JPS63114299A - Printed wiring board - Google Patents

Abstract

(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a printed wiring board on which components such as flat package components are mounted.

(Prior art) In recent years, with the demand for higher density wiring (conductor patterns) and higher mounting of components, component accommodation holes are formed in the board, the components are accommodated in the component accommodation holes, and the leads of the components are connected to the board. The conductor pattern is connected by soldering.

Examples of such printed wiring boards include the following.

FIG. 4 shows a conventional printed wiring board, in which 1 is a printed circuit board with conductive patterns 1a and 1b formed on both the front and back surfaces, 2 is a component accommodation hole provided in the printed circuit board 1, and 3 is a A through-hole plated portion 4 is used to electrically connect the conductive patterns 1a and 1b on the front and back surfaces of the printed circuit board 1, and 4 is a flat plate that is accommodated in the component accommodation hole 2 of the printed circuit board 1 and has a lead 4a soldered to the conductive pattern 1a. It is a package part.

In the conventional printed wiring board configured in this way, the flat pan cage component 4 is accommodated in the component accommodation hole 2 formed in the printed circuit board 1, so that the thickness of the printed wiring board 1 can be adjusted on the printed circuit board. It is possible to make the board thinner than a board on which flat package components are mounted.

However, the conventional printed wiring board configured as described above has a problem in that the wiring density of the conductor patterns 1a and 1b is significantly reduced due to the formation of the component accommodation hole 2 in the printed circuit board 1. Furthermore, the flat package component 4 connects the leads 4a to the conductor pattern 1 of the printed circuit board 1.
Since the lead 4a is fixed by soldering to the lead 4a, if the printed circuit board 1 is bent or twisted, a connection failure between the lead 4a and the conductive pattern 1a may occur.

(Problems to be Solved by the Invention) The present invention is intended to solve the above-mentioned conventional problems, and can significantly improve the wiring density of conductor patterns and high mounting of components, and moreover, An object of the present invention is to provide a printed wiring board that can significantly improve the reliability of a connection part.

[Configuration of the Invention (Means for Solving Problems)] In order to achieve the above object, the present invention provides a first structure in which a component is accommodated in a component accommodation hole and a lead of the component is led out from the component accommodation hole. a second substrate having a conductive pattern formed on at least one surface and fixed to at least one surface of the first substrate so as to cover the component; and a conductive pattern provided on at least the second substrate. and conductive connecting means for electrically connecting the lead of the component and the lead of the component.

(Function) By the above-mentioned means, the present invention can significantly improve the wiring density of the conductor pattern and high mounting of components, and can also significantly improve the reliability of the electrical connection portion.

(Example) Embodiments of the present invention will be described in detail below based on the drawings.

1 and 2 show a printed wiring board according to an embodiment of the present invention. In these figures, 11 is an insulating plate that is an inner layer base material, and 12 is a component accommodation hole formed in the insulating plate 11. , 13 is a flat package component accommodated in the component housing hole 12 and having a lead 13a led out onto the insulating plate 11;
．． Reference numeral 14 denotes a printed circuit board on which a conductive pattern 16 is formed, which is fixed to both the front and back sides of the insulating board 11 via an adhesive 15, and 17 electrically connects the conductive pattern 16 of the printed circuit board 14 and the lead 13a of the flat package component 13. This is a through-hole plating section for

Next, a method of assembling the printed wiring board of this embodiment will be explained.

As shown in FIG. 3, first, the flat package component 13 is accommodated in the component accommodation hole 12 formed in the insulating plate 11. As shown in FIG. The above-mentioned component accommodation hole 12 is for flat package component 1.
It also serves as a positioning hole for accurately forming the through-hole plated portion 17 on the lead 13a of No. 3. After this,
Copper-clad laminates 14a, 14a (this copper-clad laminate 14a becomes a printed circuit board 14 through a predetermined process described later) are attached to both the front and back surfaces of the insulating board 11 via an adhesive 15 such as prepreg. The adhesive 15 is melted using a heat press or the like to form an integral structure. Then, the copper-clad laminate 14a is formed on the printed circuit board 14 having the conductor pattern 16 through ordinary printed wiring board manufacturing processes such as drilling, resist removal, and etching.

Then, a printed wiring board is obtained by electrically connecting the conductor pattern 16 of the printed circuit board 14 and the lead 13a of the flat package component 13 through the through-hole plating portion 17.

In this embodiment, printed circuit boards 14 and 14 are disposed on both the front and back sides of the insulating plate 11, including on the flat package parts 13 accommodated in the component accommodation holes 12 of the insulating plate 11, so that the wiring density of the conductive pattern 16 and the flat It is possible to greatly improve the high mounting efficiency of the package component 13. Furthermore, a printed circuit board 14 is placed on the flat package component 13.
Since the lead 13a and the conductor pattern 16 are fixed by the adhesive 15, the lead 13a and the conductor pattern 16 may be bent or twisted to the insulating plate 11.
It is possible to effectively prevent connection failures.

In the embodiment described above, the insulating plate 11 is used as the inner layer base material on which the flat package component 13 is mounted, but a printed circuit board on which a conductor pattern is formed on this insulating plate may also be used. Although the printed circuit board is bonded to both sides, the printed circuit board may be fixed only to the portion that covers the flat package component.

[Effects of the Invention] As explained above, the printed wiring board of the present invention can significantly improve the wiring density of conductor patterns and the high mounting of components, and also significantly improve the reliability of electrical connections. can be done.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view for explaining a printed wiring board according to an embodiment of the present invention, FIG. 2 is an enlarged side sectional view of FIG.
FIG. 3 is an exploded side sectional view for explaining the manufacturing process of the printed wiring board of FIG. 1, and FIG. 4 is a side sectional view for explaining the conventional printed wiring board. 11...Insulating plate 12...Component accommodation hole 13...Flat package component 13a
...Lead 14...Printed circuit board 16...Conductor pattern 17...Through-hole plating section Applicant
Toshiba Corporation Representative Patent Attorney Sasa Suyama - Figure 1 Figure 2

Claims (4)

[Claims] (1) A first substrate with a component accommodated in a component accommodation hole and a lead of the component led out from the component accommodation hole, and at least one surface of the first substrate with a conductor pattern formed on at least one surface. a second part fixed over said part;
1. A printed wiring board comprising: a substrate; and conductive connecting means for electrically connecting at least a conductive pattern provided on the second substrate and a lead of the component. (2) The printed wiring board according to claim 1, wherein the first substrate is an insulating board. (3) The printed wiring board according to claim 1, wherein the first substrate is a printed circuit board on which a conductor pattern is formed. (4) The printed wiring board according to claim 1, wherein the conductive pattern on the first substrate and the conductive pattern on the second substrate are connected by conductive connecting means.