JPS6010799A - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JPS6010799A
JPS6010799A JP11959183A JP11959183A JPS6010799A JP S6010799 A JPS6010799 A JP S6010799A JP 11959183 A JP11959183 A JP 11959183A JP 11959183 A JP11959183 A JP 11959183A JP S6010799 A JPS6010799 A JP S6010799A
Authority
JP
Japan
Prior art keywords
circuit
board
wiring
block body
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11959183A
Other languages
Japanese (ja)
Inventor
中村 恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP11959183A priority Critical patent/JPS6010799A/en
Publication of JPS6010799A publication Critical patent/JPS6010799A/en
Pending legal-status Critical Current

Links

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、ビデオテープレコーダやテレビジョン受am
などの広範な電子機器に用いられる電子回路装置に関す
るものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is applicable to video tape recorders and television receivers.
The present invention relates to electronic circuit devices used in a wide range of electronic devices such as electronic devices.

従来例の構成とその問題点 近年、電子機器の小型・W量化に対する要求はますます
増大しており、それとともに電子回路装置(電子部品等
を搭載した回路基板)を小型・高密痩化してゆくための
実装技術が重要な課題となって来ている。
Conventional configurations and their problems In recent years, the demand for electronic devices to be smaller and to reduce the amount of wattage has been increasing, and along with this, electronic circuit devices (circuit boards equipped with electronic components, etc.) are becoming smaller, denser, and thinner. The implementation technology for this is becoming an important issue.

従来から、多くの電子機器においてその電子回路装置を
高密度化してゆくための手段として、いろいろな方策が
講じられて来ているが、その代表的な方法の1つとして
、回路の機能ブロック化を図り、機能ブロック回路を、
ぞれを構成する小型回路素子を用いて高密度に集積化す
ることによって様々な形態の回路ブロック体(集積回路
部品)を構成し、この回路ブロック体をマザープリント
基板に実装して電子回路装置の小型・高密度化を−2− 図る実装方法がある。本発明の出願人は、このような機
能ブ、ロック告の思想にもとづく実装技術として、すで
に特願昭56−74689号の発明を出願している。こ
の特願昭56−74689号の発明は、機能ブロック化
した回路ブロック体とそれのマザープリント基板への取
付は構造に関するものであり、この回路ブロック体をマ
ザープリント基板に取付けた電子回路装置について第1
図を用いて説明する。
Conventionally, various measures have been taken to increase the density of electronic circuit devices in many electronic devices, and one of the representative methods is to create functional blocks of circuits. and create a functional block circuit,
Various forms of circuit blocks (integrated circuit components) are constructed by high-density integration using the small circuit elements that make up each component, and these circuit blocks are mounted on a mother printed circuit board to create electronic circuit devices. There is a mounting method for achieving smaller size and higher density. The applicant of the present invention has already filed an invention in Japanese Patent Application No. 74689/1989 as a mounting technology based on the idea of such functional blocks and lock notifications. The invention of Japanese Patent Application No. 56-74689 relates to the structure of a circuit block body formed into a functional block and its attachment to a mother printed circuit board, and relates to an electronic circuit device in which this circuit block body is attached to a mother printed circuit board. 1st
This will be explained using figures.

この電子回路装置は、可とう性を有する絶縁基板1の一
方の面に配線回路導体2を形成したフレキシブル配線板
に平面接続タイプの小型回路素子3a。
This electronic circuit device includes a small circuit element 3a of a planar connection type on a flexible wiring board in which a wiring circuit conductor 2 is formed on one side of a flexible insulating substrate 1.

