JPS5923432Y2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device in which a semiconductor element is incorporated into a wiring board such as a printed wiring board using a heat-resistant film such as polyimide.

Conventionally, methods of incorporating semiconductor elements such as transistors and integrated circuits have been adopted using packages such as flat packages with a predetermined number of connection terminals, dual in-line packages (DIP), and special ceramic packages. .

However, the method using a package as described above has drawbacks such as poor workability in assembling the semiconductor element and reliability after assembling, and the assembling process is complicated, leading to high costs. .

Therefore, in order to enable automatic assembly of semiconductor elements, streamline the assembly work, and provide semiconductor devices at low cost, semiconductor elements are incorporated using a long film having heat resistance such as polyimide. A tape carrier system is used.

For example, structures shown in FIGS. 1 and 21 are known as structures in which semiconductor elements are incorporated using this tape carrier method.

FIG. 1 shows a state in which a semiconductor element 2 such as an integrated circuit element (IC) is attached to a film substrate 1 made of a heat-resistant film such as polyimide.

The film substrate 1 on which the semiconductor element 2 is attached is constructed by bonding a conductive foil 3 made of copper foil to the surface of a film base material 4 with an adhesive or the like, and etching is applied to the conductive foil 3 to form terminal electrodes. Pattern portions 3a, 3a are formed.

The semiconductor element 2 having bump electrodes 5, 5 formed thereon is punched on its upper surface so that the bump electrodes 5, 5 correspond to the terminal electrode pattern parts 3a, 3a.

Furthermore, the terminal electrode pattern portions 3a, 3a of the bump electrodes 5, 5, which are the parts for attaching the semiconductor element 2 to the film substrate 1, are
The bonding portion to is molded with protective resin 6.

As shown in FIG. 1, a film substrate 1 on which a semiconductor element 2 is attached is assembled on a printed mounting board 7 made of alumina or the like as a base material in a structure as shown in FIG. 2.

That is, the lower surface of the semiconductor element 2 is made to correspond to the circuit pattern 8 of, for example, copper foil formed on the base material 7a constituting the substrate 7, and the terminal electrode pattern portions 3a, 3a are bent by bending the film substrate 1. Connection circuit pattern 9, 9
The film substrate 1 is placed correspondingly on top.

Then, the semiconductor element 2 is assembled into the printed wiring board 7 by connecting the semiconductor element 2 and the circuit pattern 8 and between the terminal electrode pattern parts 3a, 3a and the connecting circuit patterns 9, 9 using the solder 10.

In such a structure, bump electrodes 5 are required for voiding the semiconductor element 2 onto the film substrate 1.

However, it is extremely difficult to form this bump electrode 5 on the semiconductor element 2.
is limited in size, further increasing costs.

Further, when assembling the film substrate 1 into the wiring board 7, it is necessary to simultaneously solder the semiconductor element 2 and the terminal electrode pattern parts 3a, 3a to the respective circuit patterns 9, 8.

However, when soldering the semiconductor element 2 to the circuit pattern 9, the element 2 cannot be protected by a resin mold or the like, so it is affected by the solder flux.

In order to avoid this effect, a special jig is required for assembly, which causes problems in the workability of assembly.

Moreover, according to this structure, the semiconductor element 2 is covered by the film substrate 1 and the wiring board 7, which significantly deteriorates heat dissipation.

Therefore, it cannot be applied to elements that generate significant heat, such as transistors.

Therefore, the present invention aims to eliminate the difficulty of work and increase in cost caused by forming bump electrodes, improve the ease of assembly work, and provide a semiconductor device with good heat dissipation. was suggested.

Hereinafter, the present invention will be described with reference to embodiments shown in the drawings.

As shown in FIG. 3, the semiconductor device to be stolen according to the present invention is obtained by bonding a conductive foil such as copper foil to one main surface 11a of a film base material 11 using an adhesive or without using an adhesive. At the same time, the semiconductor element 15 is mounted on the film substrate 12 on which the electrode pattern portion 13 and the terminal electrode pattern portion 14, 14 are formed by etching or the like on this conductive foil portion.

A cutout portion 16 having a through hole is formed in a portion of the film base material 11 corresponding to the electrode pattern portion 13 of the film substrate 12, and the electrode pattern portion 13 is bent to form the cutout portion 16. It is designed to face the inside of section 16.

