JPS6127366U - Printed wiring board for backboard - Google Patents

Printed wiring board for backboard

Info

Publication number
JPS6127366U
JPS6127366U JP11174684U JP11174684U JPS6127366U JP S6127366 U JPS6127366 U JP S6127366U JP 11174684 U JP11174684 U JP 11174684U JP 11174684 U JP11174684 U JP 11174684U JP S6127366 U JPS6127366 U JP S6127366U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
backboard
pad
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11174684U
Other languages
Japanese (ja)
Inventor
藤彦 熊谷
英也 佐藤
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP11174684U priority Critical patent/JPS6127366U/en
Publication of JPS6127366U publication Critical patent/JPS6127366U/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はバックボード用プリント配線板の平面図、第２
図は従来の一＼ツクボード用プリント配線板上のパッド
と銅箔パターンの接続構成図、第３図はパターン焼付け
後のパッド位置ずれの一例を示す構成図、第４図はスル
ーホール穴明け後のスルーホール位置ずれの一例の構成
図、第５図は本考案におけるバツクボード用プリント配
線板上のパッドと銅箔パターンの接続の一実施例の構成
図である。 ′１・・一バックボード用プリント配線板、２・・・パ
ッド、３・・叱銅箔パターン１、４・・・スルーホール
、５・・・銅箔パターン２。Figure 1 is a plan view of the printed wiring board for the backboard, Figure 2
The figure shows a connection configuration diagram between pads and copper foil patterns on a conventional printed wiring board for a board, Figure 3 is a configuration diagram showing an example of pad position shift after pattern baking, and Figure 4 shows a diagram after drilling through-holes. FIG. 5 is a diagram illustrating an example of a through-hole misalignment according to the present invention, and FIG. '1...1 printed wiring board for backboard, 2... Pad, 3... Copper foil pattern 1, 4... Through hole, 5... Copper foil pattern 2.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] バンクボード用プリント配線板において、パッドに接続
する銅箔パターンの接続信頼性を上げるために、パッド
付近の銅箔パターン寸法巾を２一倍以上、およびパッド
寸法巾をも広げることを特徴とするバツクボード用プリ
ント配線板。In a printed wiring board for a bank board, in order to increase the connection reliability of the copper foil pattern connected to the pad, the dimensional width of the copper foil pattern near the pad is increased by at least 21 times, and the dimensional width of the pad is also expanded. Printed wiring board for backboard.
JP11174684U 1984-07-25 1984-07-25 Printed wiring board for backboard Pending JPS6127366U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11174684U JPS6127366U (en) 1984-07-25 1984-07-25 Printed wiring board for backboard

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11174684U JPS6127366U (en) 1984-07-25 1984-07-25 Printed wiring board for backboard

Publications (1)

Publication Number Publication Date
JPS6127366U true JPS6127366U (en) 1986-02-18

Family

ID=30670820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11174684U Pending JPS6127366U (en) 1984-07-25 1984-07-25 Printed wiring board for backboard

Country Status (1)

Country Link
JP (1) JPS6127366U (en)

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