JPS5851470U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5851470U
JPS5851470U JP14609681U JP14609681U JPS5851470U JP S5851470 U JPS5851470 U JP S5851470U JP 14609681 U JP14609681 U JP 14609681U JP 14609681 U JP14609681 U JP 14609681U JP S5851470 U JPS5851470 U JP S5851470U
Authority
JP
Japan
Prior art keywords
printed board
circuit board
printed circuit
abstract
copper foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14609681U
Other languages
Japanese (ja)
Inventor
永井 典雄
Original Assignee
株式会社日立製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立製作所 filed Critical 株式会社日立製作所
Priority to JP14609681U priority Critical patent/JPS5851470U/en
Publication of JPS5851470U publication Critical patent/JPS5851470U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は銅箔面及び抜型を共用した本考案の実
施例を示すプリント基板の平面図である。 1.4・・・未使用穴、2,3・・・部品挿入穴、5・
・・レジスト印刷のない部分、6・・・レジスト印刷。
1 and 2 are plan views of a printed circuit board showing an embodiment of the present invention in which a copper foil surface and a cutting die are shared. 1.4...Unused hole, 2,3...Component insertion hole, 5.
... Area without resist printing, 6... Resist printing.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント基板の部品を挿入しない大群の銅箔面にレジス
ト印刷することを特徴とするプリント基板。
A printed circuit board characterized by resist printing on a large copper foil surface without inserting printed circuit board components.
JP14609681U 1981-10-02 1981-10-02 Printed board Pending JPS5851470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14609681U JPS5851470U (en) 1981-10-02 1981-10-02 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14609681U JPS5851470U (en) 1981-10-02 1981-10-02 Printed board

Publications (1)

Publication Number Publication Date
JPS5851470U true JPS5851470U (en) 1983-04-07

Family

ID=29939010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14609681U Pending JPS5851470U (en) 1981-10-02 1981-10-02 Printed board

Country Status (1)

Country Link
JP (1) JPS5851470U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311251A (en) * 2007-06-12 2008-12-25 Shihen Tech Corp Printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008311251A (en) * 2007-06-12 2008-12-25 Shihen Tech Corp Printed circuit board

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