JPS59112972U - multilayer printed board - Google Patents

multilayer printed board

Info

Publication number
JPS59112972U
JPS59112972U JP19624583U JP19624583U JPS59112972U JP S59112972 U JPS59112972 U JP S59112972U JP 19624583 U JP19624583 U JP 19624583U JP 19624583 U JP19624583 U JP 19624583U JP S59112972 U JPS59112972 U JP S59112972U
Authority
JP
Japan
Prior art keywords
printed board
multilayer printed
land
wiring pattern
outer diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19624583U
Other languages
Japanese (ja)
Inventor
城月 恒雄
中村 繁雄
横沢 道夫
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP19624583U priority Critical patent/JPS59112972U/en
Publication of JPS59112972U publication Critical patent/JPS59112972U/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本考案に係る多層プリント板中間層の部分平面図
である。 1・・・スルーホール、2.3・・・ランド、4・・・
配線パターン。
The drawing is a partial plan view of an intermediate layer of a multilayer printed board according to the present invention. 1...Through hole, 2.3...Land, 4...
wiring pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基本格子点上にスルーホールを有する多層プリント板の
中間層において、配線パターンに接続しないダミーラン
ドを設け、該ダミーランド外径寸法を配線パターンに接
続するスルーホールのランド外径寸法より小さくしたこ
とを特徴とする多層プリント板。
In the intermediate layer of a multilayer printed board having through holes on basic lattice points, a dummy land not connected to the wiring pattern is provided, and the outer diameter of the dummy land is smaller than the outer diameter of the land of the through hole connected to the wiring pattern. A multilayer printed board featuring
JP19624583U 1983-12-22 1983-12-22 multilayer printed board Pending JPS59112972U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19624583U JPS59112972U (en) 1983-12-22 1983-12-22 multilayer printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19624583U JPS59112972U (en) 1983-12-22 1983-12-22 multilayer printed board

Publications (1)

Publication Number Publication Date
JPS59112972U true JPS59112972U (en) 1984-07-30

Family

ID=30421148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19624583U Pending JPS59112972U (en) 1983-12-22 1983-12-22 multilayer printed board

Country Status (1)

Country Link
JP (1) JPS59112972U (en)

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