JPS58164267U - Land structure on printed circuit board - Google Patents
Land structure on printed circuit boardInfo
- Publication number
- JPS58164267U JPS58164267U JP6051282U JP6051282U JPS58164267U JP S58164267 U JPS58164267 U JP S58164267U JP 6051282 U JP6051282 U JP 6051282U JP 6051282 U JP6051282 U JP 6051282U JP S58164267 U JPS58164267 U JP S58164267U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- land structure
- solder resist
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント基板の部分平面図、第２図はそ
のプリント基板に半田付けをした状態を示す第１図にお
ける矢視Ａ−Ａ線に沿って切断した断面図、第３図は本
考案に係わるプリント基板の部分平面図、第４図はその
プリント基板に半田付けした状態を示す第３図における
矢視Ｂ−Ｂ線゛ に沿って切断した断面図である。
１・・・プリント基板、２・・・銅箔、３．３’・・・
ソルダーレジスト、４・・・大きなランド、４ａ〜４ｅ
・・・小さなランド、５．５ａ〜５Ｃ・・・半田、６・
・・ホール。Fig. 1 is a partial plan view of a conventional printed circuit board, Fig. 2 is a sectional view taken along the arrow A-A line in Fig. 1, showing the soldered state of the printed circuit board, and Fig. 3 is a partial plan view of a conventional printed circuit board. FIG. 4 is a partial plan view of the printed circuit board according to the present invention, and is a sectional view taken along the line B--B in FIG. 3, showing the printed circuit board in a soldered state. 1... Printed circuit board, 2... Copper foil, 3.3'...
Solder resist, 4...Large land, 4a to 4e
...Small land, 5.5a~5C...Solder, 6.
··hole.
Claims (1)
グして形成される比較的大きなランドをさらにソルダー
レジストにより縞模様状や水玉模様状等のパターンで各
々独立した穫数の小さなランドに分割したことを特徴と
するプリント基板におけるランド構造。It is characterized by a relatively large land formed by coating the copper foil surface of a printed circuit board with solder resist, which is further divided into independent small lands in patterns such as stripes and polka dots using solder resist. Land structure on a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6051282U JPS58164267U (en) | 1982-04-27 | 1982-04-27 | Land structure on printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6051282U JPS58164267U (en) | 1982-04-27 | 1982-04-27 | Land structure on printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58164267U true JPS58164267U (en) | 1983-11-01 |
Family
ID=30070758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6051282U Pending JPS58164267U (en) | 1982-04-27 | 1982-04-27 | Land structure on printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58164267U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031558U (en) * | 1989-05-26 | 1991-01-09 | ||
| US10897809B2 (en) | 2016-12-16 | 2021-01-19 | Mitsubishi Electric Corporation | Printed circuit board, air conditioner, and method for manufacturing printed circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4832864B1 (en) * | 1972-06-29 | 1973-10-09 |
-
1982
- 1982-04-27 JP JP6051282U patent/JPS58164267U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4832864B1 (en) * | 1972-06-29 | 1973-10-09 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH031558U (en) * | 1989-05-26 | 1991-01-09 | ||
| US10897809B2 (en) | 2016-12-16 | 2021-01-19 | Mitsubishi Electric Corporation | Printed circuit board, air conditioner, and method for manufacturing printed circuit board |
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