JPH0639479Y2 - Printed wiring board - Google Patents

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial field of application) The present invention relates to a printed wiring board for mounting electronic parts and the like, and in particular, a printed wiring whose function can be easily changed during high-density mounting. Regarding the board.

(Prior Art) In recent years, the mounting density of electronic components such as printed wiring boards mounted on various electronic devices has dramatically improved, and recently, surface mounting has become mainstream with the development of small components. . On such a high-density surface-mounting printed wiring board, it is difficult to provide a space for predicting a function change and mounting a spare part, and there is a problem that the function change cannot be easily performed. In particular, at the time of development and trial production, there is a problem that it takes time to cope with the changes and the useless cost is required to create each dedicated printed wiring board.

(Problems to be Solved by the Invention) As described above, in the conventional printed wiring board, it is difficult to provide a mounting space for spare parts when surface mounting electronic components at a high density, and it is difficult to change the function. There was a problem that it could not be done easily.

Therefore, the present invention has been made in consideration of the above circumstances, and an object thereof is to provide a printed wiring board which can be mounted on the main printed wiring board to easily mount components and change the function.

[Configuration of the Invention] (Means for Solving Problems) A printed wiring board according to the present invention is a printed wiring board additionally mounted on the surface of a main pudding on which wiring wrapping posts are erected and a wiring board. The film substrate, the component mounting pad formed on the front surface of the film substrate, the adhesive layer formed on the back surface of the film substrate, and the wiring wrapping post are formed so that they can be fitted to each other. The above object is achieved by providing a through hole and a wiring pattern for electrically connecting the through hole and the component mounting pad.

(Operation) According to the above means, when the additional component is to be mounted on the main printed wiring board, the post erected on the main printed wiring board is inserted into the through hole formed in the additional pad,
The additional pad is adhered to the surface of the main printed wiring board via the adhesive layer formed on the back surface, and the wiring pattern formed by connecting to the through hole and the post are soldered.
Then, the additional component is mounted on the component mounting pad formed on the surface of the additional pad, and the additional component is wired and connected to a predetermined portion on the main printed wiring board through the pad and the post. The additional components can be additionally mounted on the main printed wiring board, and the function can be easily changed.

(Example) An example of a printed wiring board (additional pad) according to the present invention will be described below with reference to the drawings.

1 to 3 show an embodiment of the present invention. In FIGS. 1 and 2, a pad 2 made of a conductive thin film of copper foil having a predetermined pattern is formed on the upper surface of a substrate 1 made of a film-shaped insulating member by a thin film technique. In this embodiment, the case of the additional pad 3 for additionally mounting the 14-pin IC is shown, and the seven pads 2 arranged in one row are provided in two rows facing each other. An adhesive layer 4 is formed on the entire back surface of the substrate 1. On the other hand, as shown in FIG. 3, a plurality of wiring wrapping posts 6 are provided upright on the main printed wiring board 5 at a predetermined pitch, and the additional pad 3 has positions that can be aligned with these posts 6. 14 through-holes 7 are formed in the. Then, the posts 6 are positioned in the additional pads 3 by inserting the posts 6 into the through holes 7, respectively, and are pressed and fixed to the surface of the main printed wiring board 5 via the adhesive layer 4 so as to be fixedly bonded. There is. In addition, as shown in FIG. 1, a wiring pattern 8 for connecting the pad 2 and the through hole 7 is formed on the surface of the substrate 1.
Are formed. The pad 2 is formed on the surface of the substrate 1 on which the pad 2, the through hole 7 and the wiring pattern 8 are formed.
The insulating coating 9 is formed by a photolithography technique or the like in a state where at least a part of the surface is exposed and the peripheral portion of the through hole 7 of the wiring pattern 8.

Next, the operation of this embodiment will be described. When making changes such as adding functions to the already completed main printed wiring board 5, the through holes 7 formed in the additional pad 3 as shown in FIG.
The posts 6 that are erected on the main printed wiring board 5 are inserted into each of the above, and the adhesive layer 4 formed on the back surface of the additional pad 3
This additional pad 3 is pressure-bonded to the surface of the main printed wiring board 5 via. Then, the post 6 and the wiring pattern 8 on the periphery of the post 6 are electrically connected by soldering 10. After that, a 14-pin IC (not shown) to be additionally mounted is soldered to the pad 2 of the pad 3 for addition, one end of the lead wire (not shown) is lapped on the post 6, and the other end is placed on a predetermined portion of the main printed wiring board 5. Wiring between parts is done by connecting. In this way, a 14-pin IC can be additionally mounted to change the function. The 14-pin IC may be mounted on the additional pad 3 in advance before the additional pad 3 is bonded to the main printed wiring board 5. Further, since the main printed wiring board 5, the pad 2 and the wiring pattern 8 are insulated by the substrate 1, the additional pad 3 can be bonded to an arbitrary position on the main printed wiring board 5 which has already been wired. .

According to this embodiment, it is possible to mount additional components on the main printed wiring board 5 that is surface-mounted on high density without providing spare pads for mounting additional components, and it is possible to easily change the function. In addition, by creating the additional pad 3 in which the pad 2 for mounting the additional component is formed in advance, it is not necessary to create a plurality of dedicated printed wiring boards 5, and the general-purpose main printed wiring board 5 is created. It can be used to create circuits with different functions. Therefore, it is possible to reduce the time and cost for producing the circuit.
Furthermore, since the additional pad 3 is in the form of a film, it can be easily cut, and it can be divided and used as necessary.

In the above embodiment, the case where the post 6 is inserted into the through hole 7 formed in the additional pad 3 to perform the positioning wiring has been described. It may be electrically connected to the pad. Further, the components to be additionally mounted are not limited to the 14-pin IC. For example, as shown in (a) of FIG. 4, for three chips of chip resistors or chip capacitors, as shown in (b), chip diodes or It may be formed for one chip of the chip transistor or for a 28-pin IC as shown in (c).

[Advantages of the Invention] As described above, according to the present invention, a pad and a through hole having an arbitrary pattern, and a wiring pattern for electrically connecting the pad and the through hole are provided on the surface of the film-like substrate. The additional pad is configured by inserting the wiring wrapping post standing upright on the main printed wiring board into the through hole of the additional pad so that the additional pad is positioned on the main printed wiring board and adhesively fixed. Therefore, it is possible to easily install additional components on the main printed wiring board that is surface-mounted with high density, and it is possible to change the function in a short time and at low cost.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing an embodiment of an additional pad according to the present invention, FIG. 2 is a sectional view taken along the line AA of FIG. 1, and FIG. 3 is an addition shown in FIG. FIG. 4 is a vertical cross-sectional view showing a state in which the pad for use is mounted on the main printed wiring board, and FIG. 4 is a plan view showing another embodiment of the present invention. 1 ... Substrate, 2 ... Pad 3 ... Additional pad (printed wiring board) 4 ... Adhesive layer, 5 ... Main printed wiring board 6 ... Wiring wrapping post 7 ... Through hole, 8 ... Wiring pattern 9 ... Insulating film

Claims (1)

[Scope of utility model registration request] 1. A printed wiring board to be additionally mounted on the surface of a main printed wiring board on which wiring wrapping posts are erected, wherein a film substrate and a component mounting pad formed on the surface of the film substrate. An adhesive layer formed on the back surface of the film substrate, a through hole in which the wiring wrapping post is formed so that the wiring wrapping post can be fitted, and wiring for electrically connecting the through hole and the component mounting pad. A printed wiring board comprising a pattern.