The semiconductor element 1 is placed on the electrode pattern part 13 which is bent into the notch part 16 so that its lower surface 13a becomes flat.
5 is mounted and electrically connected using solder 17 or the like.

Further, a part of the terminal electrode pattern part 14.14 is formed to extend to the side of the film base material 11, and to be bent in the same way as the electrode pattern part 13 to reach the lower surface side, which is the other side surface of the film base material 11. has been done.

By the way, the semiconductor element 15 connected on the electrode pattern part 13 connects the electrode part provided on the upper surface of this element 15 and the terminal electrode pattern part 14.14 with a wire (thin wire) 18 made of silver or the like. and is electrically connected to the terminal electrode pattern section 14.14.

The semiconductor element 15 mounted on the film substrate 12 in this manner is protected by being molded with a resin 19 such as synthetic resin.

The film substrate 2 with the semiconductor element 15 mounted thereon is
The lower surface 13 a of the electrode pattern portion 13 and the connecting portions 14 a and 14 a of the terminal electrode pattern portion 14.14 extending to the lower surface side of the film base material 11 are connected to the circuit pattern 21 formed on the printed wiring board 20, respectively. , 22° 22 and is placed on the wiring board 19 and solder 2
3 and is electrically connected and incorporated into the wiring board 20.

The film substrate 12 used in the present invention is the same as the carrier tape used in the conventional tape carrier system, and as shown in FIG. are continuously formed into a tape shape.

The tape-shaped film substrate 120 is automatically fed by the automatic feeding device used in the tape carrier method, and splots are fitted therein for positioning so that the semiconductor elements 15 can be automatically assembled together with the automatic feeding. Matching sprocket holes 24 are continuously provided.

Therefore, the attachment of the semiconductor element 15 constituting the present invention to the film substrate 12 can be automated in combination with an automatic wire bonding device.

Note that the electrode pattern portion 13 and the terminal electrode pattern portion 14.14 of the film substrate 12 are formed by means such as etching as shown in FIG. and the base material 11
It is bent along the main surface of the

This bending is performed by a press device 28 which combines an upper die 26 with a protrusion 25 corresponding to the notch 16 and the like and a flat lower die 27, as shown in FIG.

As described above, according to the present invention, when assembling a semiconductor element onto a film substrate, there is no need to form bump electrodes on the element, which is difficult to form, and the film substrate is formed into a tape shape for assembling. Since the advantages of the conventional tape carrier system, which allows objects to be automatically fed by an automatic feeder, are not lost, the assembling work can be improved.

Further, an increase in manufacturing costs can be prevented, and semiconductor devices can be provided at low cost.

Further, according to the present invention, all semiconductor elements can be assembled in a so-called face-up state, and since the assembly remains in an open state even after assembly, good heat dissipation can be provided.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing a state in which a semiconductor element is attached to a film substrate by a conventional method, and FIG. 2 is a sectional view showing a state in which the above-mentioned board is assembled into a wiring board. FIG. 3 is a sectional view showing a semiconductor device according to the present invention. FIG. 4 is a plan view showing the film substrate used in the present invention, FIG. 5 is a sectional view showing the pattern portion formed on the film substrate, and FIG. 6 is a plan view showing the pattern portion formed on the film substrate. It is a schematic sectional view showing a bent state. 11...Film base material, 12...Film substrate, 13...Electrode pattern portion, 14.1
4...Terminal electrode pattern section, 15...
Semiconductor element, 16... Notch, 18...
...Wire, 20...Printed wiring board, 21...
...Circuit pattern.

Claims (1)

[Scope of utility model registration request] The electrode pattern section and the terminal electrode pattern section are formed on the whole surface of the film base material, and a notch section is provided in a portion of the film base material corresponding to the above-mentioned electrode pattern section, and the above-mentioned electrode pattern section is bent. A semiconductor element is attached to the upper electrode pattern part of the film substrate facing into the notch, and the electrode part of the element and the terminal electrode pattern part are connected with a wire, and at least the electrode pattern part formed on the film substrate is connected. 1. A semiconductor device which is assembled into a wiring board by connecting a lower surface thereof to a circuit pattern formed on the wiring board.