JPS6230719B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic circuit component assembly, and particularly provides an electronic circuit component assembly using highly integrated small electronic circuit components using planar connection type circuit components such as chip-type components. This is what I am trying to do.

Conventionally, thick film hybrid integrated circuit components are typical of small electronic circuit components used in electronic circuit component assemblies. This thick film hybrid integrated circuit component is
A conductor layer on an insulating substrate such as ceramic or glass.
The resistor layer, or in some cases the dielectric layer, is formed by printing and then firing, and circuit elements that cannot be formed into a film are constructed by connecting the individual components to the substrate by soldering or the like. In addition, as a small electronic circuit component to replace this thick film type hybrid integrated circuit component,
Hybrid integrated circuit components of a type in which planar connection type individual components are mounted and connected to a rigid printed wiring board are also manufactured. The manufacturing method and structure of this type of hybrid integrated circuit component is approximately as follows. Individual flat-connection type components are mounted on a printed wiring board with copper foil conductor wiring on a rigid insulating substrate made of paper phenol, paper epoxy, glass epoxy, etc., and the components and conductor wiring are connected by soldering. Connect and get the finished product.

Furthermore, in recent years, in order to increase the degree of circuit integration and miniaturize the circuit elements of any of the above types of small electronic circuit components, double-sided wiring boards with conductor wiring formed on both sides and connected through through holes have been used to connect the circuit elements. Many devices are manufactured that have a structure in which they are installed and connected on one side or even both sides.

However, conventional double-sided hybrid integrated circuits have the advantage of being able to increase the degree of circuit integration compared to single-sided structures;
There are manufacturing and product cost problems in that extremely complicated manufacturing processes are required to mount and connect circuit elements.

In addition, since all of the conventional small electronic circuit components mentioned above are generally used by being attached to a mother wiring board, it is necessary to pull out metal lead wires as external connection terminals, and space is required to attach the metal lead wires. This is an obstacle to increasing the degree of integration and miniaturization of circuits.

For this reason, the inventors first developed an electronic circuit component structure using small electronic circuit components that is simple, inexpensive, and has a high degree of circuit integration, and designed a planar connection type circuit on one side of a flexible printed wiring board. We have proposed a configuration in which small electronic circuit components are mounted and connected to the mother wiring board, and the flexible printed wiring board is lined with a hard insulating or metal board, leaving a bent part on a part of the flexible printed wiring board. In addition, as a manufacturing method, a small electronic circuit component is bent and inserted into a mother wiring board with a slit hole, and the wiring conductor for the external connection terminal of the small electronic circuit component is soldered to the wiring conductor of the mother wiring board. proposed. However, although this electronic circuit component assembly can have a higher degree of integration than the aforementioned conventional electronic circuit component assembly, it is difficult to reduce the overall size of the circuit to less than the projected area of the circuit components on which it is mounted. However, there is a limit in terms of circuit integration.

The present invention has been made in order to solve the above-mentioned conventional problems, and its purpose is to create an electronic circuit component structure using small electronic circuit components that are simple, inexpensive, and have an extremely high degree of circuit integration. Our goal is to provide the following.

Hereinafter, one embodiment of the present invention will be described based on the drawings. FIG. 1 is a sectional view showing an example of a flexible printed wiring board used in the present invention.
An adhesive 4 is provided on the flexible printed wiring board formed with the
A through hole is provided at a connection portion with a conductor layer of a circuit board, which will be described later. As the insulating film 1,
Materials that are resistant to soldering heat, such as polyimide and heat-resistant polyester, were used. Further, although FIG. 1 shows a single-sided flexible printed wiring board, a double-sided flexible printed wiring board having through holes can also be used.

FIG. 2 is a cross-sectional view showing an example of a circuit board that also serves as a support plate used in the present invention, in which a conductor layer 6, a resistor layer 7, and a protective layer 8 of insulating glass are formed on an inorganic insulating substrate 5. This is what I did. As the insulating substrate 5, materials such as ceramic and glass were used.
The conductor layer 6, the resistor layer 7, and the protective layer 8 were all formed into films by printing and baking. The resistor layer 7 is
The resistance value was adjusted to a predetermined value by trimming. The protective layer 8 was formed at necessary portions except for the conductor layer at the connection portion with the flexible printed wiring board mentioned above. Furthermore, in addition to resistors, circuit elements such as capacitors that can be formed into films can be provided on this circuit board.

FIG. 3 is a sectional view showing an example of a flexible printed wiring board with a circuit board used in the present invention. This shows the state in which it is pasted. In FIG. 3, a part of the flexible printed wiring board is not provided with a circuit board because this part is used by being bent as will be described later.

