JPS5984863U - multilayer printed wiring board - Google Patents
multilayer printed wiring boardInfo
- Publication number
- JPS5984863U JPS5984863U JP18000482U JP18000482U JPS5984863U JP S5984863 U JPS5984863 U JP S5984863U JP 18000482 U JP18000482 U JP 18000482U JP 18000482 U JP18000482 U JP 18000482U JP S5984863 U JPS5984863 U JP S5984863U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- signal pattern
- multilayer printed
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の多層配線基板を示す側面図、第２図は第
１図に示された実装部品の平面図、第３図は本考案の一
実施例を示す側面図、第４図は第３図に示された実装部
品の平面−である。
１・・・・・・多層印刷配線基板、３ａ、 ３ｂ・・
・・・・実装部品、５ａ・・・・・・内層に設けられた
信号パターン、５ｂ・・・・・・外層に設けられた信号
パターンの一部、１１・・・・・・スルーホール。Fig. 1 is a side view showing a conventional multilayer wiring board, Fig. 2 is a plan view of the mounted components shown in Fig. 1, Fig. 3 is a side view showing an embodiment of the present invention, and Fig. 4 is a side view showing a conventional multilayer wiring board. This is a plane view of the mounted component shown in FIG. 3. 1...Multilayer printed wiring board, 3a, 3b...
...Mounted component, 5a...Signal pattern provided on inner layer, 5b...Part of signal pattern provided on outer layer, 11...Through hole.
Claims (1)
てこの信号パターンとスルーホールニヨり接続された前
記信号パター′ンの一部とを有し、この信号パターンの
一部を介して前記内層の信号パターンと実装部品とが接
続されることを特徴とする多層印刷配線基板。It has a signal pattern provided in an inner layer portion, and a part of the signal pattern provided in an outer layer and connected to this signal pattern through a through hole, and the signal pattern is connected to the inner layer through a part of the signal pattern. A multilayer printed wiring board characterized in that a signal pattern and a mounted component are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18000482U JPS5984863U (en) | 1982-11-30 | 1982-11-30 | multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18000482U JPS5984863U (en) | 1982-11-30 | 1982-11-30 | multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5984863U true JPS5984863U (en) | 1984-06-08 |
Family
ID=30390405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18000482U Pending JPS5984863U (en) | 1982-11-30 | 1982-11-30 | multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5984863U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247034B2 (en) * | 1972-10-16 | 1977-11-29 |
-
1982
- 1982-11-30 JP JP18000482U patent/JPS5984863U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5247034B2 (en) * | 1972-10-16 | 1977-11-29 |
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