JPS5887380U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5887380U
JPS5887380U JP18411781U JP18411781U JPS5887380U JP S5887380 U JPS5887380 U JP S5887380U JP 18411781 U JP18411781 U JP 18411781U JP 18411781 U JP18411781 U JP 18411781U JP S5887380 U JPS5887380 U JP S5887380U
Authority
JP
Japan
Prior art keywords
printed wiring
copper foil
wiring board
board
annular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18411781U
Other languages
Japanese (ja)
Inventor
啓 松本
大濱　泰造
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP18411781U priority Critical patent/JPS5887380U/en
Publication of JPS5887380U publication Critical patent/JPS5887380U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図は製造工程における従来の印刷配線板を
示し、アはそれぞれ平面図、イはそれぞれ断面図、第３
図は本考案の一実施例の印刷配線板を示し、アは平面図
、イはその断面図である。 １・・・基板、２・・・銅箔パターン、３・・・ランド
部、４・・・樹脂層、５・・・環状銅箔部。Figures 1 and 2 show conventional printed wiring boards in the manufacturing process, where A is a plan view, B is a cross-sectional view, and Figure 3 is a cross-sectional view.
The figures show a printed wiring board according to an embodiment of the present invention, in which A is a plan view and B is a sectional view thereof. DESCRIPTION OF SYMBOLS 1... Board, 2... Copper foil pattern, 3... Land part, 4... Resin layer, 5... Annular copper foil part.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 銅箔パターンのランド部のまわりに一定距離を隔てて環
状銅箔部を形成し、この環状銅箔部の環内部を除く基板
および銅箔パターンの表面に保護用の樹脂層を形成した
ことを特徴とする印刷配線板。　・An annular copper foil part is formed at a certain distance around the land part of the copper foil pattern, and a protective resin layer is formed on the surface of the board and copper foil pattern except for the inside of the annular copper foil part. Characteristic printed wiring board.・
JP18411781U 1981-12-09 1981-12-09 printed wiring board Pending JPS5887380U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18411781U JPS5887380U (en) 1981-12-09 1981-12-09 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18411781U JPS5887380U (en) 1981-12-09 1981-12-09 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5887380U true JPS5887380U (en) 1983-06-14

Family

ID=29983995

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18411781U Pending JPS5887380U (en) 1981-12-09 1981-12-09 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5887380U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103587A (en) * 2005-10-03 2007-04-19 Nitto Denko Corp Wiring circuit board and method of manufacturing same
JP2023544920A (en) * 2021-09-08 2023-10-26 ティーシーエル チャイナスター オプトエレクトロニクス テクノロジー カンパニー リミテッド Light emitting substrate and its manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007103587A (en) * 2005-10-03 2007-04-19 Nitto Denko Corp Wiring circuit board and method of manufacturing same
JP2023544920A (en) * 2021-09-08 2023-10-26 ティーシーエル チャイナスター オプトエレクトロニクス テクノロジー カンパニー リミテッド Light emitting substrate and its manufacturing method

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