JPS6375074U - - Google Patents
Info
- Publication number
- JPS6375074U JPS6375074U JP16970786U JP16970786U JPS6375074U JP S6375074 U JPS6375074 U JP S6375074U JP 16970786 U JP16970786 U JP 16970786U JP 16970786 U JP16970786 U JP 16970786U JP S6375074 U JPS6375074 U JP S6375074U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- outer layer
- printed wiring
- circuit pattern
- long groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図ａ，ｂ及びｃは本考案の一実施例の断面
図、第２図ａないしｅは本実施例の製造過程の一
例を示す断面図、第３図及び第４図は従来の多層
印刷配線板の第１及び第２の例を示す斜視図であ
る。
１……絶縁基板、２……銅箔、２ａ，２ａ′，
２ｂ……回路パターン、３，３′……両面板、４
……〓テフロン〓テープ、５……絶縁板、６……
積層体、７……スルーホール、８……導体層、９
……長溝部、１０……多層印刷配線板、１１……
フレキシブル配線板、１２ａ，１２ｂ，１４ａ，
１４ｂ……印刷配線板、１３ａ，１３ｂ，１５ａ
，１５ｂ……回路パターン、１６……導線、１７
，１８……打込み端子。
Figures 1a, b, and c are cross-sectional views of an embodiment of the present invention, Figures 2 a to e are cross-sectional views showing an example of the manufacturing process of the present invention, and Figures 3 and 4 are cross-sectional views of a conventional multilayer It is a perspective view which shows the 1st and 2nd example of a printed wiring board. 1...Insulating substrate, 2...Copper foil, 2a, 2a',
2b...Circuit pattern, 3, 3'...Double-sided board, 4
...Teflon tape, 5...Insulating board, 6...
Laminated body, 7... Through hole, 8... Conductor layer, 9
... Long groove part, 10 ... Multilayer printed wiring board, 11 ...
Flexible wiring board, 12a, 12b, 14a,
14b...Printed wiring board, 13a, 13b, 15a
, 15b...Circuit pattern, 16...Conducting wire, 17
, 18... Drive terminal.
Claims (1)
パターンを設けて成る第１及び第２の外層材を絶
縁材を介して上下に積層した構造をもつ多層印刷
配線板において、前記第１の外層材及び前記絶縁
材を予め定めた位置で一定長だけ切除し且つ前記
第２の外層材の内側の回路パターンを前記切除し
た部分に露出するごとき長溝部を設けていること
を特徴とする多層印刷配線板。 (2) 前記長溝部に露出した前記内側の回路パタ
ーンの表面を絶縁性テープで被着してなることを
特徴とする実用新案登録請求の範囲第(1)項記載
の多層印刷配線板。[Claims for Utility Model Registration] (1) Multilayer printing having a structure in which first and second outer layer materials, which are formed by providing circuit patterns on both upper and lower surfaces of a flexible insulating substrate, are stacked one above the other with an insulating material in between. In the wiring board, the first outer layer material and the insulating material are cut out by a certain length at predetermined positions, and a long groove portion is provided such that the circuit pattern inside the second outer layer material is exposed in the cut portion. A multilayer printed wiring board characterized by: (2) The multilayer printed wiring board according to claim 1, wherein the surface of the inner circuit pattern exposed in the long groove portion is covered with an insulating tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16970786U JPS6375074U (en) | 1986-11-04 | 1986-11-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16970786U JPS6375074U (en) | 1986-11-04 | 1986-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375074U true JPS6375074U (en) | 1988-05-19 |
Family
ID=31103761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16970786U Pending JPS6375074U (en) | 1986-11-04 | 1986-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375074U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016034026A (en) * | 2013-12-12 | 2016-03-10 | 株式会社村田製作所 | Signal transmission component and electronic apparatus |
| WO2019131288A1 (en) * | 2017-12-28 | 2019-07-04 | 株式会社村田製作所 | Transmission line device |
| CN113498257A (en) * | 2020-04-08 | 2021-10-12 | 奥特斯奥地利科技与系统技术有限公司 | Partially rigid and partially flexible component carrier and method for producing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538575B2 (en) * | 1974-12-16 | 1978-03-30 | ||
| JPS58201393A (en) * | 1982-05-20 | 1983-11-24 | 松下電器産業株式会社 | Small electronic circuit part |
| JPS58216493A (en) * | 1982-06-09 | 1983-12-16 | 株式会社フジクラ | Laminated substrate for printed circuit and method of producing flexible electric circuit board using same laminated substrate |
| JPS61168990A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Printed circuit board |
-
1986
- 1986-11-04 JP JP16970786U patent/JPS6375074U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538575B2 (en) * | 1974-12-16 | 1978-03-30 | ||
| JPS58201393A (en) * | 1982-05-20 | 1983-11-24 | 松下電器産業株式会社 | Small electronic circuit part |
| JPS58216493A (en) * | 1982-06-09 | 1983-12-16 | 株式会社フジクラ | Laminated substrate for printed circuit and method of producing flexible electric circuit board using same laminated substrate |
| JPS61168990A (en) * | 1985-01-22 | 1986-07-30 | 松下電器産業株式会社 | Printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016034026A (en) * | 2013-12-12 | 2016-03-10 | 株式会社村田製作所 | Signal transmission component and electronic apparatus |
| WO2019131288A1 (en) * | 2017-12-28 | 2019-07-04 | 株式会社村田製作所 | Transmission line device |
| JPWO2019131288A1 (en) * | 2017-12-28 | 2020-02-06 | 株式会社村田製作所 | Transmission line equipment |
| US11489242B2 (en) | 2017-12-28 | 2022-11-01 | Murata Manufacturing Co., Ltd. | Transmission line device comprising a plurality of substrates each having signal and ground conductor patterns thereon that are joined to each other |
| CN113498257A (en) * | 2020-04-08 | 2021-10-12 | 奥特斯奥地利科技与系统技术有限公司 | Partially rigid and partially flexible component carrier and method for producing the same |
| JP2021168380A (en) * | 2020-04-08 | 2021-10-21 | エーティーアンドエス オーストリア テクノロジー アンド システムテクニック アクツィエンゲゼルシャフト | Failure robust bending of component carrier with rigid and flexible portions connected with rounding |
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