3bをはんだ4によって接続するとともに、このフレキ
シブル配線板の中央部が折り曲げられるように、その裏
面の一部に一対の硬質支持板5を接着した構造の回路ブ
ロック体(集積回路部品)を、折り曲げた状態で、その
外部接続端子を、マザープリント基板6に設けたスリッ
ト穴7に挿入し、マザープリント基板6の銅はくパター
ンから成る接続端子8と、はんだ9によって接続したも
のである。従ってこの電子回路装置の特徴としては、−
3− 回路ブロック体の外部接続端子がリード線を介さずに直
接マザープリント基板6に接続された構成となるため、
電子回路装置全体の体積の小型化に役立ち、またフレキ
シブル配線板の片面にブロック回路に構成するための小
型回路素子3a、3t)を実装し、マザープリント基板
6に取付けた状態で両面に小型回路素子3a、 3bが
配置された構成となることからも、電子回路装置の小型
化に役立つことである。
3b are connected by solder 4, and a circuit block body (integrated circuit component) having a structure in which a pair of hard support plates 5 are bonded to a part of the back surface of the flexible wiring board is bent so that the central part of the flexible wiring board can be bent. In this state, the external connection terminal is inserted into a slit hole 7 provided in the mother printed circuit board 6, and connected to a connection terminal 8 made of a copper foil pattern on the mother printed circuit board 6 by solder 9. Therefore, the characteristics of this electronic circuit device are -
3- Since the external connection terminals of the circuit block body are directly connected to the mother printed circuit board 6 without using lead wires,
It is useful for reducing the volume of the entire electronic circuit device, and small circuit elements 3a, 3t) for configuring a block circuit are mounted on one side of the flexible wiring board, and small circuit elements 3a, 3t) are mounted on both sides when attached to the mother printed circuit board 6. The structure in which the elements 3a and 3b are arranged also helps in downsizing the electronic circuit device.

しかしながら、このようf、r従来の電子回路装置では
、第1図からも明らかなように、フレキシブル配線板に
よって構成された回路ブロック休が、マザープリント基
板6に取付【Jられた状態においでは、フレキシブル配
線板が局部的に小さい曲率半径で折り曲げられるため、
折り曲げ部の回路パターンの機械的強度(銅はくパター
ンの折り曲げ強度)を保持するために、パターン設計部
や回路ブロック体の構成面で特別な配慮を行なう必要が
ありえ。 1 発明の目的 −4= 本発明は上記従来の欠点を解消するもので、銅はくパタ
ーンの機械的折り曲げに対する負荷を軽減できるととも
に、フレキシブル配線板に取付ける回路素子をより高密
度に配置できる電子回路装置を提供することを目的とす
る。
However, in such conventional electronic circuit devices, as is clear from FIG. Because the flexible wiring board is locally bent with a small radius of curvature,
In order to maintain the mechanical strength of the circuit pattern at the folded portion (the bending strength of the copper foil pattern), special considerations may need to be made in the pattern design section and the construction of the circuit block body. 1. Purpose of the Invention - 4 = The present invention solves the above-mentioned conventional drawbacks, and is an electronic device that can reduce the load on mechanical bending of copper foil patterns, and also enables higher density arrangement of circuit elements attached to flexible wiring boards. The purpose is to provide a circuit device.

発明の構成 上記目的を達成するため、本発明の電子回路装置は、可
とう性を有する絶縁基板の両面に所定の配線回路導体が
形成されかつこれら両面の配線回路導体がスルーホール
を介して互いに接続されたフレキシブル配線板とこのフ
レキシブル配線板の両面に固定されかつ前記配線回路導
体に電気的に接続された複数の平面接続タイプの回路素
子とを有する回路ブロック体と、この回路ブロック体が
その中央部から略コ字状に折曲された状態でその両道端
部が挿入されるスリット穴を有しかつこのスリット穴の
近傍位置にて少なくとも一方の面に接続端子導体が形成
されたマザープリント基板と、このマザープリント基板
の接続端子導体と前記回路ブロック体の配線回路導体の
一部を構成する外−5− 接続端子とを電気的かつ機械的に接続するはんだとを備
えた構成である。
Structure of the Invention In order to achieve the above object, an electronic circuit device of the present invention includes predetermined wiring circuit conductors formed on both sides of a flexible insulating substrate, and these wiring circuit conductors on both sides being connected to each other via through holes. A circuit block body having a connected flexible wiring board and a plurality of planar connection type circuit elements fixed to both sides of the flexible wiring board and electrically connected to the wiring circuit conductor; A mother print having a slit hole into which both end portions are inserted while being bent into a substantially U-shape from the center portion, and a connecting terminal conductor is formed on at least one surface in the vicinity of the slit hole. The circuit board is configured to include a board, and a solder that electrically and mechanically connects the connection terminal conductor of the mother printed board and the connection terminal constituting a part of the wiring circuit conductor of the circuit block body. .

