JPH0265377U - - Google Patents
Info
- Publication number
- JPH0265377U JPH0265377U JP14415588U JP14415588U JPH0265377U JP H0265377 U JPH0265377 U JP H0265377U JP 14415588 U JP14415588 U JP 14415588U JP 14415588 U JP14415588 U JP 14415588U JP H0265377 U JPH0265377 U JP H0265377U
- Authority
- JP
- Japan
- Prior art keywords
- film
- rigid base
- base materials
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 1
Description
第１図は本考案によるプリント配線板の実施例
を示す縦断面図、第２図は従来のプリント配線板
の接続例を断面で示した図である。
１……リジツト基材、２……接着剤、３……フ
イルム、４……導体パターン、５……スルーホー
ル、６……コネクタ、７……ジヤンパ線。
FIG. 1 is a longitudinal cross-sectional view showing an embodiment of a printed wiring board according to the present invention, and FIG. 2 is a cross-sectional view showing an example of connection of a conventional printed wiring board. 1... Rigid base material, 2... Adhesive, 3... Film, 4... Conductor pattern, 5... Through hole, 6... Connector, 7... Jumper wire.
Claims (1)
銅箔付きフイルムに貼り合わせることによりリジ
ツト基材とフイルムとを一体構造とし、前記フイ
ルム上にパターン形成を行なうことにより複数枚
のリジツト基材間の電気的接続を行なうことを特
徴とするプリント配線板の接続構造。 By bonding one side of a plurality of rigid base materials to a film with copper foil via an adhesive, the rigid base material and the film are made into an integral structure, and by forming a pattern on the film, a plurality of rigid base materials can be formed. A connection structure for a printed wiring board characterized by making an electrical connection between the two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14415588U JPH0265377U (en) | 1988-11-04 | 1988-11-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14415588U JPH0265377U (en) | 1988-11-04 | 1988-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265377U true JPH0265377U (en) | 1990-05-16 |
Family
ID=31411610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14415588U Pending JPH0265377U (en) | 1988-11-04 | 1988-11-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265377U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02129762U (en) * | 1989-03-30 | 1990-10-25 |
-
1988
- 1988-11-04 JP JP14415588U patent/JPH0265377U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02129762U (en) * | 1989-03-30 | 1990-10-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0265377U (en) | ||
| JPS6416686U (en) | ||
| JPS62126863U (en) | ||
| JPH028080U (en) | ||
| JPH0288270U (en) | ||
| JPS6276562U (en) | ||
| JPS6440880U (en) | ||
| JPH02122479U (en) | ||
| JPS61161969U (en) | ||
| JPH0165179U (en) | ||
| JPH01174963U (en) | ||
| JPS61173177U (en) | ||
| JPH0241474U (en) | ||
| JPS6289160U (en) | ||
| JPH01150378U (en) | ||
| JPS6262466U (en) | ||
| JPS585376U (en) | double-sided printed wiring board | |
| JPS58103477U (en) | Printed circuit board connection device | |
| JPH0180972U (en) | ||
| JPS62204373U (en) | ||
| JPS6212979U (en) | ||
| JPS6049669U (en) | Connection structure of chip carrier type package | |
| JPS6214683U (en) | ||
| JPS61153371U (en) | ||
| JPH0298672U (en) |