JP3012184B2 - Mounting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a mounting apparatus for mounting a predetermined number of electronic components on a substrate. 2. Description of the Related Art In recent years, in the field of information and communication of computers and the like, the performance has been improved, and it has been desired to increase the mounting density of semiconductor chips and the like on a mounting board to be mounted.

[0002]

2. Description of the Related Art Conventionally, a mounting board has a maximum number of components mounted on a board of an allowable size due to a limitation of an installation space of a device to be mounted. Therefore, FIG.
FIG. 1 shows a configuration diagram of a conventional mounting board. In the mounting substrate 11 shown in FIG. 11A, a wiring pattern is formed on both surfaces of a printed substrate 12 formed of, for example, glass epoxy, and the wiring patterns on both surfaces are appropriately electrically connected by through holes. A predetermined number of semiconductor chips 13 corresponding to the wiring patterns are mounted on both sides of the printed board 12 by flip chips with a predetermined number of bumps 14.

[0003] A mounting board 15 shown in FIG.
Is a printed circuit board 16 having a wiring pattern formed on both sides.
A predetermined number of substrates 17 on which semiconductor chips 13 are mounted by flip chips on bumps 14 on one side are stacked in a predetermined number, and adjacent printed circuit boards 16 are electrically connected by connectors 18. It is also known that electrical connection is made using a flexible substrate instead of the connector 18.

[0004] The mounting boards 11 and 15 as described above are connected to, for example, a motherboard or a PC card (PCMC).
IA (Personal Computer Mem
ory Card International As
standard) (3.3 mm thick for TYPE I, 5 mm thick for TYPE II)
mm, TYPE III, thickness 10 mm).

[0005]

However, FIG.
In the mounting as shown in (A) and (B), the number of electronic components (semiconductor chips) to be mounted is limited within the dimensions of the printed circuit board limited by the installation space, and it is difficult to achieve higher density mounting. There is a problem that is. In addition, the formation of wiring patterns on both sides of the printed circuit boards 12 and 16 with through holes has a problem in that the land density of the through holes hinders an improvement in pattern density. Furthermore, there is a problem that it is difficult to radiate heat efficiently and small while the amount of heat generated by the semiconductor chip 13 and the like to be mounted is becoming higher and more integrated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a mounting apparatus that achieves high-density mounting, reduces costs, and improves heat dissipation.

[0007]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means. According to the first aspect of the invention, electronic components are provided on the front and back surfaces.
Each mounting device is made by bending the mounted flexible substrate.
A wiring pattern and the wiring pattern on the surface of the flexible substrate.
Forming a first terminal for internal connection corresponding to the turn, the
On the back surface of the flexible substrate, a wiring pattern and the wiring pattern
Corresponding second form the internal connection terminals, the flexible base
By bending the plate into a ring shape, the first internal connection terminal
Connecting to the second internal connection terminal, and forming on the surface;
Wiring pattern and the wiring pattern formed on the back surface
Are electrically connected to each other.

[0008] The invention according to claim 2 provides the invention according to claim 1.
Mounting device, the surface has a third internal connection
A terminal is further formed, and a fourth internal connection end is provided on the back surface.
The electronic component is further formed with electronic components mounted on the back surface.
By bending the flexible substrate in a ring shape, the third
The internal connection terminal is connected to the fourth internal connection terminal.
It is characterized by that. Further, according to claim 3
The present invention provides the mounting device according to claim 1, wherein
The substrate is twisted and bent into a ring shape
Things.

According to the first to third aspects of the present invention, the flexible substrate
Requires a wiring pattern on the front side of the board and a wiring pattern on the back side
Electrical connection by each internal connection terminal according to
become. This makes it especially necessary to form through holes
And the pattern density is improved,
The hole forming process and plating process for forming
And cost reduction can be achieved.

