JP2822446B2 - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JP2822446B2 JP2822446B2 JP1123718A JP12371889A JP2822446B2 JP 2822446 B2 JP2822446 B2 JP 2822446B2 JP 1123718 A JP1123718 A JP 1123718A JP 12371889 A JP12371889 A JP 12371889A JP 2822446 B2 JP2822446 B2 JP 2822446B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- wiring
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、混成集積回路装置に関し、特にモノリシッ
クIC用のパッケージ内に１つ又は複数のICペレットを収
納して、回路を構成するような混成集積回路装置に関す
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device, and more particularly to a hybrid integrated circuit device in which one or more IC pellets are housed in a package for a monolithic IC to form a circuit. The present invention relates to a hybrid integrated circuit device.
〔従来の技術〕 従来、この種の混成集積回路装置の構造としては、例
えば第４図に示すような金属板をエッチング又は打ち抜
き加工したリードフレームのアイランド48上に表面又は
両面に配線導体42が作り込まれた絶縁樹脂基板41を貼り
付け、ICペレット43等のチップ部品搭載後、トランスフ
ァモールド封止した構造を有している。その際、絶縁樹
脂基板41上の回路パターン（42）とICペレット43及び外
部リード47との電気的接続には、ボンディングワイヤ44
を用いるのが一般的であった。[Prior Art] Conventionally, as a structure of this type of hybrid integrated circuit device, for example, a wiring conductor 42 is formed on the surface or both surfaces of a lead frame island 48 obtained by etching or punching a metal plate as shown in FIG. It has a structure in which the fabricated insulating resin substrate 41 is attached, chip components such as IC pellets 43 are mounted, and then transfer-molded. At this time, a bonding wire 44 is used to electrically connect the circuit pattern (42) on the insulating resin substrate 41 to the IC pellet 43 and the external lead 47.
Was generally used.
しかしながら、上述した従来の構造は、外部リード及
びアイランドと絶縁樹脂基板が互いに独立して作成され
たものである為、異種材料を貼り合わせる必要性と、相
互の電気的接続をとる必要性が生じ、その結果、熱膨張
係数の差異からバイメタル効果により、製品自体に反り
が生じるとか、外部リードと絶縁樹脂基板とのボンディ
ングワイヤの総数を著しく増加させ、ワイヤ切れ不良を
引き起こし易くなる等の欠点がある。However, in the above-described conventional structure, since the external leads and islands and the insulating resin substrate are formed independently of each other, it is necessary to bond different kinds of materials and to make an electrical connection between them. As a result, due to the difference in thermal expansion coefficient, the product itself may be warped due to the bimetal effect, or the total number of bonding wires between the external leads and the insulating resin substrate may be significantly increased, which may cause defects such as wire breakage. is there.
さらに従来の構造はいわゆる片面実装となっているの
で、反対側の面を全く使用出来ないという大きな制約が
ある。Further, since the conventional structure is so-called single-sided mounting, there is a great restriction that the opposite surface cannot be used at all.
本発明の混成集積回路装置の構成は、絶縁樹脂基板に
配線導体を設けた配線基板に電気部品を搭載し、前記配
線基板の端部に設けられた配線導体を外部リードとして
露出させて樹脂封止してなり、この樹脂封止の外部で互
いに隣接する前記外部リードの先端部間の前記絶縁樹脂
基板が除去されると共に、前記配線基板が前記樹脂封止
の外部で折り曲げられていることを特徴とする。The configuration of the hybrid integrated circuit device of the present invention is such that an electric component is mounted on a wiring board having a wiring conductor provided on an insulating resin substrate, and the wiring conductor provided at an end of the wiring board is exposed as an external lead to form a resin seal. And that the insulating resin substrate between the tips of the external leads adjacent to each other outside the resin sealing is removed, and that the wiring substrate is bent outside the resin sealing. Features.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図（ａ）及び（ｂ）はそれぞれ本発明に関連する
混成集積回路装置の平面図及び側面図である。1A and 1B are a plan view and a side view, respectively, of a hybrid integrated circuit device relating to the present invention.