実施例の説明 以下、本発明の一実施例について、図面に基づいて説明
する。第2図は電子回路装置を構成するための回路ブロ
ック体の断面図で、10は可とう性を有する絶縁基板、
Na 、 11bは配線回路導体、12はスルーホール
、138〜13dは平面接続タイプの小型回路素子、1
4ははんだ、19は前記配線回路導体11a 、 11
bの一部を構成する外部接続端子である。また第3図は
電子回路装置の断面図で、15はマザープリント基板、
16はマザープリント基板15に設けられたスリット穴
、17はマザープリント基板15に形成された接続端子
導体、18ははんだである。
DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a cross-sectional view of a circuit block body for configuring an electronic circuit device, in which 10 is a flexible insulating substrate;
Na, 11b is a wiring circuit conductor, 12 is a through hole, 138 to 13d are planar connection type small circuit elements, 1
4 is solder, 19 is the wiring circuit conductor 11a, 11
This is an external connection terminal that constitutes a part of b. FIG. 3 is a cross-sectional view of the electronic circuit device, and 15 is a mother printed board;
16 is a slit hole provided in the mother printed board 15, 17 is a connecting terminal conductor formed in the mother printed board 15, and 18 is solder.

上記電子回路装置の製造手順について説明すると、まず
耐熱性にすぐれかつ可どう性を有する絶縁基板10とし
てポリイミドフィルムを用い、その表裏両面に35μ情
の銅はくにより所望の配線回路導体11a 、 11b
を形成し、さらにこの配線回路導−6− 体11a 、 11bを貫通する孔を形成して、その孔
の壁面にめっきまたは銀や銅などの導電性を右するペー
ストを充填することにより配線回路導体11a。
To explain the manufacturing procedure of the above-mentioned electronic circuit device, first, a polyimide film is used as the insulating substrate 10 having excellent heat resistance and flexibility, and desired wiring circuit conductors 11a and 11b are coated with 35 μm thick copper foil on both the front and back surfaces of the film.
A wiring circuit is formed by forming holes passing through the wiring circuit conductors 11a and 11b, and filling the walls of the holes with plating or a conductive paste such as silver or copper. Conductor 11a.

11b間を電気的に接続するスルーホール12を形成し
、かくして19たいわゆるフレキシブル両面配線板を用
いて、その表裏面の配線回路導体11a。
A through hole 12 is formed to electrically connect between the wiring circuit conductors 11a on the front and back surfaces of the so-called flexible double-sided wiring board.

