JPS6276562U - - Google Patents
Info
- Publication number
- JPS6276562U JPS6276562U JP16809585U JP16809585U JPS6276562U JP S6276562 U JPS6276562 U JP S6276562U JP 16809585 U JP16809585 U JP 16809585U JP 16809585 U JP16809585 U JP 16809585U JP S6276562 U JPS6276562 U JP S6276562U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- copper foil
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の第１実施例を示す要部平面図
、第２図は同断面図、第３図は本考案の第２実施
例を示す要部断面図、第４図は第３実施例を示す
要部平面図、第５図は従来例を示す断面図である
。
１１…端子用銅箔ランド、１２…フレキシブル
プリント基板、１３…接続用銅箔ランド、１４…
接続用フレキシブルプリント基板、１５…接着剤
層、１６…隙間、１７…硬質基材、１８…銅箔、
１９…切り込み。
Fig. 1 is a plan view of the main part showing the first embodiment of the present invention, Fig. 2 is a sectional view of the same, Fig. 3 is a sectional view of the main part showing the second embodiment of the invention, and Fig. 4 is the main part of the main part showing the second embodiment of the invention. FIG. 5 is a plan view of the main parts showing the embodiment, and a sectional view showing the conventional example. 11... Copper foil land for terminal, 12... Flexible printed circuit board, 13... Copper foil land for connection, 14...
Flexible printed circuit board for connection, 15...Adhesive layer, 16...Gap, 17...Hard base material, 18...Copper foil,
19...notch.
Claims (1)
子用銅箔ランドと、フレキシブルプリント基板の
前記銅箔面と逆の面に接着剤層を介して貼り合わ
された硬質基材と、前記接着剤層を一部廃してフ
レキシブルプリント基板と硬質基材との間に設け
た隙間と、この隙間に差し込まれる接続用フレキ
シブルプリント基板と、この接続用フレキシブル
プリント基板上に前記端子用銅箔ランドと相対向
するよう配した接続用銅箔ランドを備え、前記端
子用銅箔ランドと接続用銅箔ランドを半田付した
フレキシブルプリント基板の接続構造。 A copper foil land for a terminal arranged on an end of a flexible printed circuit board, a hard base material bonded to a surface opposite to the copper foil surface of the flexible printed circuit board via an adhesive layer, and the adhesive layer are bonded together. A gap is formed between the flexible printed circuit board and the hard base material, a flexible printed circuit board for connection is inserted into this gap, and a flexible printed circuit board for connection is placed on the flexible printed circuit board for connection so as to face oppositely to the copper foil land for the terminal. A connection structure of a flexible printed circuit board, which is provided with a copper foil land for connection and soldered to the copper foil land for the terminal and the copper foil land for connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16809585U JPS6276562U (en) | 1985-10-30 | 1985-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16809585U JPS6276562U (en) | 1985-10-30 | 1985-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6276562U true JPS6276562U (en) | 1987-05-16 |
Family
ID=31100651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16809585U Pending JPS6276562U (en) | 1985-10-30 | 1985-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6276562U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014220023A (en) * | 2013-05-07 | 2014-11-20 | 住友電工プリントサーキット株式会社 | Hard disk device printed circuit board and hard disk device |
-
1985
- 1985-10-30 JP JP16809585U patent/JPS6276562U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014220023A (en) * | 2013-05-07 | 2014-11-20 | 住友電工プリントサーキット株式会社 | Hard disk device printed circuit board and hard disk device |
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