JPS5877076U - Printed board - Google Patents

Printed board

Info

Publication number
JPS5877076U
JPS5877076U JP17221881U JP17221881U JPS5877076U JP S5877076 U JPS5877076 U JP S5877076U JP 17221881 U JP17221881 U JP 17221881U JP 17221881 U JP17221881 U JP 17221881U JP S5877076 U JPS5877076 U JP S5877076U
Authority
JP
Japan
Prior art keywords
printed board
recess
conductive layer
mounting part
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17221881U
Other languages
Japanese (ja)
Inventor
章 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP17221881U priority Critical patent/JPS5877076U/en
Publication of JPS5877076U publication Critical patent/JPS5877076U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のプリント基板の切断正面図、第2図は部
品の正面図、第3図はこの考案のプリント基板の1実施
例の切断正面図である。
FIG. 1 is a cutaway front view of a conventional printed circuit board, FIG. 2 is a front view of parts, and FIG. 3 is a cutaway front view of an embodiment of the printed circuit board of this invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 板体の導電層の形成された面側に手話により凹部を形成
し、前記凹部に取付部品を嵌入し、前記取付部品の導電
部を前記導電層に半田付けしたプリント基板。
A printed circuit board in which a recess is formed in a sign language on the side of a plate on which a conductive layer is formed, a mounting part is fitted into the recess, and a conductive part of the mounting part is soldered to the conductive layer.
JP17221881U 1981-11-19 1981-11-19 Printed board Pending JPS5877076U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17221881U JPS5877076U (en) 1981-11-19 1981-11-19 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17221881U JPS5877076U (en) 1981-11-19 1981-11-19 Printed board

Publications (1)

Publication Number Publication Date
JPS5877076U true JPS5877076U (en) 1983-05-24

Family

ID=29964122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17221881U Pending JPS5877076U (en) 1981-11-19 1981-11-19 Printed board

Country Status (1)

Country Link
JP (1) JPS5877076U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395814A (en) * 1989-09-08 1991-04-22 Hitachi Ltd Fixing device for surface-mounted DIP switch

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0395814A (en) * 1989-09-08 1991-04-22 Hitachi Ltd Fixing device for surface-mounted DIP switch

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