JPH05259214A - Semiconductor device - Google Patents

Abstract

PURPOSE:To permit a circuit board which is to be mounted with a semiconductor device to be denser by reducing the area of TAB tape which is necessitated for constituting the semiconductor device so as to miniatuarize the semiconductor device. CONSTITUTION:Wiring patterns 3 and 4 on the surface of TAB tape are formed in an area whereupon a semiconductor chip is to be mounted, the semiconductor chip is aligned on the rear side of the area and is bonded on the wiring patterns 3 and 4.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device using a TAB tape.

[0002]

2. Description of the Related Art A conventional technique will be described with reference to FIGS. FIG. 4 shows a TAB tape. First, a flexible tape 1 is formed with a device hole 9 and an outer lead hole 2 around the device hole 9 by punching using a die. Next, a copper foil is attached on the film 1 having the holes, a photoresist is applied on both surfaces, and photoetching is performed to form a pattern of the outer leads 3 and the inner leads 4. The surfaces of these leads are plated with tin or gold, and nickel is used as the base of the portion of the outer lead 3 that straddles the outer lead hole 2 and the portion of the inner lead 4 that extends inside the device hole 9. Plating by. Then, a TAB tape is formed by forming a punched hole 6 at the joint between the plating wiring 5 and the outer lead 3 and making each outer lead 3 independent.

Device hole 9 of the above-mentioned TAB tape
A bump (not shown) is formed at the tip of the inner lead 4 extending inward, and the inner lead 4 and the electrode of the semiconductor chip 7 are connected via this bump. Then, after removing foreign matters and stains generated in this connecting step, the coating 10 is applied with resin. In this way, the semiconductor device is manufactured.

In the above-mentioned semiconductor device, the electrical characteristics are measured by using the measuring terminals (outer leads 3) on the TAB tape, and finally punching is performed to obtain the semiconductor from the film 1 as shown in FIGS. The device is punched out. At this time, the outer leads 3 are shaped at the same time. The semiconductor device punched out from the film 1 is the outer lead 3
It is mounted on the circuit board by bonding.

[0005]

Conventionally, a device hole 9 is provided on a flexible tape, and the inner lead 4 and the outer lead 3 are provided around the device hole 9.
By manufacturing a semiconductor device using a TAB tape provided with a pattern 8 that connects the semiconductor chip 7 and the semiconductor chip 7, one area of the semiconductor chip 7 is several times larger than that of the semiconductor chip 7 in order to mount one semiconductor chip 7.
AB tape area was needed. Therefore, when a semiconductor device manufactured using such a TAB tape is mounted on a circuit board, the mounting area on the circuit board is the area of the punched TAB tape plus the area of the outer leads 3. Since a mounting area several times as large as the semiconductor chip area is required, there is a drawback that improvement of the mounting density is hindered.

In order to solve such a problem, the present invention provides a TA required for mounting one semiconductor chip 7.
It is to provide a semiconductor device in which the area of the B tape is reduced.

[0007]

In order to achieve the above object, the present invention provides a wiring pattern comprising an inner lead connected to a semiconductor chip and an outer lead connected to an external circuit. A TAB tape formed in an area where a semiconductor chip is mounted is connected to a semiconductor chip mounted in the area of the TAB tape and electrically connected to the inner lead.

[0008]

In the semiconductor device of the present invention, since the wiring pattern including the inner leads and the outer leads is formed in the area for mounting the semiconductor chip, the area required for mounting the semiconductor device on the circuit board is The area of the outer lead can be added to the area of.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described with reference to FIGS. The same parts as those in the conventional example are designated by the same reference numerals. FIG. 1 shows a TAB tape, which is composed of a flexible tape 1 and a wiring pattern formed on the tape 1 and including outer leads 3 and inner leads 4. Outer lead holes 2 are formed in the tape 1 so as to surround the periphery of the area where the semiconductor chip 7 is mounted. A wiring pattern composed of inner leads 4 and outer leads 3 is formed on the mounting area of the semiconductor chip 7, and the inner leads 4 extend into outer lead holes 2 formed in the width direction of the tape 1. On the other hand, the outer leads 3 are formed in the longitudinal direction of the tape 1, are connected to the inner leads 4 in a one-to-one relationship on the mounting area of the semiconductor chip 7, and are formed so as to straddle the outer lead holes 2. Reference numeral 6 is a punched hole in which each outer lead 4 is made independent in order to measure the electrical characteristics. On the tape 1, a plurality of the above wiring patterns are formed in the longitudinal direction at a predetermined pitch interval.

The semiconductor chip 7 is positioned on the back side of the TAB tape constructed as described above, and the electrode of the semiconductor chip 7 and the inner lead 3 extending from the outer lead hole 2 are connected. After that, the foreign matter and stains generated in this connecting step are removed, and the coating 10 is applied with resin or the like. In this way, the semiconductor device is configured. Further, by similarly mounting the semiconductor chip 7 on each wiring pattern on the TAB tape, semiconductor devices are continuously formed on the TAB tape.

When the semiconductor device described above is mounted on a circuit board, punching is performed and the outer leads 3 are shaped at the same time as shown in FIGS. 2 and 3 in the same manner as in the conventional example. The semiconductor device punched from the TAB tape in this way is connected to the circuit board by bonding the outer leads 3.

As described above, according to the semiconductor device of this embodiment, the area required for mounting on the circuit board is determined by adding the area of the outer lead 3 to the area of the semiconductor chip 7. Therefore, the space of the semiconductor device can be saved, and the area for mounting on the circuit board can be reduced, so that the density of the circuit board can be increased. Further, the circuit board can be downsized, and the cost can be reduced accordingly. Further, since a plurality of semiconductor devices are continuously formed on the TAB tape, the automation of mounting the circuit board is easy.

[0013]

According to the present invention, since the wiring pattern on the TAB tape for connecting the semiconductor chips is formed in the area for mounting the semiconductor chips, the semiconductor device configured by mounting the semiconductor chips on the TAB tape. It is possible to reduce the size and reduce the mounting area on the circuit board. Therefore, the density of the circuit board can be increased. Also,
Since a plurality of such semiconductor devices are continuously formed on the tape, it is possible to automate the mounting of the circuit board.

[Brief description of drawings]

FIG. 1 shows a T used in a semiconductor device according to an embodiment of the present invention.
It is a top view of an AB tape.

FIG. 2 is a perspective view showing a state in which the semiconductor device according to the exemplary embodiment of the present invention is separated from the TAB tape.

FIG. 3 is a front view of FIG.

FIG. 4 is a plan view of a TAB tape according to a conventional example.

FIG. 5 is a perspective view showing a state in which a TAB tape is separated in a semiconductor device according to a conventional example.

FIG. 6 is a front view of FIG.

[Explanation of symbols]

1 ... tape, 3 ... outer lead, 4 ... inner lead, 7 ... semiconductor chip.

Claims (2)

[Claims] 1. A TAB tape in which a wiring pattern including inner leads connected to a semiconductor chip and outer leads connected to an external circuit is formed in an area on the surface of a flexible tape where the semiconductor chip is mounted, The TAB
A semiconductor device comprising a semiconductor chip mounted on the area of the tape and electrically connected to the inner lead. 2. The TAB tape comprises a plurality of wiring patterns formed in the semiconductor chip mounting area according to claim 1 arranged on a long tape at predetermined pitch intervals, and each wiring pattern is mounted in the mounting area. A semiconductor device having a semiconductor chip mounted thereon.