JPS60172362U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS60172362U
JPS60172362U JP6017384U JP6017384U JPS60172362U JP S60172362 U JPS60172362 U JP S60172362U JP 6017384 U JP6017384 U JP 6017384U JP 6017384 U JP6017384 U JP 6017384U JP S60172362 U JPS60172362 U JP S60172362U
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
board
land
lands
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6017384U
Other languages
Japanese (ja)
Inventor
小沢 佳司
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP6017384U priority Critical patent/JPS60172362U/en
Publication of JPS60172362U publication Critical patent/JPS60172362U/en
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の多層印刷配線板の説明図、第2図は本考
案の一実施例に係る多層印刷配線板の説明図、第3図は
本考案の他の実施例に係る多層印刷配線板の説明図であ
る。 2a、2b・・・接続用ランド、3.8at  sb−
回路パターン、4・・・部品、5・・・リード、6λ、
6b−・・部品用ランド、11a、  11bt  1
2a、  12b・・・部品予備用ランド、13a、1
3b・・・印刷マーク。
FIG. 1 is an explanatory diagram of a conventional multilayer printed wiring board, FIG. 2 is an explanatory diagram of a multilayer printed wiring board according to an embodiment of the present invention, and FIG. 3 is an explanatory diagram of a multilayer printed wiring board according to another embodiment of the present invention. It is an explanatory view of a board. 2a, 2b...Connection land, 3.8at sb-
Circuit pattern, 4... Component, 5... Lead, 6λ,
6b--Land for parts, 11a, 11bt 1
2a, 12b... parts spare land, 13a, 1
3b...Print mark.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線基板と、この基板に設けられた部品用ランドと
、同基板に設けられた前記ランドに接続する回路パター
ンと、同基板に前記ランドと近接して設けられた部品予
備用ランドを具備し、部品□   用ランドと部品予備
用ランドとを識別できる手段を有することを特徴とする
印刷配線板。
A printed wiring board, a component land provided on the board, a circuit pattern connected to the land provided on the board, and a component spare land provided on the board adjacent to the land. , a printed wiring board characterized by having means for distinguishing lands for parts and lands for spare parts.
JP6017384U 1984-04-24 1984-04-24 printed wiring board Pending JPS60172362U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6017384U JPS60172362U (en) 1984-04-24 1984-04-24 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6017384U JPS60172362U (en) 1984-04-24 1984-04-24 printed wiring board

Publications (1)

Publication Number Publication Date
JPS60172362U true JPS60172362U (en) 1985-11-15

Family

ID=30587275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6017384U Pending JPS60172362U (en) 1984-04-24 1984-04-24 printed wiring board

Country Status (1)

Country Link
JP (1) JPS60172362U (en)

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