JPH06314885A - Multilayer printed wiring board module - Google Patents

Abstract

PURPOSE:To provide a multilayer printed wiring board module which can be mounted in a width margin range limited for a thickness in the height direction by reducing the thickness margin in the height direction of a multilayer printed wiring board main body from its upper layer to an electronic component mounted and assembled. CONSTITUTION:A penetration hole 16 as large as an outward form dimension of an electronic component 11 is bored on a multilayer printed wiring board main body 10 to incorporate the electronic component. A number of conductor pads equivalent to the input and output portion of the electronic component are further installed to the end of a penetration hole of the multilayer printed wiring board and a main body of the electronic component is incorporated into and soldered in the penetration hole in a turned over state to a standard package system so that the input/output terminal 15 of the electronic component may be paired with each input and output terminal on a conductive pad 14, thereby providing a multilayer printed wiring board module which is mounted based on the penetration hole.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an industrial and consumer printed multilayer wiring board module.

[0002]

2. Description of the Related Art FIG. 3 is a front view and a plan view of a printed multilayer wiring board module. The printed multi-layer wiring board module shown in FIG. 3 electrically connects the printed multi-layer wiring board body 20 electrically connected to the electronic component (integrated circuit) 21, which electrically operates, the printed multi-layer wiring board body 20 and other boards. Input / output terminal (lead frame) 22 for electrical connection.

The main body 20 of the printed multilayer wiring board has a multilayer structure formed by a laminated multilayer technique and is constituted by a pattern which is electrically connected by conducting holes (through holes), and has an upper layer surface portion of the printed multilayer wiring board. Has
A conductive pattern having a conductive pattern plated with solder on a copper foil and having a certain area equivalent to the input / output terminals of the electronic component (integrated circuit) 21 having the S0-20 type package form shown in FIG. A conductive pad 24 is provided, and the input / output terminals of the electronic component (integrated circuit) 21 are mounted on the conductive pad 24 and soldered with solder 23.

The printed multilayer wiring board body 20 is also provided.
An input / output terminal (lead frame) 22 for electrically connecting the printed multilayer wiring board body 20 to another board is soldered to the end of the. When this mounting method is adopted, the printed multilayer wiring board body 20 when the electronic component (integrated circuit) 21 is soldered to the upper surface of the printed multilayer wiring board body 20 with the solder 23
The width in the height direction from the substrate surface to the upper surface of the electronic component (integrated circuit) 21 has an upper limit value of 3.5 mm.

When displaying the thickness width in the height direction of a normal printed multilayer wiring board module, the printed multilayer wiring board main body is inserted from the position of a stopper provided on the input / output terminal (lead frame) 22 for preventing excessive insertion. The size up to the height of the electronic component (integrated circuit) 21 mounted on the upper surface of the board 20 is described. In this case, from the upper surface of the printed multilayer wiring board body 20 which is the difference between the conventional technology and the present invention, The contents of the upper part will be described.

[0006]

The printed multi-layer wiring board module adopting the conventional mounting method is a printed multi-layer wiring board module adopting the conventional mounting method for a certain limited thickness in the height direction. Since there is a limit to the thickness in the height direction when attempting to assemble and mount, in the normal general mounting method, the thickness in the height direction from the top surface of the printed multilayer wiring board body to the top surface of the electronic component is as described above. Since the upper limit of the width is 3.5 mm, when trying to mount in the range of thickness width 2.5 mm in the height direction, the electronic parts mounted on the printed multi-layer wiring board module and the thickness width in the height direction that is restricted There is a problem in that there is an adverse effect that it cannot be attached due to contact with other formed parts.

The present invention has been made based on the above circumstances, and in a printed multilayer wiring board module,
Printed multi-layer wiring board Printable that can be mounted within the range of thickness where the thickness in the height direction is limited by reducing the thickness in the height direction from the upper layer surface to electronic components It is an object to provide a multilayer wiring board module.

[0008]

In order to achieve the above-mentioned object, a printed multilayer wiring board module of the present invention has an electronic circuit mounted on a printed multilayer wiring board main body with conductive wiring, and has an input / output terminal to provide an electric circuit. In the printed multilayer wiring board module configured as described above, a through hole having a large outer dimension of the electronic component to be mounted provided on the printed multilayer wiring board body and a plurality of conductive members provided at the end of the through hole on the surface of the printed multilayer wiring board body. And a conductive pad, and an electronic component in which a body portion is inserted into the through hole and an input / output terminal extending from the body portion is connected to the conductive pad.

[0009]

According to the present invention, according to the above-mentioned structure, in the printed multilayer wiring board module, a through hole for incorporating the electronic component in the printed multilayer wiring board body constituting the printed multilayer wiring board module is formed so that the electronic component can be incorporated. An electronic component is provided with a large outer dimension, and conductive pads for connecting the electronic component in the circuit are provided at the end of the through hole of the printed multilayer wiring board main body, the number corresponding to the number of input / output terminals of the electronic component. Set the I / O terminals of each to correspond to each of the conductive pads, and make sure that each I / O terminal of the electronic component is paired with each of the I / O terminals on the conductive pad. Then, the main body of the electronic component is installed in the through hole, and each input / output terminal of the contacted electronic component and the conductive pad are soldered and mounted. Printed multilayer wiring board module mounting efficiency by the miniaturization as mounting and mounting it in a small space than that made thinner lower thickness width is improved by implementing utilized.

