JPS61109169U - - Google Patents
Info
- Publication number
- JPS61109169U JPS61109169U JP1984195064U JP19506484U JPS61109169U JP S61109169 U JPS61109169 U JP S61109169U JP 1984195064 U JP1984195064 U JP 1984195064U JP 19506484 U JP19506484 U JP 19506484U JP S61109169 U JPS61109169 U JP S61109169U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- board
- wiring board
- multilayer printed
- interior
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の多層プリント配線
板の部分拡大断面図、第２図は第１図の部分の平
面図、第３図は第２図の内装板１２上の銅箔１２
ａを多層プリント配線板の表面と平行な方向に切
断した断面図である。
１０……多層プリント配線板、１１……上側プ
リント配線板、１２……内装板、１３……下側プ
リント配線板、１１ａ……上側プリント配線板上
の配線層、１２ａ，１２ｂ……内装板上の銅箔、
１２Ａ，１２Ｂ……銅箔１２ａの除去部分、１３
ａ……下側プリント配線板上の配線層、２０……
フラツトパツケージ（ＦＩＣ）、２１……ＦＩＣ
の電極端子。
1 is a partially enlarged sectional view of a multilayer printed wiring board according to an embodiment of the present invention, FIG. 2 is a plan view of the portion shown in FIG. 1, and FIG. 3 is a copper foil 12 on the interior board 12 of FIG.
FIG. 3 is a cross-sectional view taken along a direction parallel to the surface of the multilayer printed wiring board. 10... Multilayer printed wiring board, 11... Upper printed wiring board, 12... Interior board, 13... Lower printed wiring board, 11a... Wiring layer on upper printed wiring board, 12a, 12b... Interior board copper foil on top,
12A, 12B...Removed portion of copper foil 12a, 13
a... Wiring layer on the lower printed wiring board, 20...
Flat package (FIC), 21...FIC
electrode terminal.
Claims (1)
成された内装板を有する多層プリント配線板にお
いて、 該多層プリント配線板上に搭載される部品の微
小間隙電極群とプリント配線層とのハンダ付け箇
所については、内装板上の導体層が除去されてい
ることを特徴とする多層プリント配線板。[Scope of Claim for Utility Model Registration] A multilayer printed wiring board having an interior board made of a translucent material and having a conductive layer formed on its surface, a microgap electrode group of components mounted on the multilayer printed wiring board. A multilayer printed wiring board characterized in that the conductor layer on the interior board is removed at the soldering location between the board and the printed wiring layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984195064U JPH0132374Y2 (en) | 1984-12-22 | 1984-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984195064U JPH0132374Y2 (en) | 1984-12-22 | 1984-12-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61109169U true JPS61109169U (en) | 1986-07-10 |
| JPH0132374Y2 JPH0132374Y2 (en) | 1989-10-03 |
Family
ID=30752554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984195064U Expired JPH0132374Y2 (en) | 1984-12-22 | 1984-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0132374Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333898A (en) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | Manufacture of electromagnetic shielded double-sided printed circuit board |
-
1984
- 1984-12-22 JP JP1984195064U patent/JPH0132374Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6333898A (en) * | 1986-07-28 | 1988-02-13 | 新神戸電機株式会社 | Manufacture of electromagnetic shielded double-sided printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0132374Y2 (en) | 1989-10-03 |