JPH098462A - Multilayer printed-wiring board module - Google Patents

Abstract

PURPOSE: To contrive a reduction in the occupation area of a module, which consists of multilayer printed-wiring boards mounted with electronic components, in the same function as that of another board and an increase in the functions of the module in the same occupation area as that of another board. CONSTITUTION: Electronic components 11 are mounted on two sheets of multilayer printed-wiring boards 10 for mounting use and input/output terminals 12 installed on both ends of these boards 10 are respectively inserted in through holes 17 provided in two sheets of multilayer printed-wiring boards 15 for coupling and connection use and are soldered to the boards 15. The two sheets of the boards 10 are coupled and connected with each other mechanically and electrically by the two sheets of the boards 15 and a multilayer printed-wiring board module 1 in the form of a multiple structure (a three-dimensional structure) is obtained. This board module 1 is mounted an another board or the like via input/output terminals 16 installed on the lower ends of the two sheets of the boards 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed multilayer wiring board module.

[0002]

2. Description of the Related Art FIG. 2 is a plan view and a front view of a conventional printed multilayer wiring board module. The printed multilayer wiring board module (hereinafter, board module) 2 shown in FIG.
Printed multilayer wiring board having conductive wiring (hereinafter referred to as board)
20, an electronic component (active component, passive component) 21 for performing an electrical function operation, and an input / output terminal 22 for electrically connecting the substrate 20 to another substrate or the like.

The substrate 20 has a multi-layer structure formed by a multi-layer multi-layer technique, and has conductive wirings which are electrically connected to each other through conductive holes (through holes). Substrate 2
0 has a wiring pattern formed on the upper surface thereof, and the conductive pads 20a having the number and area corresponding to each lead 21a of the electronic component 21 having the surface mount type package form are provided on the upper surface side. Each lead 21a of the electronic component 21 is connected to the pad 20a by solder 23. The conductive wiring of the substrate 20 is connected to the input / output terminal 22.
It is connected to the.

In such a board module 2,
Using the input / output terminals 22 installed at both ends of the substrate 20,
The most common mounting method is to electrically connect to another board or the like. When such a mounting method is adopted, the outer dimensions of the board module 2 are determined from the area required for mounting the electronic component 21 that constitutes the board module 2.

[0005]

However, the board module 2 adopting the conventional mounting method requires a certain amount of area when the board module 2 is to be mounted on a plane, and the board module 2 is mounted on a plane within a limited area. In this case, the board module 2 may not fit in the mounting area due to its outer dimensions. Further, even when the number of equivalent electronic components is increased in the same area to add a function, there is an adverse effect that the external dimensions cannot be mounted in a limited area.

Therefore, the present invention has been made based on the above circumstances, and provides a printed multilayer wiring board module capable of reducing the area occupied by an equivalent function and increasing the number of functions within the same area. The purpose is to

[0007]

In order to achieve the above-mentioned object, the present invention mounts an electronic component on a printed multilayer wiring board for mounting having conductive wiring and comprises an input / output terminal to form an electric circuit. In a printed multilayer wiring board module having an electrical functional operation, a plurality of mounting printed multilayer wiring boards are connected and connected to each other through the input / output terminals by a connection / connection printed multilayer wiring board to form a multiple structure. To do.

[0008]

In the present invention configured as described above, a plurality of mounting printed multilayer wiring boards on which electronic components are mounted are mechanically and mechanically connected by the printed multilayer wiring board for connection connection through these input / output terminals. It is electrically connected and connected to form a multiple structure (three-dimensional structure). As a result, it is possible to reduce the area occupied by the same function, and it is also possible to increase the number of functions in the same area.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a plan view, a front view, and a side view of a printed multilayer wiring module in this embodiment. A printed multilayer wiring board module (hereinafter referred to as a board module) 1 shown in FIG. 1 includes two printed multilayer wiring boards (hereinafter referred to as mounting boards) 10 having conductive wirings and electronic components (integrated circuit, Capacitor, resistor, etc.) 11,
An input / output terminal 12 for electrically connecting the two mounting boards 10 to the outside, and two printed multilayer wiring boards for connecting and connecting the two mounting boards 10 (hereinafter referred to as connecting and connecting terminals). Substrate 15 and input / output terminals 16 for electrically connecting the connection / connection substrate 15 to another substrate or the like.