[0010]

[0011]

[0012]

FIG. 1 shows a configuration diagram of a first embodiment of the present invention. FIG. 2 shows a configuration diagram of the flexible substrate of FIG. Mounting device 21 _A shown in FIG. 1, the flexible substrate 23 _A is a flexible substrate on the mother board 22 is a mount substrate is mounted is bent in a predetermined shape, electricity I / O lead 24 is a read unit It is implemented with a static connection.

[0013] The flexible substrate 23 _A is a in which a predetermined wiring pattern on both surfaces of a strip-shaped film base by a gold (Au) or the like is formed, a predetermined external number to the one end as shown in FIG. 2 (B) I / O terminal 25 serving as a connection terminal
a, 25b (25b is the back surface, not shown in the figure). Then, as shown in FIG. 2 (A), (B) , for a predetermined number of electrical connections by a predetermined number of bumps 27 on which the semiconductor chip 26 correspond as an electronic component on a predetermined wiring pattern of both surfaces of the flexible substrate 23 _A Is implemented two-dimensionally.

[0014] Returning to Figure 1, a motherboard 22 is intended to have a predetermined wiring pattern on one surface, for example, glass epoxy or the like is formed, firstly the flexible substrate 23 _A in the motherboard 22 is laterally (semiconductor chip 26 and the motherboard 22 (Parallel direction). At this time, the back surface of the flexible substrate 23 _A (mother board 22 side surface) which is formed in the I / O terminal (25b) are electrically connected by soldering or the like directly with a predetermined portion of the wiring pattern on the motherboard 22. And
I / O terminal 25a on the surface of the flexible substrate 23 _A is,
Predetermined portions of wiring pattern on motherboard 22 and I / O
The leads 24 are electrically connected by solder or the like.

[0015] I / O lead 24 is, for example, a tape lead pattern is formed for the I / O terminal 25a of the flexible substrate 23 _A, it is interposed for each I / O pin 25a. Note that a tape lead in which a predetermined number of I / O leads 24 are integrated may be used.

That is, the semiconductor chip 26 is
Flexible substrate 23 on _AThree-dimensional through
In the height direction and secondary to the allowable limit of the dimension in the height direction.
High-density mounting can be achieved compared to the original mounting
It is. Then, the semiconductor chip 26 is appropriately motherboarded.
Sealed with a mold resin or the like on the
It is mounted on equipment or built in PC card etc.
is there.

[0017] Incidentally, the flexible substrate 23 _A, the wiring patterns formed on both sides as described above I / O terminals 2
Since the connection with the outside is made by 5a and 25b, it is not necessary to form through holes and connect the predetermined wiring patterns on both sides, and it is not necessary to form lands and the like, thereby reducing the pattern density. It is possible to reduce the number of hole forming steps and plating steps for forming through holes, and to reduce
The cost can be reduced, and as a result, the cost can be reduced.

FIG. 3 is a block diagram showing another embodiment of the first embodiment. Mounting device 21 _B shown in FIG. 3, on the motherboard 22 to the flexible substrate 23 shown in FIG. 2 described above, in which the semiconductor chip 26 is mounted in bent folded so as to be vertically motherboard 22 , a predetermined wiring pattern of the motherboard 22, the connecting rear surface of the flexible substrate 23 _a of the I / O pin (25b), the I / O terminal 25a of the surface to be connected through the I / O leads 24 Figure Same as 1.

Next, FIG. 4 shows a configuration diagram of a second embodiment of the present invention. FIG. 4A is a plan view, and FIG. 4B is a side view. Mounting device 21 _C shown in FIG. 4, for example, the above FIG. 3
In the mounting apparatus 21 _B shown in, is a predetermined number of fin portions 28a to be contacted with the semiconductor chip 26 of the flexible substrate 23 _A that is bent formed by attaching a heat radiating plate 28 is a heat radiating member formed integrally.

That is, the bent flexible substrate 2
The semiconductor chip 26 mounted on both sides of the 3 _A is since it is possible to line up in the same direction, by taking the heat radiating plate 28 from the arrangement direction, a plurality of semiconductor chips 2
6 can be radiated at once by a single radiator plate 28. This eliminates the need to attach a plurality of heat radiating members, reduces the number of components, reduces the number of assembly steps, and can reduce the cost.