この本発明に関連する混成集積回路に於いては、金属
板を加工したリードは一切使用せず、その代わりに、導
体配線12aを設けた絶縁樹脂基板11の端部の導体配線を
外部リード12bとして封止樹脂15から露出させた構造を
有している。絶縁性樹脂基板の裏面にも導体配線が設け
てあり、外部リード12bに対応して同様の外部リードが
設けてあるものとするが、表裏の外部リードは必ずしも
接続されている必要はない。但し、必要があれば、絶縁
性樹脂基板側のスルーホールにより接続する。このよう
な混成集積回路装置を搭載するプリント基板側では、ス
リット状の窓を形成し、その裏面両サイドに半田ランド
を設けておけばよいのである。In the hybrid integrated circuit according to the present invention, no lead formed by processing a metal plate is used at all, and the conductor wiring at the end of the insulating resin substrate 11 provided with the conductor wiring 12a is replaced with the external lead 12b. Has a structure exposed from the sealing resin 15. Conductive wiring is also provided on the back surface of the insulating resin substrate, and similar external leads are provided corresponding to the external leads 12b. However, the external leads on the front and back surfaces are not necessarily connected. However, if necessary, they are connected by through holes on the insulating resin substrate side. On the printed circuit board side on which such a hybrid integrated circuit device is mounted, a slit-shaped window may be formed, and solder lands may be provided on both sides of the back surface.
なお、導体配線の厚みを含めた配線基板の厚さを100
〜500μｍとし、導体配線の厚さは放熱性、加工性、強
度を考慮して10〜200μｍ程度に設定してある。Note that the thickness of the wiring board, including the thickness of the conductor wiring, is 100
The thickness of the conductor wiring is set to about 10 to 200 μm in consideration of heat dissipation, workability, and strength.
第２図（ａ）及び（ｂ）はそれぞれ本発明に関連する
他の混成集積回路装置の正面図及び側面図である。2 (a) and 2 (b) are a front view and a side view, respectively, of another hybrid integrated circuit device related to the present invention.
この実施例では、外部リード22bの先端部において絶
縁樹脂基板21の形状をこの外部リード部分22bのパター
ンに沿った形状に加工している。この為、本混成集積回
路装置を搭載するプリント基板側では、通常のスルーホ
ールで対応することが出来、従って絶縁樹脂基板側にス
ルーホールを設けなくても外部リードパターンが半田で
接続されるという利点がある。In this embodiment, the shape of the insulating resin substrate 21 at the tip of the external lead 22b is processed into a shape along the pattern of the external lead portion 22b. For this reason, on the printed circuit board side on which the hybrid integrated circuit device is mounted, it is possible to cope with ordinary through holes, so that the external lead patterns are connected by solder without providing through holes on the insulating resin substrate side. There are advantages.
第３図（ａ），（ｂ）及び（ｃ）は本発明の実施例の
上面図、正面図及び側面図である。この実施例では、外
部リード32b部の絶縁樹脂基板31に曲げ加工を施してい
る。この為、本実施例ではDIP型のパッケージ形状を実
現出来る。3 (a), (b) and (c) are a top view, a front view and a side view of an embodiment of the present invention. In this embodiment, the bending process is performed on the insulating resin substrate 31 of the external lead 32b. Therefore, in this embodiment, a DIP type package shape can be realized.
以上説明したように、本発明は、配線基板に電気部品
を搭載して、導体配線を外部リードとして封止樹脂から
露出させたものであり、従来のように異種材料の貼り合
わせの構造を有していない為に、組立工数が軽減出来る
と同時に、反りの問題も原理的に解消される。As described above, in the present invention, the electric component is mounted on the wiring board, and the conductor wiring is exposed from the sealing resin as the external lead. Since it is not performed, the number of assembling steps can be reduced, and at the same time, the problem of warpage is basically solved.
