JPS6197891A - Hybrid ic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a hybrid integrated circuit device, and particularly to a hybrid integrated circuit device using an insulating substrate having conductive patterns formed on both the front and back sides.

[Conventional technology]

In recent years, the demand for hybrid integrated circuit devices has been growing quite rapidly, and the market has expanded into a wide range of fields. As a matter of course, the demands of users vary, including low cost, size, shape, etc., and in particular, the demand for miniaturization is increasing. In order to meet this demand for miniaturization, the conventional common method is to increase the pattern density of the hybrid integrated circuit device, but to form patterns on both sides of the substrate and provide through holes in the substrate. It is used by making electrical connections between the front and back sides of the board. There are also two types of through-holes, and in general, those with through-holes inside the disconnected board have been widely used. However, for devices that require even more miniaturization, a method has been adopted in which through holes are provided on four sides of the substrate, since providing through holes inside the substrate makes the substrate somewhat larger.

[Problem that the invention seeks to solve]

However, when manufacturing a 4-layer substrate etc. with these through holes, the process is complicated, the number of steps for manufacturing the substrate increases, and the yield is also slightly lower than that of a normal substrate. Therefore, there was a problem in that the cost of the board was much higher than that of a normal board.

[Means for solving problems]

In order to solve the above problems, in the present invention, the four-way connection between the front and back surfaces of an insulating substrate having conductor patterns formed on both the front and back surfaces is made by a flexible substrate having a conductor pattern.

〔Example〕

Next, the present invention will be explained by examples.

FIG. 1 (al and di are perspective views for explaining the manufacturing process of a hybrid integrated circuit according to an embodiment of the present invention. First, in FIG. 1(a), conductive patterns are 2 is formed (however, the figure shows only the surface), print solder paste on the connection part of the insulating substrate 1, and attach the mini mold transistor 3, chip capacitor 4, etc. to the predetermined positions. (
As shown in b), on the polyimide flexible substrate 5,
A copper foil 6 is pasted 9 on a pattern that allows cross-connection to both sides of the insulating substrate 1 at the # end of the insulating substrate 1. Then, as shown in FIG. 1C, the flexible substrate 5 is fixed so as to span the edge of the insulating substrate 1, with the connection patterns aligned. A solder paste is also printed on the connecting portions of the flexible substrate 5, and then the insulating substrate 1 and the flexible substrate 5 are passed through a furnace 70, and the insulating substrate 1 and the flexible substrate 5. Mini mold transistor 3, chip capacitor 4. Furthermore, the lead terminals 7 are melted and bonded with solder to be fixed. Finally, as shown in FIG. 1(d), an outer device is applied using resin or the like.

〔Effect of the invention〕

As described above, according to the present invention, even if it is a double-sided printed insulating board, no through holes are provided, so the structure is simpler and the number of man-hours is reduced compared to conventional boards with through holes.
Along with this, the manufacturing yield will also improve and the unit price of the substrate will become much cheaper. As a result of equipment rationalization in recent years, the proportion of the board price in the price of a hybrid integrated circuit device has increased, so the reduction in the board price due to the present invention is due to the reduction in the price of the entire hybrid integrated circuit device. make a major contribution to

In the above embodiments, a polyimide film has been described as the 7-lexiple substrate, but it goes without saying that other resin films can also be used.

[Brief explanation of drawings]

1A to 1D are perspective views for explaining the manufacturing process of a hybrid integrated circuit device according to an embodiment of the present invention. 1... Insulating substrate, 2... ...Conductor pattern, 3...Mini mold transistor, 4...
...Chip capacitor, 5...7 board, 6...conductor pattern of flexible board, 7...lead terminal, 8...exterior resin. Agent Patent Attorney Uchihara Oto 67 Kuni

Claims (1)

[Claims] In a hybrid integrated circuit device in which active and passive circuit components are mounted on an insulating substrate with conductor patterns formed on both the front and back sides, electrical connection between the front and back surfaces of the insulating substrate is made by a flexible substrate. A hybrid integrated circuit device characterized by: