JPS5920672U - Chip component mounting structure on printed wiring board - Google Patents
Chip component mounting structure on printed wiring boardInfo
- Publication number
- JPS5920672U JPS5920672U JP11521782U JP11521782U JPS5920672U JP S5920672 U JPS5920672 U JP S5920672U JP 11521782 U JP11521782 U JP 11521782U JP 11521782 U JP11521782 U JP 11521782U JP S5920672 U JPS5920672 U JP S5920672U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- wiring board
- printed wiring
- component mounting
- mounting structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の一実施例を示す印刷配線基板のチップ
部品の取付部の要部切欠側面図、第2図は同じ印刷配線
基板のチップ部品の取付部の平面図、第3図は従来型の
印刷配線基板のチップ部品の取付部の要部切欠側面図で
ある。同図中、1・・・印刷配線基板、2・・・チッチ
部品、3・・・電極、4・・・電極銅箔部、5・・・凹
部、6・・・凹部、7・・・接着剤。Fig. 1 is a cutaway side view of the main parts of the chip component mounting portion of a printed wiring board showing an embodiment of the present invention, Fig. 2 is a plan view of the chip component mounting portion of the same printed wiring board, and Fig. 3 is a top view of the chip component mounting portion of the same printed wiring board. FIG. 2 is a cutaway side view of a main part of a chip component mounting portion of a conventional printed wiring board. In the figure, 1... printed wiring board, 2... chichi component, 3... electrode, 4... electrode copper foil part, 5... recessed part, 6... recessed part, 7... glue.
Claims (1)
び同チップ部品の取付位置の中央部には夫々銅箔厚さ以
上の深さをもった凹部を形成してなることを特徴とする
印刷配線基板のチップ部品取付構造。Printing characterized in that a recessed part having a depth equal to or greater than the thickness of the copper foil is formed in the copper foil part of the printed wiring board to which the chip component is soldered and in the central part of the mounting position of the chip component. Chip component mounting structure on wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11521782U JPS5920672U (en) | 1982-07-29 | 1982-07-29 | Chip component mounting structure on printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11521782U JPS5920672U (en) | 1982-07-29 | 1982-07-29 | Chip component mounting structure on printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5920672U true JPS5920672U (en) | 1984-02-08 |
Family
ID=30266041
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11521782U Pending JPS5920672U (en) | 1982-07-29 | 1982-07-29 | Chip component mounting structure on printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5920672U (en) |
-
1982
- 1982-07-29 JP JP11521782U patent/JPS5920672U/en active Pending
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