The attachment of the heat radiating plate 28 is not limited to the case shown in FIG. 3, but can be carried out even in a bent shape as shown in FIG. 1, and in the third to fifth embodiments described later. What can be applied. Next, FIG. 5 shows a configuration diagram of a third embodiment of the present invention. Also, FIG.
1 shows a configuration diagram of a flexible substrate. Mounting device 21 _D shown in FIG. 5, the flexible substrate 23 _B mounted with the semiconductor chip 26 on the motherboard 22 mounted in the annular,
And the wiring pattern of the motherboard 22 and the flexible substrate 23 _B in which was connected with I / O lead 24 of a predetermined number.

[0022] Here, in FIG. 6 (A) ~ (C) , as shown in FIG. 6 (B) in the surface 23a on the flexible substrate 23 _B, outside one end to a predetermined wiring pattern formed An I / O terminal 25a as a connection terminal is formed, and a predetermined number of first internal connection terminals 29 for a predetermined wiring pattern are formed as a set at the other end. Further, the back surface of the one end side with respect to the I / O terminal 25a to the back surface 23b of the flexible substrate 23 _B, along with corresponding to a predetermined wiring pattern formed, a predetermined number corresponding to the first internal connection terminal 29 Are formed as a set.

[0023] Then, a predetermined number of the semiconductor chips 26 are bumps 27 on both sides of the flexible substrate 23 _B (two each on each side in FIG. 5 and FIG. 6) but is implemented. Therefore, returning to FIG. 5, the flexible substrate 23 _B when the ring is connected to the first internal connection terminal 29 and a second inner connection terminal 30. Thus, would be electrically connected as required with the wiring pattern of the wiring pattern and the back 23b of the surface 23a of the flexible substrate 23 _B, there is no particular need to form through holes, the pattern density as described above And a hole forming step for forming a through hole, a plating step, and the like can be reduced, and cost reduction can be achieved.

When the flexible substrate _23B has a dedicated power supply pattern or GND pattern (having a plurality of types of power supply systems and GND systems) as a multilayer structure, through holes are required for connection to the power supply pattern and the GND pattern. However, at least a through hole of the signal system is unnecessary, and the pattern density can be improved.

Next, FIG. 7 shows a configuration diagram of a fourth embodiment of the present invention. FIG. 8 shows a configuration diagram of the flexible substrate of FIG. Mounting device 21 _E shown in FIG. 7 is a development of the Figure 5 and 6, by connecting the internal connection terminals of the flexible substrate 23 _C that is mounted on the mother board 22, for example, the respective corresponding at two points It has a ring shape.

That is, in FIGS. 8A to 8C,
Out of 6 on the surface 23a of the flexible substrate 23 _C, the semiconductor chip 2 from the first set of internal connection terminals 29
6, a predetermined number of third internal connection terminals 31 are formed, and a predetermined number of fourth internal connection terminals 31 are formed on the back surface _23B of the second internal connection terminals 30 with the semiconductor chip 26 interposed therebetween.
Of the internal connection terminals 32 are formed.

As shown in FIG. 7, the first set of internal connection terminals 29 and the fourth set of internal connection terminals 32 are electrically connected, and the second set of internal connection terminals 30 are connected. The set is electrically connected to the set of the third internal connection terminals 31. Also in this case, similarly to the third embodiment, the pattern density can be improved and the cost can be reduced.

Next, FIG. 9 shows a configuration diagram of a fifth embodiment of the present invention. FIG. 10 shows a configuration diagram of the flexible substrate of FIG. Mounting device 21 _F shown in FIG. 9 is an implementation by bending the flexible substrate 23 _D by a predetermined number of mounting a semiconductor chip 26 on the motherboard 22 to 180 ° twisted with annular.