又、従来ボンディングワイヤが使用されていた外部リ
ードフレームと絶縁樹脂基板との電気的接続は全く不要
のものとなり、外部リード本数当りのボンディングワイ
ヤ数が減少する為、ワイヤ切れ等による不良の発生率も
半減する効果がある。In addition, the electrical connection between the external lead frame and the insulating resin substrate, which used conventional bonding wires, is completely unnecessary, and the number of bonding wires per external lead is reduced. Also has the effect of halving.
さらに従来構造では、利用不可能であった両面実装が
可能となるという大きな効果がある。Furthermore, the conventional structure has a great effect that double-sided mounting, which cannot be used, becomes possible.
第１図（ａ）及び（ｂ）は本発明に関連する混成集積回
路装置の正面図及び側面図、第２図（ａ）及び（ｂ）は
本発明に関連する他の混成集積回路装置の正面図及び側
面図、第３図（ａ），（ｂ）及び（ｃ）は本発明の一実
施例の上面図、正面図及び側面図、第４図（ａ），
（ｂ）及び（ｃ）は従来例の上面図、正面図及び側面図
である。 11,21,31,41……絶縁樹脂基板、12a、32a……導体配
線、12b,22b、32b……外部リード、13,23,33……ICペレ
ット、14,34……ボンディングワイヤ、15,25,35,45……
封止樹脂、16,36……裏面搭載チップ部品、47……金属
板を加工した外部リード、48……金属板を加工したアイ
ランド。1 (a) and 1 (b) are front and side views of a hybrid integrated circuit device related to the present invention, and FIGS. 2 (a) and (b) are diagrams of another hybrid integrated circuit device related to the present invention. FIGS. 3 (a), 3 (b) and 3 (c) are a top view, a front view and a side view of an embodiment of the present invention, and FIGS.
(B) and (c) are a top view, a front view, and a side view of a conventional example. 11,21,31,41 …… Insulating resin board, 12a, 32a …… Conductor wiring, 12b, 22b, 32b …… External leads, 13,23,33 …… IC pellets, 14,34 …… Bonding wires, 15 , 25,35,45 ……
Encapsulation resin, 16, 36… Back-mounted chip parts, 47… External leads processed from a metal plate, 48… Islands processed from a metal plate.
Claims (1)
に電気部品を搭載し、前記配線基板の端部に設けられた
配線導体を外部リードとして露出させて樹脂封止してな
り、この樹脂封止の外部で互いに隣接する前記外部リー
ドの先端部間の前記絶縁樹脂基板が除去されると共に、
前記配線基板が前記樹脂封止の外部で折り曲げられてい
ることを特徴とする混成集積回路装置。An electric component is mounted on a wiring board provided with a wiring conductor on an insulating resin substrate, and the wiring conductor provided at an end of the wiring board is exposed as an external lead and sealed with a resin. While removing the insulating resin substrate between the distal ends of the external leads adjacent to each other outside the resin sealing,
The hybrid integrated circuit device, wherein the wiring substrate is bent outside the resin sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1123718A JP2822446B2 (en) | 1989-05-16 | 1989-05-16 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1123718A JP2822446B2 (en) | 1989-05-16 | 1989-05-16 | Hybrid integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02302062A JPH02302062A (en) | 1990-12-14 |
| JP2822446B2 true JP2822446B2 (en) | 1998-11-11 |
Family
ID=14867643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1123718A Expired - Lifetime JP2822446B2 (en) | 1989-05-16 | 1989-05-16 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2822446B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6305820B2 (en) * | 2014-04-24 | 2018-04-04 | アピックヤマダ株式会社 | Resin molding apparatus and resin molding method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48140U (en) * | 1971-05-22 | 1973-01-05 | ||
| JPS51136444U (en) * | 1975-04-25 | 1976-11-04 | ||
| JPS5280452U (en) * | 1975-12-15 | 1977-06-15 |
-
1989
- 1989-05-16 JP JP1123718A patent/JP2822446B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02302062A (en) | 1990-12-14 |
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