JPS58140663U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS58140663U
JPS58140663U JP3840982U JP3840982U JPS58140663U JP S58140663 U JPS58140663 U JP S58140663U JP 3840982 U JP3840982 U JP 3840982U JP 3840982 U JP3840982 U JP 3840982U JP S58140663 U JPS58140663 U JP S58140663U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
hole
small
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3840982U
Other languages
Japanese (ja)
Inventor
潔 山田
忠 松本
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP3840982U priority Critical patent/JPS58140663U/en
Publication of JPS58140663U publication Critical patent/JPS58140663U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の印刷配線板における一実施例の斜視図
、第2図、第3図は他の実施例の正面図、第4図は同印
刷配線板の説明図である。 1・・・・・・基板、2・・・・・・透孔、3・・・・
・・小基板、4・・・・・・小孔、5・・・・・・ドラ
イバー。
FIG. 1 is a perspective view of one embodiment of the printed wiring board of the present invention, FIGS. 2 and 3 are front views of other embodiments, and FIG. 4 is an explanatory diagram of the same printed wiring board. 1...Substrate, 2...Through hole, 3...
...Small board, 4...Small hole, 5...Driver.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に形成された透孔にこの透孔を形成する際に打抜か
れる小基板を挿入し、この小基板に上記小基板を上記透
孔より取出しやすくするための小孔を形成して成る印刷
配線板。
A printing method in which a small substrate punched out when forming the through hole is inserted into a through hole formed in a substrate, and a small hole is formed in the small substrate to make it easier to take out the small substrate from the through hole. wiring board.
JP3840982U 1982-03-17 1982-03-17 printed wiring board Pending JPS58140663U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3840982U JPS58140663U (en) 1982-03-17 1982-03-17 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3840982U JPS58140663U (en) 1982-03-17 1982-03-17 printed wiring board

Publications (1)

Publication Number Publication Date
JPS58140663U true JPS58140663U (en) 1983-09-21

Family

ID=30049751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3840982U Pending JPS58140663U (en) 1982-03-17 1982-03-17 printed wiring board

Country Status (1)

Country Link
JP (1) JPS58140663U (en)

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