JPS6057152U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS6057152U
JPS6057152U JP6291783U JP6291783U JPS6057152U JP S6057152 U JPS6057152 U JP S6057152U JP 6291783 U JP6291783 U JP 6291783U JP 6291783 U JP6291783 U JP 6291783U JP S6057152 U JPS6057152 U JP S6057152U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
chip component
slit portion
recorded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6291783U
Other languages
Japanese (ja)
Inventor
高村　芳雄
登 中村
小野　道成
弘本　圭右
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP6291783U priority Critical patent/JPS6057152U/en
Publication of JPS6057152U publication Critical patent/JPS6057152U/en
Pending legal-status Critical Current

Links

Landscapes

  • Credit Cards Or The Like (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

図面は本考案を示す図で、第１図はプリント配線板の要
部拡大図、第２図は第１図のプリント配線板に対し外部
応力が加わわった状態を示すＡ矢視方向からの側面図、
第３図は他の実施例を示すプリント配線板の要部拡大図
、第４図は第３図のプリント配線板に外部応力が加わわ
った状態を示すＢ矢視方向からの側面図で、第５図は更
に他の実施例を示すプリント配線板の要部拡大図である
。・ １・・・プリント配線板、２，１２・・・プリント配線
基板、２ａｅ１２ａ・・・パターン、３，１３・・・チ
ップ部品、４．１４・・・スリット部、５・・・半田層
。 “°　ノ・ 」１１ 男４図 （′４　　Ｘ ５５国 ○”　■−４■The drawings show the present invention. Figure 1 is an enlarged view of the main parts of the printed wiring board, and Figure 2 is a view taken from the direction of arrow A, showing the printed wiring board in Figure 1 with external stress applied. Side view,
FIG. 3 is an enlarged view of the main parts of a printed wiring board showing another embodiment, and FIG. 4 is a side view from the direction of arrow B showing a state in which external stress is applied to the printed wiring board of FIG. 3. FIG. 5 is an enlarged view of the main parts of a printed wiring board showing still another embodiment. 1... Printed wiring board, 2, 12... Printed wiring board, 2ae12a... Pattern, 3, 13... Chip component, 4.14... Slit portion, 5... Solder layer. “°ノ・” 11 Man 4 figures ('4 x 55 countries ○” ■-4■

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] プリント配線基板面上に役職されるチップ部品近傍の前
記プリント配線基板にスリット部を設けたことを特徴と
するプリント配線板。1. A printed wiring board, characterized in that a slit portion is provided in the printed wiring board near a chip component placed on a surface of the printed wiring board.
JP6291783U 1983-04-28 1983-04-28 printed wiring board Pending JPS6057152U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6291783U JPS6057152U (en) 1983-04-28 1983-04-28 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6291783U JPS6057152U (en) 1983-04-28 1983-04-28 printed wiring board

Publications (1)

Publication Number Publication Date
JPS6057152U true JPS6057152U (en) 1985-04-20

Family

ID=30193106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6291783U Pending JPS6057152U (en) 1983-04-28 1983-04-28 printed wiring board

Country Status (1)

Country Link
JP (1) JPS6057152U (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01145197A (en) * 1987-06-11 1989-06-07 Dainippon Printing Co Ltd Ic card and manufacture thereof
JPH02137280U (en) * 1989-04-21 1990-11-15
JP2009545143A (en) * 2006-07-21 2009-12-17 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング Printed circuit board with electronic components generating vibration
JP2012216566A (en) * 2011-03-31 2012-11-08 Brother Ind Ltd Circuit board
JP6065119B2 (en) * 2013-09-05 2017-01-25 株式会社村田製作所 Multilayer board
JP2017117919A (en) * 2015-12-24 2017-06-29 株式会社デンソー Circuit board
WO2021206122A1 (en) * 2020-04-10 2021-10-14 株式会社デンソー Electronic device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01145197A (en) * 1987-06-11 1989-06-07 Dainippon Printing Co Ltd Ic card and manufacture thereof
JPH02137280U (en) * 1989-04-21 1990-11-15
JP2009545143A (en) * 2006-07-21 2009-12-17 オスラム ゲゼルシャフト ミット ベシュレンクテル ハフツング Printed circuit board with electronic components generating vibration
US9119299B2 (en) 2006-07-21 2015-08-25 Osram Gesellschaft Mit Beschrankter Haftung Printed circuit board with vibration-generating electronic component
JP2012216566A (en) * 2011-03-31 2012-11-08 Brother Ind Ltd Circuit board
JP6065119B2 (en) * 2013-09-05 2017-01-25 株式会社村田製作所 Multilayer board
JP2017117919A (en) * 2015-12-24 2017-06-29 株式会社デンソー Circuit board
WO2021206122A1 (en) * 2020-04-10 2021-10-14 株式会社デンソー Electronic device
JP2021168356A (en) * 2020-04-10 2021-10-21 株式会社デンソー Electronic device

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