JPS58191669U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58191669U JPS58191669U JP8897982U JP8897982U JPS58191669U JP S58191669 U JPS58191669 U JP S58191669U JP 8897982 U JP8897982 U JP 8897982U JP 8897982 U JP8897982 U JP 8897982U JP S58191669 U JPS58191669 U JP S58191669U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- pitch
- circuit patterns
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の回路パターン主要部の拡大平面図。第
２図ア第４図は本考案実施例の回路パターン主要部の拡
大平面図。
符号、ＩＡ、 ＩＢ、 １１Ａ、 １１Ｂ−・・
・・・スルーホール、２Ａ、 ２Ｂ、 １２Ａ、
１２Ｂ−−−−−−回路パターン、３Ａ、 ３Ｂ、
１３Ａ、 １３Ｂ−・・・・・ランド、４・・・・
・・（回路パターンとランド間の）間隙、５・・・・・
・（回路パターン間の）間隙、６−・・・・・ソルダー
レジスト。
／′３８
第２図−
１２Ａ ７２ＢFIG. 1 is an enlarged plan view of the main part of a conventional circuit pattern. FIG. 2A and FIG. 4 are enlarged plan views of the main parts of the circuit pattern according to the embodiment of the present invention. Code, IA, IB, 11A, 11B-...
...Through hole, 2A, 2B, 12A,
12B------Circuit pattern, 3A, 3B,
13A, 13B-...Land, 4...
...Gap (between circuit pattern and land), 5...
- Gaps (between circuit patterns), 6-...Solder resist. /'38 Figure 2 - 12A 72B
Claims (2)
ンド付きスルーホールの間に回路パターンを２本配設す
る印刷配線板において前記回路パターンピッチを２．５
４ｍピッチの１ ／ ５ （０−５０８ｎｕｔピッチ）
未満にしたことを特徴とする印刷配線板。(1) 2.54 xm--In a printed wiring board in which two circuit patterns are arranged between adjacent through holes with lands at a pitch interval, the circuit pattern pitch is 2.5
1/5 of 4m pitch (0-508nut pitch)
A printed wiring board characterized by having a
の外径を拡大したことを特徴とする実用新案登録請求の
範囲第１項記載の印刷配線板。 第１図 ２．５４ ３Ａ （− 題(2) The printed wiring board according to claim 1, wherein the outer diameter of the through hole adjacent to the two circuit patterns is enlarged. Figure 1 2.54 3A (- title
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8897982U JPS58191669U (en) | 1982-06-15 | 1982-06-15 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8897982U JPS58191669U (en) | 1982-06-15 | 1982-06-15 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58191669U true JPS58191669U (en) | 1983-12-20 |
Family
ID=30097627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8897982U Pending JPS58191669U (en) | 1982-06-15 | 1982-06-15 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58191669U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6149492A (en) * | 1984-08-17 | 1986-03-11 | 旭化成株式会社 | Printed thick film fine pattern conductor |
-
1982
- 1982-06-15 JP JP8897982U patent/JPS58191669U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6149492A (en) * | 1984-08-17 | 1986-03-11 | 旭化成株式会社 | Printed thick film fine pattern conductor |
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