FIG. 4 shows a solder connection part 1 after soldering a planar connection type circuit component 9 such as a chip type component.
FIG. 2 is a cross-sectional view showing a state in which 0 is provided and electrically connected, and shows a completed state of a small electronic circuit component used in the electronic circuit component assembly of the present invention. In a small electronic circuit component having such a configuration, when soldering, a part of the conductor layer 6 of the circuit board and a predetermined part of the conductor wiring 2 of the flexible printed wiring board are also electrically connected by soldering at the same time. Ru. As the circuit component 9, in addition to chip resistors and ceramic capacitors, all planar connection type components such as mini-molded transistors, diodes, ICs, and tantalum electrolytic capacitors can be used. Further, in the above-mentioned small electronic circuit component of the present invention, wiring conductors serving as external connection terminals are provided at both ends facing the bent portion (the portion where the circuit board is not provided) of the flexible printed wiring board. . (Not shown.) The small electronic circuit component used in the electronic circuit component structure of the present invention shown in FIG. , diode, I.
It is possible to mount circuit components such as C., and it is extremely easy to construct a multilayer structure of circuit elements, resulting in a dramatic degree of circuit integration compared to conventional small electronic circuit components. In addition, by exposing a part of the resistor film-formed on the circuit board, attaching a flexible printed wiring board, and adjusting the resistance value of this resistor after mounting and connecting the circuit components, Functions can be easily trimmed, allowing it to have a function that replaces a variable resistor.

FIG. 5 and FIG. 6 are diagrams for explaining the structure of the electronic circuit component assembly of the present invention and its manufacturing method. In FIG. 5, reference numeral 11 denotes a small electronic circuit component used in the present invention, which is in a state in which the bent portion of the flexible printed wiring board described above is bent in order to be inserted into and attached to the slit portion 14 provided with the mother wiring board 13. This is what is shown. In this folded state, the wiring conductor 12 that serves as an external connection terminal provided on the small electronic circuit component 11 is inserted into the slit portion 14 and is slightly exposed from the mother wiring board 13. FIG. 6 is a sectional view showing the electronic circuit component structure of the present invention, in which the wiring conductor 16 provided on the insulating laminate 15 of the mother wiring board
This figure shows a state in which the wiring conductor 2 serving as the external connection terminal of the small electronic circuit component is electrically connected by the solder connection part 17. According to the structure of the electronic circuit component assembly of the present invention shown in FIG. 6, it is possible to directly connect the small electronic circuit component and the mother wiring board by conductive wiring without requiring metal lead wires as external connection terminals. , an electronic device with a high degree of circuit integration and an extremely small size after assembly can be constructed.

As is clear from the above description, the electronic circuit component structure of the present invention has an extremely high degree of circuit integration, allows for functional trimming of the circuit, and also allows for easy attachment of small electronic circuit components to the mother wiring board. It has excellent features, and its industrial value is enormous.

[Brief explanation of the drawing]

1, 2, 3, and 4 are cross-sectional views for explaining one embodiment of a small electronic circuit component used in the electronic circuit component assembly of the present invention, and FIG. 5 and 6 are sectional views of the present invention. 1A and 1B are a perspective view and a cross-sectional view for explaining a method of manufacturing an electronic circuit component of the invention and its structure. 1... Insulating film, 2, 16... Conductor wiring, 3... Solder resist, 4... Adhesive, 5
... Insulating substrate, 6 ... Conductor layer, 7 ... Resistor layer, 8 ... Protective layer, 9 ... Circuit component, 10, 17
...Solder connection part, 11 ...Small electronic circuit component, 1
2... External connection terminal, 13, 15... Mother wiring board, 14... Slit portion.

Claims (1)

[Claims] 1 A flexible printed wiring board with circuit components mounted on one main surface, and a conductor bonded to the other main surface of the flexible printed wiring board, leaving at least a bent portion of the flexible printed wiring board. and a circuit board on which circuit elements are formed into a film, a wiring conductor of the flexible printed wiring board, an electrical connection portion that electrically connects the conductor of the circuit board formed into a film and the circuit component, and the flexible printed wiring board. A small electronic circuit component having wiring conductors serving as external connection terminals formed at opposite ends of a flexible printed wiring board with respect to the bent portion is arranged such that the opposite ends approach each other. The wiring conductor serving as the external connection terminal is electrically connected to the connection conductor layer provided on the mother wiring board. Electronic circuit component structure.