JPS60103871U - Printed circuit board pattern or resist structure - Google Patents
Printed circuit board pattern or resist structureInfo
- Publication number
- JPS60103871U JPS60103871U JP19576783U JP19576783U JPS60103871U JP S60103871 U JPS60103871 U JP S60103871U JP 19576783 U JP19576783 U JP 19576783U JP 19576783 U JP19576783 U JP 19576783U JP S60103871 U JPS60103871 U JP S60103871U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board pattern
- resist structure
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａおよびｂは従来の構造を示す平面図および側面
図、第２図ａおよびｂはこの考案による構造を示す平面
図および側面図、第３図から第７因はこの考案による構
造の他の実施例を示すそれぞれ平面図である。
なお図において、１０・・・導電性本体、１１ａ。
１１ｂ・・・半田部材、１２・・・間隙部分、１３・・
・リード線、１４・・・小孔、１５．１６・・・切欠き
部である。Figures 1 a and b are plan and side views showing the conventional structure, Figures 2 a and b are plan views and side views showing the structure according to this invention, and Figures 3 to 7 show the structure according to this invention. FIG. 6 is a plan view showing other embodiments. In addition, in the figure, 10... conductive main body, 11a. 11b...Solder member, 12...Gap portion, 13...
-Lead wire, 14...small hole, 15.16...notch.
Claims (3)
線等を連結し得る半田部材が付着され、この半田部材が
間隙部分を介して少なくとも２ケ所に付着されて成るプ
リント基板のパターンまたはレジスト構造。(1) A printed circuit board pattern or resist in which a solder member to which a lead wire or the like can be connected is attached to a conductive body formed of a conductive material, and the solder member is attached to at least two locations through a gap. structure.
設され、この孔を囲むように前記半田部材の１ケ所が付
着されて成る実用新案登録請求の範囲第１項記載のプリ
ント基板のパターンまたはレジスト構造。(2) A print according to claim 1, wherein the conductive body has a hole through which a lead wire or the like can be inserted, and the solder member is attached at one place to surround the hole. Substrate pattern or resist structure.
切欠き部が形成されて成る実用新案登録請求の範囲第１
項記載のプリント基板のパターンまたはレジスト構造。(3) Utility model registration claim 1, in which the conductive body is formed with a notch for positioning a lead wire, etc.
Printed circuit board pattern or resist structure as described in section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576783U JPS60103871U (en) | 1983-12-20 | 1983-12-20 | Printed circuit board pattern or resist structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19576783U JPS60103871U (en) | 1983-12-20 | 1983-12-20 | Printed circuit board pattern or resist structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60103871U true JPS60103871U (en) | 1985-07-15 |
Family
ID=30420308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19576783U Pending JPS60103871U (en) | 1983-12-20 | 1983-12-20 | Printed circuit board pattern or resist structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60103871U (en) |
-
1983
- 1983-12-20 JP JP19576783U patent/JPS60103871U/en active Pending
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