11b面にブロック回路を構成するのに必要な平面接続
タイプの小型回路素子13a〜13dとして、例えばリ
ードレスタイプのチップ抵抗器やチップコンデンサーな
どの受動素子や、ミニモールド型のトランジスタ、ダイ
オード、IC1LSIなどの能動素子をマイクロソルダ
リング技術を駆使して高密麿に実装することによって、
第1図に示すような回路ブロック体を構成する。そして
この回路ブロック体を、実装された小型回路素子 13
a〜13dどうしが互いに接触しないようにしてその中
央部から断面が略コ字状になるように折り曲げ、フレキ
シブル配線板の両道端部の外面側に形成された銅はくパ
ターンから成る外部接続端子19を絶縁基板10を介し
て相対向させた状態で、紙−フニー 7 − ノール基板やガラスエポキシ)大板により構成されたマ
ザープリンミル基板15に加工された細長い1つのスリ
ット穴1Gに挿入し、その回路ブロック体の配線回路導
体11a 、 Ilbの一部を構成する外部接続端子1
9とマザープリント基板15に形成された銅はくから成
る接続端子導体17とをはんだ18で直接接続する。
As the planar connection type small circuit elements 13a to 13d necessary for configuring the block circuit on the 11b surface, for example, passive elements such as leadless type chip resistors and chip capacitors, mini-molded type transistors, diodes, and IC1LSIs. By mounting active elements such as on a high-density matrix using micro-soldering technology,
A circuit block body as shown in FIG. 1 is constructed. Then, this circuit block body is used as a mounted small circuit element 13
An external connection terminal consisting of a copper foil pattern formed on the outer surface side of both ends of the flexible wiring board by bending the parts a to 13d so that they do not touch each other so that the cross section is approximately U-shaped from the center part. 19 facing each other via the insulating substrate 10, insert it into one elongated slit hole 1G machined in the mother pudding mill substrate 15 made of a large plate (paper-Funi 7-nor substrate or glass epoxy). , an external connection terminal 1 forming a part of the wiring circuit conductor 11a and Ilb of the circuit block body.
9 and a connection terminal conductor 17 made of a copper foil formed on the mother printed circuit board 15 are directly connected by solder 18.

かくして得られた電子回路装置は、フレキシブル配線板
が略コ字状に折り曲げられるので、折り曲げ部の銅はく
パターンの耐屈曲性が緩和され、断線不良を低減できる
。またフレキシブル配線板を略コ字状に折り曲げた時に
、回路ブロックを構成する小型回路素子13a〜13d
がフレキシブル配線板をはさんで4w4配置となること
がら、電子回路装置の高密度化を達成できる。
In the electronic circuit device thus obtained, the flexible wiring board is bent into a substantially U-shape, so the bending resistance of the copper foil pattern at the bent portion is relaxed, and disconnection defects can be reduced. Also, when the flexible wiring board is bent into a substantially U-shape, the small circuit elements 13a to 13d forming the circuit block
Since the flexible wiring boards are placed in a 4w4 arrangement, high density electronic circuit devices can be achieved.

発明の詳細 な説明したように本発明によれば、フレキシブル両面配
線板の表裏面に平面接続タイプの回路素子を高密疫に実
装した回路ブロック体を、断面が略コ字状になるように
折り曲げた状態で、マザー 8 − 一プリント基板のスリット穴を通して接続したので、次
の効果を得ることができる。
DETAILED DESCRIPTION OF THE INVENTION According to the present invention, as described in detail, a circuit block body in which planar connection type circuit elements are densely mounted on the front and back surfaces of a flexible double-sided wiring board is bent so that the cross section is approximately U-shaped. In this state, the mother 8-1 was connected through the slit hole of the printed circuit board, so that the following effect can be obtained.

■ フレキシブル配線板が略コ字状に折り曲げられるの
で、折り曲げ部の銅はくパターンの耐屈曲性が緩和され
、断線不良を低減し得る。
(2) Since the flexible wiring board is bent into a substantially U-shape, the bending resistance of the copper foil pattern at the bent portion is relaxed, and disconnection defects can be reduced.

