameter, and the shape may be an elliptical shape other than a circular shape.
It may be a square or the like.

According to the first and second aspects of the present invention, the electronic components are mounted and mounted in a state of being embedded in the wiring board, so that the electronic components can be made thin, and the electrical connection is notched. Since it is performed by soldering with the connection pad extended on the side wall, there is no fear of disconnection and the reliability of the connection is greatly improved. In particular, when a structure is adopted in which a void is left on the side surface of the electronic component mounted / mounted in the through-hole type notch, the heat dissipation is also improved, so that the stability or reliability of the function is improved. .

According to the inventions of claims 3 to 5, since the mounting and mounting are carried out without the possibility of a connection failure (Manhattan phenomenon) due to the rising of the electronic parts and the electrical connection portion, the required mounting is performed with a high yield. A circuit device can be provided.
In addition, when mounting and mounting electronic components in the notch, the force (self-alignment) that optimally corrects and sets the position is
In addition to more effective operation, the movement of the electronic component in the soldering process of electrical connection is planar, and the risk of occurrence of a solder bridge is reduced, so that workability is improved and production yield is improved.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, FIG. 1 and FIG. 2 (a) to (e)
An example will be described with reference to FIG.

FIG. 1 is a sectional view showing the structure of a main part of a mounted circuit device according to this embodiment. In FIG. 1, reference numeral 1 is a wiring board having at least a wiring pattern 1a on one main surface and a notch 2 for mounting and mounting electronic components.
Is a notch 2 which is connected to the wiring pattern 1a of the wiring board 1.
Connection pads 4 extended on the inner wall are electronic components mounted on and mounted in the notches 2 of the wiring board 1, for example, resistance elements. Here, the wiring board 1 is a multilayer wiring board in which the notch 2 is provided in a through-type in the thickness direction and avoids wiring patterning in this region, and the conductor layer forming the connection pad 3 is formed by a plating method. Has been done.

Further, 5 is a solder layer coated on the notch 2 of the wiring board 1 for electrically connecting the connection terminal 4a of the electronic component 4 to the connection pad 3, and 6 is the electronic component 4 mounted.・
It is a mold resin layer for sealing the one surface of the mounted wiring board. Here, the mold resin layer 6 is made of, for example, an epoxy resin-based sealing resin and is formed by the transfer molding method, but the mold resin layer 6 may be omitted.

Next, an example of a method of manufacturing the mounted circuit device will be described.

2 (a) to 2 (d) schematically show an embodiment in the manufacturing process.

First, at least the wiring pattern 1a is formed on one main surface.
A wiring board 1 having (not shown) is prepared, and as shown in a perspective view of FIG.
The through hole type notch 2 corresponding to the shape and size of the electronic component (for example, the resistance element) 4 is formed. Where notch 2
As shown in the plan view of FIG. 2 (b), the wiring board 1 is formed.
After a pair of holes 2a having a diameter not exceeding 1.0 mm, which is the short side length of the electronic component 4, are formed in a predetermined area of the electronic component 4 to be mounted / mounted with the long side end portion as a center point. As shown in plan view in (c), a region straddling both holes 2a is punched out.

More specifically, when the short side length of the electronic component 4 is a, the radius r of the drilled hole 2a is set to (a + n) / 2. However, n = 0 to 1.0 mm. Also, a hole
The center of 2a is the center of the short side a of the electronic component 4, and when the distance between the long side end of the electronic component 4 and the inner wall surface of the drilled hole 2a is α,

[Equation 1] However, the distance α = 0 to 0.3 mm is set inside the long side end of the electronic component 4. Next, chemical plating and electroplating are used together to form a conductor layer forming the connection pad 3 on the inner wall surfaces of both the holes 2a. This step is similar to the through-hole forming step in a normal wiring board. On the other hand, in the punching of the region straddling both the holes 2a, when the long side length of the electronic component 4 is b and the length of the electrode terminal of the electronic component 4 is c, the length direction y is y = b-2 (c + m), where m = -0 to 0.1 mm. In the width direction z, z = 2r +
p, where p = 0 to 0.1 mm.