Then, in FIGS. 10A to 10D,
The surface 23a of the flexible substrate 23 _D and a first set of internal connection terminals 29 are formed in pairs and the other end of the I / O terminal 25a to the one end as shown in FIG. 6 (B), the back surface 25
In b, a set of fourth internal connection terminals 32 is formed at a position corresponding to the I / O terminal 25a, and a set of a predetermined number of second I / O terminals 25c is formed at the other end (FIG. 10B). , (C)).

[0030] Therefore, the flexible substrate 23 _D 10
As shown in FIG. 9 (D), the first set of internal connection terminals 29 and the second set of internal connection terminals are electrically connected as shown in FIG. 2 I / O terminal 2
5c is connected to a predetermined wiring pattern on the motherboard 22 by I / O leads 24.

By mounting as described above, it is possible to improve the pattern density and reduce the cost by eliminating the need for forming through holes as described above. As described above, electronic components such as a plurality of semiconductor chips 26 and the like can be mounted on a small area, and a through-hole is not required, so that the pattern density can be improved and the cost can be reduced. The heat radiating plate 28 can efficiently radiate heat at low cost.

[0032]

As described above, according to the first to third aspects of the present invention,
Then, the wiring pattern on the front surface and the wiring pattern on the back
Turns are electrically connected by internal connection terminals as necessary.
Will be connected. This allows for especially through holes
Need not be formed, the pattern density is improved,
Hole forming process and plating process for through hole formation
Etc. can be reduced, and cost reduction can be achieved.
You.

[0033]

[0034]

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a first embodiment of the present invention.

FIG. 2 is a configuration diagram of a flexible substrate of FIG. 1;

FIG. 3 is a configuration diagram of another embodiment of the first embodiment.

FIG. 4 is a configuration diagram of a second embodiment of the present invention.

FIG. 5 is a configuration diagram of a third embodiment of the present invention.

FIG. 6 is a configuration diagram of the flexible substrate of FIG. 5;

FIG. 7 is a configuration diagram of a fourth embodiment of the present invention.

FIG. 8 is a configuration diagram of the flexible substrate of FIG. 7;

FIG. 9 is a configuration diagram of a fifth embodiment of the present invention.

FIG. 10 is a configuration diagram of the flexible substrate of FIG. 9;

FIG. 11 is a configuration diagram of a conventional mounting board.

[Explanation of symbols]

21 _{A to} 21 _F Mounting device 22 Motherboard 33 _{A to} 33 _D Flexible board 24, 33 I / O lead 25 a to 25 c I / O terminal 26 Semiconductor chip 28 Heat sink 29 First internal connection terminal 30 Second internal connection Terminal 31 Third internal connection terminal 32 Fourth internal connection terminal

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Kazuhisa Tsunoi 1015 Uedanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Limited (56) References JP-A-5-95080 (JP, A) JP-A-4-234157 (JP, A) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 25/04

Claims (3)

(57) [Claims] An electronic component is mounted on each of front and back surfaces.
In a mounting device in which a flexible substrate is bent , a wiring pattern and a wiring pattern are provided on a surface of the flexible substrate.
Forming a first internal connection terminal corresponding to the wiring pattern, and forming a wiring pattern and the wiring pattern on the back surface of the flexible substrate.
And a second internal connection terminal corresponding to the first internal connection terminal is formed by bending the flexible substrate into a ring shape.
Connection terminal and the second internal connection terminal, and
Wiring pattern formed on the surface and wiring formed on the back surface
A mounting device , wherein the mounting device is electrically connected to a pattern . 2. A third internal connection terminal is further provided on the surface.
And a fourth internal connection terminal mounted on the back surface.
And the third substrate is formed by bending the flexible substrate into a ring shape.
Connection between the connection terminal and the fourth internal connection terminal.
The mounting device according to claim 1, wherein: 3. The flexible substrate is twisted and bent into a ring shape.
The mounting device according to claim 1, wherein the mounting device is mounted.