JPS5811273U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5811273U
JPS5811273U JP10487181U JP10487181U JPS5811273U JP S5811273 U JPS5811273 U JP S5811273U JP 10487181 U JP10487181 U JP 10487181U JP 10487181 U JP10487181 U JP 10487181U JP S5811273 U JPS5811273 U JP S5811273U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
chip
electronic component
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10487181U
Other languages
Japanese (ja)
Inventor
一博 松本
三桝 義高
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP10487181U priority Critical patent/JPS5811273U/en
Publication of JPS5811273U publication Critical patent/JPS5811273U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図は従来の印刷配線板を示す要部の上面図
、第3図、第4図は本考案の印刷配線板の実施例を示す
要部の上面図である。
1 and 2 are top views of the main parts of a conventional printed wiring board, and FIGS. 3 and 4 are top views of the main parts of an embodiment of the printed wiring board of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁基板に導電パターン、ソルダーレジスト層を設け、
チップ形電子部品を組込む印刷配線板において、上記チ
ップ形電子部品を組込む個所にその位置を示すH形マー
クを設けてなる印刷配線板。
A conductive pattern and a solder resist layer are provided on an insulating substrate,
A printed wiring board in which a chip-shaped electronic component is installed, wherein an H-shaped mark is provided at a location where the chip-shaped electronic component is installed to indicate the position thereof.
JP10487181U 1981-07-15 1981-07-15 printed wiring board Pending JPS5811273U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10487181U JPS5811273U (en) 1981-07-15 1981-07-15 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10487181U JPS5811273U (en) 1981-07-15 1981-07-15 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5811273U true JPS5811273U (en) 1983-01-25

Family

ID=29899434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10487181U Pending JPS5811273U (en) 1981-07-15 1981-07-15 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5811273U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387870U (en) * 1986-11-25 1988-06-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6387870U (en) * 1986-11-25 1988-06-08

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