First, the two mounting substrates 10 are unified to have the same outer dimensions (length a35 mm × width b30 mm), and each of them has a multi-layered structure, for example, a four-layered structure, and has a thickness of 1. It is set to 0 mm.
Each layer of the mounting substrate 10 has a conductive wiring that is electrically connected by being electrically connected by a conductive hole (through hole).
A wiring pattern solder-plated on a copper foil is formed on the upper layer surface portion of the mounting substrate 10, and conductive pads 10a having a number and an area corresponding to each lead 11a of the electronic component 11 having a surface mounting type package are formed on the upper surface. The leads 11a of the electronic component 11 are connected to these conductive pads 10a by solder 13 on the side. The input / output terminals 12 are composed of lead frames installed at both ends of the mounting board 10. The input / output terminals 12 are center-distributed to the long side of the board 10 and are horizontally arranged at a pitch p of 2.54 mm by, for example, soldering. It is arranged. Then, the conductive wiring of the mounting substrate 10 is connected to the input / output terminal 12. The mounting board 10, the electronic component 11, and the input / output terminal 12 form two board modules having a certain electrical functional operation.

Next, the two connecting and connecting boards 15 are
The external dimensions of the width a corresponding to the mounting substrate 10 (height c
19 mm) and has a conductive wiring in the same multilayer structure as the mounting substrate 10. Then, through holes 17 which are connected to the conductive wiring and into which the input / output terminals 12 of the mounting substrate 10 can be inserted are formed in the connecting and connecting substrate 15 at positions 3 mm below and 10 mm below the upper end of the substrate 15. It is aligned with the position. Further, the input / output terminals 16 are composed of lead frames installed at the lower end of the connection / connection board 15, and are arranged vertically at a pitch p of 2.54 mm by, for example, soldering. Then, the connection connection board 15
Is connected to the input / output terminal 16.

In the above structure, the two mounting substrates 1 are mounted.
The input / output terminals 12 at both ends of 0 are respectively inserted into the through holes 17 of the two connection / connection boards 15 and soldered, for example. As a result, the two mounting boards 10 and the two connecting and connecting boards 15 are mechanically and electrically connected to each other, and the board module 1 in the form of a multiple structure (three-dimensional structure) is obtained. As a result, it is possible to reduce the occupied area with the same function, and it is possible to have multiple functions with the same occupied area. The board module 1 is mounted on another board or the like through the input / output terminals 16 of the two connection / connection boards 15.

In this embodiment, the input / output terminals 12 and 1 are
Although the lead frame is used as 6, a connector may be used for the same purpose. Further, in this embodiment, two mounting printed multilayer wiring boards 10 have a multiple structure, but three or more mounting printed multilayer wiring boards 10 may be stacked if there is no restriction in the height direction. Further, the electronic component 11 may be double-sided mounted on the mounting printed multilayer wiring board 10. It goes without saying that the numerical values and the like shown in this embodiment can be appropriately designed and changed.

[0014]

As described above, according to the present invention,
In a printed multilayer wiring board module, a plurality of mounting printed multilayer wiring boards on which electronic components are mounted are connected and connected by a connection / connection printed multilayer wiring board via these input / output terminals to form a multiple structure. By doing so, it is possible to reduce the area occupied by the same function and increase the number of functions in the same area. As a result, high density and high functionality can be achieved, and mounting efficiency is greatly improved. be able to.

[Brief description of drawings]

1 shows a printed multilayer wiring board module according to an embodiment of the present invention, (a) is a plan view, (b) is a front view, FIG.
(C) is a side view.

2A and 2B show a conventional printed multilayer wiring board module, in which FIG. 2A is a plan view and FIG. 2B is a front view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed multilayer wiring board module 10 Printed multilayer wiring board for mounting 11 Electronic component 12 Input / output terminal 15 Printed multilayer wiring board for connection connection 16 Input / output terminal 17 Through hole

Claims (1)

[Claims] 1. A printed multi-layer wiring board module having electrical functional operation, comprising an electronic component mounted on a printed multi-layer wiring board for mounting having a conductive wiring, and an electric circuit having an input / output terminal. A printed multi-layer wiring board module, wherein a plurality of mounting printed multi-layer wiring boards are connected and connected by the printed multi-layer wiring board via the input / output terminals to form a multiple structure.