JPS594669U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS594669U
JPS594669U JP10043882U JP10043882U JPS594669U JP S594669 U JPS594669 U JP S594669U JP 10043882 U JP10043882 U JP 10043882U JP 10043882 U JP10043882 U JP 10043882U JP S594669 U JPS594669 U JP S594669U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
conductive path
carbon layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10043882U
Other languages
Japanese (ja)
Inventor
野村　則行
Original Assignee
日立コンデンサ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立コンデンサ株式会社 filed Critical 日立コンデンサ株式会社
Priority to JP10043882U priority Critical patent/JPS594669U/en
Publication of JPS594669U publication Critical patent/JPS594669U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のプリント配線板の断面図、第２図は本考
案の実施例の平面図、第３図は第２図の実施例の断面図
を示す。 １１・・・・・・基板、１２・・・・・・導電路、１４
・・・・・・レジスト層、１７・・・・・・カーボン層
。FIG. 1 is a sectional view of a conventional printed wiring board, FIG. 2 is a plan view of an embodiment of the present invention, and FIG. 3 is a sectional view of the embodiment of FIG. 11... Substrate, 12... Conductive path, 14
...Resist layer, 17...Carbon layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板に所定の導電路を形成し、該導電路の一部にカーボ
ン層を積層するプリント配線板において、導電路の側端
部を被覆しかつカーボン層の下地となるレジスト層を設
けることを特徴とするプリント配線板。A printed wiring board in which a predetermined conductive path is formed on a substrate and a carbon layer is laminated on a part of the conductive path, characterized by providing a resist layer that covers the side end of the conductive path and serves as a base for the carbon layer. printed wiring board.
JP10043882U 1982-07-02 1982-07-02 printed wiring board Pending JPS594669U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10043882U JPS594669U (en) 1982-07-02 1982-07-02 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10043882U JPS594669U (en) 1982-07-02 1982-07-02 printed wiring board

Publications (1)

Publication Number Publication Date
JPS594669U true JPS594669U (en) 1984-01-12

Family

ID=30237599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10043882U Pending JPS594669U (en) 1982-07-02 1982-07-02 printed wiring board

Country Status (1)

Country Link
JP (1) JPS594669U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145754A (en) * 1974-10-18 1976-04-19 Matsushita Electric Ind Co Ltd INSATSUHIMA KUTEIKO
JPS5731802B2 (en) * 1977-04-04 1982-07-07

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5145754A (en) * 1974-10-18 1976-04-19 Matsushita Electric Ind Co Ltd INSATSUHIMA KUTEIKO
JPS5731802B2 (en) * 1977-04-04 1982-07-07

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