After that, for example, a solder paste 5 is applied to the surface on which the connection pad 3 is formed, and then the electronic component 4 is positioned and mounted in the cutout portion 2 and heat-treated to obtain a heat treatment, as shown in FIG. Electrode terminal 4a of electronic component 4 as shown in cross section
Are electrically connected to the corresponding connection pads 3 and are mechanically fixed to the wiring board to manufacture the required mounted circuit components.

In the above description, the manner of mounting and mounting one resistance element has been described. However, when there are a plurality of passive elements such as resistance elements, in the case of semiconductor components, or in the case of passive elements and semiconductor elements, Basically, the same means is used except that the number and shape of the corresponding notches differ.

In this sense, the present invention is not limited to the above examples, and various modifications can be made without departing from the spirit of the invention.

[0027]

According to the first and second aspects of the present invention, the electronic component mounting area of the wiring board is formed as a through type notch, and the electronic component is inserted and embedded in the notch so that the electronic component is mounted. The desired thinning is easily ensured. Also,
Since the electrical connection is also made by soldering with the connection pad extended on the side wall of the notch, there is no fear of disconnection, and it functions as a mounted circuit device with greatly improved connection reliability. It will be. In particular, when the electronic component is mounted and mounted in the through-hole type notch with a part of the gap left, it exhibits excellent functions such as stability in combination with improvement of heat dissipation.

According to the inventions of claims 3 to 5, the highly reliable mounted circuit device as described above can be easily manufactured with a high yield. In particular, the force (self-alignment) for optimally correcting and setting the position in the mounting / mounting process of the electronic component in the notch acts more effectively, and the movement of the electronic component in the soldering process is planar. Therefore, the possibility of solder bridge generation can be reduced, which greatly contributes to the improvement of workability and the production yield.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a configuration example of a main part of a mounted circuit device according to the present invention.

2A, 2B, 2C, and 2D are schematic views of an embodiment in an example of a manufacturing process of a mounted circuit device according to the present invention.

[Explanation of symbols]

 1 ... Wiring board 1a ... Wiring pattern 2 ... Penetrating notch in thickness direction 3 ... Connection pad 4 ... Electronic component (resistive element) 5 ... Soldering 6 ... Mold resin layer

Claims (5)

[Claims] 1. A wiring board having at least a wiring pattern on one main surface and having a notch portion penetrating in a thickness direction for mounting and mounting electronic components; and a wiring board connected to the wiring pattern of the wiring board. Connection pad extended to the inner wall of the cutout portion, an electronic component mounted and mounted in the cutout portion of the wiring board, and a connection terminal portion of the electronic component that is coated in the cutout portion and electrically connected to the connection pad. And a conductor to be connected to the mounting circuit device. 2. The mounting circuit device according to claim 1, wherein a part of the electronic component mounted and mounted in the cutout portion of the wiring board is separated from a side wall of the cutout portion. 3. A step of forming a wiring board having at least a wiring pattern on one main surface and having a notch portion penetrating in a thickness direction for mounting and mounting electronic components, and a notch of the wiring board. A step of forming a connection pad connected to the wiring pattern on the inner wall surface of the part; a step of positioning and mounting the electronic component in the cutout part of the wiring board; and a corresponding connection of the connection terminal part of the positioning and mounting-positioned electronic component. And a step of electrically connecting to a pad. 4. A cutout is formed in a wiring board after a pair of holes having a diameter not exceeding 1.0 mm, which is the short side length of an electronic component to be mounted and arranged, and having a long side end as a center point. 4. The method for manufacturing a mounted circuit device according to claim 3, wherein a region that straddles both of the drilled holes is formed by punching through the region in the thickness direction. 5. The method for manufacturing a mounted circuit device according to claim 3, wherein a part of the electronic component is mounted and arranged in the cutout portion of the wiring board so as to be separated from a side wall of the cutout portion.