JPS58124983U - Printed board - Google Patents

Printed board

Info

Publication number
JPS58124983U
JPS58124983U JP2198182U JP2198182U JPS58124983U JP S58124983 U JPS58124983 U JP S58124983U JP 2198182 U JP2198182 U JP 2198182U JP 2198182 U JP2198182 U JP 2198182U JP S58124983 U JPS58124983 U JP S58124983U
Authority
JP
Japan
Prior art keywords
printed board
hole
solder
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2198182U
Other languages
Japanese (ja)
Inventor
尾崎 茂男
Original Assignee
クラリオン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クラリオン株式会社 filed Critical クラリオン株式会社
Priority to JP2198182U priority Critical patent/JPS58124983U/en
Publication of JPS58124983U publication Critical patent/JPS58124983U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a、 bおよび第2図a、  bは各々従来およ
び本考案実施例を示す平面図および断面図である。 2・・・導電パターン、4・・・孔、5・・・部品、6
・・・リード、7・・・半田、8・・・半田拡がり防止
用レジスト。
FIGS. 1A and 1B and FIGS. 2A and 2B are a plan view and a sectional view respectively showing the conventional and the embodiments of the present invention. 2... Conductive pattern, 4... Hole, 5... Part, 6
...Lead, 7...Solder, 8...Resist for preventing solder spread.

Claims (1)

【実用新案登録請求の範囲】 ■ 実装すべき部品のリードを挿入するための孔が設け
られた導電パ)−ン上の上記孔の周囲に半田拡がり防止
用レジストが設けられてなることを特徴とするプリント
基板。 2 上記半田拡がり防止用レジストが帯状からなること
を特徴とする実用新案登録請求の範囲第1項記載のプリ
ント基板。
[Claims for Utility Model Registration] ■ Features: A resist for preventing the spread of solder is provided around the hole on a conductive pattern provided with a hole for inserting the lead of a component to be mounted. printed circuit board. 2. The printed circuit board according to claim 1, wherein the solder spread prevention resist is strip-shaped.
JP2198182U 1982-02-18 1982-02-18 Printed board Pending JPS58124983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2198182U JPS58124983U (en) 1982-02-18 1982-02-18 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2198182U JPS58124983U (en) 1982-02-18 1982-02-18 Printed board

Publications (1)

Publication Number Publication Date
JPS58124983U true JPS58124983U (en) 1983-08-25

Family

ID=30034083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2198182U Pending JPS58124983U (en) 1982-02-18 1982-02-18 Printed board

Country Status (1)

Country Link
JP (1) JPS58124983U (en)

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