■ フレキシブル配線板を略コ字状に折り曲げた時に、
回路ブロックを構成する回路素子がフレキシブル配線板
をはさんで4層配置となることから、電子回路装置の高
密度化を実現し得る。
■ When the flexible wiring board is bent into a U-shape,
Since the circuit elements constituting the circuit block are arranged in four layers with flexible wiring boards in between, it is possible to realize high density electronic circuit devices.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来の電子回路装置の要部の断面図、第2図は
本発明の一実施例における電子回路装置に用いる回路ブ
ロック体の断面図、第3図は本発明の一実施例における
電子回路装置の要部の断面図である。 10・・・絶縁基板、11a 、 11b・・・配線回
路導体、12・・・スルーホール、13a〜13d・・
・小型回路素子(回路素子)、15・・・マザープリン
ト基板、16・・・スリット穴、17・・・接続端子導
体、18・・・はんだ、19・・・外部−9− 接続端子 代理人 森 木 義 弘 −10− 第1図 第2図 第3図 π 1d 4 、、 tz tb ] q iq
FIG. 1 is a cross-sectional view of a main part of a conventional electronic circuit device, FIG. 2 is a cross-sectional view of a circuit block body used in an electronic circuit device according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of a circuit block body used in an electronic circuit device according to an embodiment of the present invention. FIG. 3 is a cross-sectional view of the main parts of the electronic circuit device. DESCRIPTION OF SYMBOLS 10... Insulating substrate, 11a, 11b... Wiring circuit conductor, 12... Through hole, 13a-13d...
・Small circuit element (circuit element), 15...Mother printed circuit board, 16...Slit hole, 17...Connecting terminal conductor, 18...Solder, 19...External-9- Connection terminal agent Yoshihiro Moriki-10- Figure 1 Figure 2 Figure 3 π 1d 4 ,, tz tb ] q iq

Claims (1)

【特許請求の範囲】 1、可どう性を有する絶縁基板の両面に所定の配線回路
導体が形成されかつこれら両面の配線回路導体がスルー
ホールを介して互いに接続されたフレキシブル配線板と
このフレキシブル配線板の両面に固定されかつ前記配線
回路導体に電気的に接続された複数の平面接続タイプの
回路素子とを有する回路ブロック体と、この回路ブロッ
ク体がその中央部から略コ字状に折曲された状態でその
両遊端部が挿入されるスリット穴を有しかつこのスリッ
ト穴の近傍位置にて少なくとも一方の面に接続端子導体
が形成されたマザープリント基板と、このマザープリン
ト基板の接続端子導体と前記回路ブロック体の配線回路
導体の一部を構成する外部接続端子とを電気的かつ機械
的に接続するはんだとを備えた電子回路装置。 −1−
[Claims] 1. A flexible wiring board in which predetermined wiring circuit conductors are formed on both sides of a flexible insulating substrate, and the wiring circuit conductors on both sides are connected to each other via through holes, and this flexible wiring. A circuit block body having a plurality of planar connection type circuit elements fixed to both sides of a board and electrically connected to the wiring circuit conductor, and the circuit block body being bent into a substantially U-shape from the center thereof. A mother printed circuit board having a slit hole into which both free ends are inserted in a state in which the mother printed circuit board is connected to a mother printed circuit board having a connecting terminal conductor formed on at least one surface near the slit hole; An electronic circuit device comprising: a solder that electrically and mechanically connects a terminal conductor and an external connection terminal forming a part of a wiring circuit conductor of the circuit block body. -1-
JP11959183A 1983-06-30 1983-06-30 Electronic circuit device Pending JPS6010799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11959183A JPS6010799A (en) 1983-06-30 1983-06-30 Electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11959183A JPS6010799A (en) 1983-06-30 1983-06-30 Electronic circuit device

Publications (1)

Publication Number Publication Date
JPS6010799A true JPS6010799A (en) 1985-01-19

Family

ID=14765162

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11959183A Pending JPS6010799A (en) 1983-06-30 1983-06-30 Electronic circuit device

Country Status (1)

Country Link
JP (1) JPS6010799A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03245591A (en) * 1990-02-23 1991-11-01 Nec Corp Lsi module
JP2009152239A (en) * 2007-12-18 2009-07-09 Denso Corp Electronic equipment, and motor-driven compressor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03245591A (en) * 1990-02-23 1991-11-01 Nec Corp Lsi module
JP2009152239A (en) * 2007-12-18 2009-07-09 Denso Corp Electronic equipment, and motor-driven compressor

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