[0010]

EXAMPLES Examples will be described below with reference to the drawings. FIG. 1 is a front view and a plan view of a printed multilayer wiring board module according to an embodiment of the present invention. The printed multi-layer wiring board module shown in FIG. 1 includes a printed multi-layer wiring board body 10 that is electrically connected, an electronic component (integrated circuit) 11 that performs an electrical function operation, and the printed multi-layer wiring board body 10.
And an input / output terminal (lead frame) 12 for electrically connecting the other substrate.

The printed multi-layer wiring board body 10 has a four-layer structure having a multi-layer structure formed by a multi-layer multi-layer technique, and has a thickness of 1.2 mm. Each of the layers is electrically conductively wired through a conductive hole (through hole) to form a pattern having electrical conductivity. A conductive pattern solder-plated on a copper foil is wired on the upper surface of the printed multilayer wiring board. Has been done.

Further, the printed multi-layer wiring board in a state in which an electronic component (integrated circuit) 11 having an S0-20 type package form defined by the standard shown in FIG. A 8.5 × 15 mm square through hole 16 is formed so that it can be incorporated into the main body 10. Further, 0.4 × corresponding to the number of input / output terminals of the electronic component (integrated circuit) 11 is provided at a position with a clearance of 0.3 mm from the end of the through hole 16 of the printed multilayer wiring board body 10.
20-pin conductive pad 1 having a size of 1.3 mm
4 are installed at intervals of 1.27 mm.

The electrically conductive pattern wiring is arranged in consideration of the through hole 16. The printed multi-layer wiring board body 10 set to the above-mentioned specifications has S0-20
Type electronic components (integrated circuits)
11 is turned upside down with respect to a normal mounting method, is mounted so as to be incorporated in the printed multilayer wiring board body 10, and each input / output terminal 15 of the electronic component (integrated circuit) 11 and the conductive pad 14 are soldered. is doing.

The printed multilayer wiring board body 10 is also provided.
An input / output terminal (lead frame) 12 for electrically connecting the printed multilayer wiring board body 10 to other boards is soldered to the end of the with a solder 13. When this mounting method is adopted, the electronic component (integrated circuit) 11 is soldered on the substrate of the printed multilayer wiring board body 10.
The width in the height direction from the board surface of the printed multilayer wiring board body 10 to the upper surface of the electronic component 11 when soldered in 3 can be mounted and assembled within the upper limit of 1.5 mm.

The thickness width in the height direction from the upper layer surface of the printed multilayer wiring board body 10 to the electronic component (integrated circuit) 11 mounted and assembled is lowered from the upper limit value of 3.5 mm of the conventional method to the upper limit value of 1.5 mm. By reducing the thickness, the thickness in the height direction is prevented so that the electronic component (integrated circuit) 11 mounted on the printed multilayer wiring board module does not come into contact with other portions forming a limited thickness in the height direction. It can be installed within the range of thickness width, which is limited by.

According to the present invention, the printed multilayer wiring board 10 has an S
An electronic component (integrated circuit) 11 having a 0-20 type package form was mounted so as to be incorporated into the printed multilayer wiring board body 10 in a state of being turned upside down with respect to a normal mounting method, but other than the S0-20 type. Electronic components (integrated circuits, transistors, diodes, etc.) and discrete components having a surface mount package form may be set for the same purpose.

[0017]

As described above, according to the present invention, it is possible to provide a printed multilayer wiring board module which can be mounted and mounted in a narrower area, so that the mounting efficiency is improved.

[Brief description of drawings]

FIG. 1 is a schematic view of a printed multilayer wiring board module of an embodiment of the present invention, (a) is a front view thereof, and (b) is a plan view thereof.

FIG. 2 is a schematic view of an electronic component (integrated circuit) having an S0-20 type package form, (a) is a front view thereof, and (b) is a plan view thereof.

FIG. 3 is a schematic view of a conventional printed multilayer wiring board module, (a) is a front view thereof, and (b) is a plan view thereof.

[Explanation of symbols]

 10,20 Printed wiring board main body 11,21 Integrated circuit 12,22 Input / output terminal (lead frame) 13,23 Solder 14,24 Conductive pad 15,25 Input / output terminal 16 Through hole

Claims (2)

[Claims] 1. A printed multi-layered wiring board module in which electronic components are mounted on a printed multi-layered wiring board body with conductive wiring, and an electric circuit is provided with input / output terminals, wherein the mounting provided on the printed multi-layered wiring board body. A through hole having a large outer dimension of the electronic component, a plurality of conductive pads provided at the end of the through hole on the surface of the printed multilayer wiring board body, and a body portion inserted into the through hole and extending from the body portion. An electronic component whose output terminal is connected to the conductive pad,
A printed multilayer wiring board module comprising: 2. The electronic component according to claim 1, wherein a main body portion of the electronic component is embedded and arranged in the through hole, and the input / output terminals of the electronic component extending from the main body portion are located outside one surface of the main body portion. A printed multilayer wiring board module, which is formed to extend and is connected to the conductive pad outside one surface of a main body portion.