JPS60194365U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS60194365U JPS60194365U JP8190784U JP8190784U JPS60194365U JP S60194365 U JPS60194365 U JP S60194365U JP 8190784 U JP8190784 U JP 8190784U JP 8190784 U JP8190784 U JP 8190784U JP S60194365 U JPS60194365 U JP S60194365U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- round
- diameter
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は回路部品の配線図、第２図および第３図は配線
パターンとラウンドとの接続状態の従来例を示す平面図
、第４図は本考案によるプリント配線基板の原理を説明
する説明図、第５図は本考案によるプリント配線基板の
配線パターンとラウンドとの接続状態を示す平面図であ
る。
３．５・・・ラウンド、４・・・配線パターン。 。Fig. 1 is a wiring diagram of circuit components, Figs. 2 and 3 are plan views showing conventional examples of connections between wiring patterns and rounds, and Fig. 4 is an explanation explaining the principle of the printed wiring board according to the present invention. FIG. 5 is a plan view showing the state of connection between the wiring pattern and the round of the printed wiring board according to the present invention. 3.5...Round, 4...Wiring pattern. .
Claims (1)
とを備えたプリント配線基板において、前記ラウンドが
大径のラウンドとこの大径のラウンドに一部が重なる小
径のラウンドとから成り、この小径のラウンドを介して
前記配線パターンと大径のパターンとが接続されること
を特徴とするプリント配線基板。In a printed wiring board having a wiring pattern and a round coupled to the wiring pattern, the round is composed of a large-diameter round and a small-diameter round that partially overlaps the large-diameter round, and the small-diameter round is A printed wiring board, characterized in that the wiring pattern and the large-diameter pattern are connected through the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8190784U JPS60194365U (en) | 1984-06-04 | 1984-06-04 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8190784U JPS60194365U (en) | 1984-06-04 | 1984-06-04 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60194365U true JPS60194365U (en) | 1985-12-24 |
Family
ID=30629134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8190784U Pending JPS60194365U (en) | 1984-06-04 | 1984-06-04 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60194365U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02268483A (en) * | 1989-04-11 | 1990-11-02 | Hitachi Ltd | Printed wiring board |
-
1984
- 1984-06-04 JP JP8190784U patent/JPS60194365U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02268483A (en) * | 1989-04-11 | 1990-11-02 | Hitachi Ltd | Printed wiring board |
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