JPH02137280U - - Google Patents
Info
- Publication number
- JPH02137280U JPH02137280U JP4625289U JP4625289U JPH02137280U JP H02137280 U JPH02137280 U JP H02137280U JP 4625289 U JP4625289 U JP 4625289U JP 4625289 U JP4625289 U JP 4625289U JP H02137280 U JPH02137280 U JP H02137280U
- Authority
- JP
- Japan
- Prior art keywords
- module
- contact terminals
- card
- front surface
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図の−線断面図で、第３図は本考案
の他の実施例を示す平面図、第４図は第３図の裏
面図、第５図は第３図の−線断面図である。
１……コンタクト基板、２……コンタクト面、
２−１〜２−８……コンタクト端子、３……ＩＣ
チツプモールド部、５，７……スリツト部、６…
…ダム基板。
Fig. 1 is a plan view showing one embodiment of the present invention;
The figures are a sectional view taken along the line -- in Fig. 1, Fig. 3 is a plan view showing another embodiment of the present invention, Fig. 4 is a rear view of Fig. 3, and Fig. 5 is a sectional view taken along the - line in Fig. 3. It is a diagram. 1...Contact board, 2...Contact surface,
2-1 to 2-8...Contact terminal, 3...IC
Chip mold part, 5, 7...Slit part, 6...
...dam board.
Claims (1)
で包囲したＩＣチツプを備えたＩＣカード用モジ
ユールにおいて、前記表面のコンタクト端子と裏
面のダム基板の少なくとも一方の外周に沿つて剛
性を弱めるためのスリツト部を形成したことを特
徴とするＩＣカード用モジユール。 In an IC card module equipped with an IC chip having contact terminals arranged on the front surface and surrounded by a dam board on the back surface, a slit is provided to weaken the rigidity along the outer periphery of at least one of the contact terminals on the front surface and the dam board on the back surface. A module for an IC card, characterized in that a module is formed with a section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989046252U JP2533408Y2 (en) | 1989-04-21 | 1989-04-21 | IC module for IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989046252U JP2533408Y2 (en) | 1989-04-21 | 1989-04-21 | IC module for IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02137280U true JPH02137280U (en) | 1990-11-15 |
| JP2533408Y2 JP2533408Y2 (en) | 1997-04-23 |
Family
ID=31561170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989046252U Expired - Lifetime JP2533408Y2 (en) | 1989-04-21 | 1989-04-21 | IC module for IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2533408Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152U (en) * | 1983-04-28 | 1985-04-20 | 株式会社東芝 | printed wiring board |
| JPS6163498A (en) * | 1984-09-05 | 1986-04-01 | 株式会社東芝 | Integrated circuit card |
-
1989
- 1989-04-21 JP JP1989046252U patent/JP2533408Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6057152U (en) * | 1983-04-28 | 1985-04-20 | 株式会社東芝 | printed wiring board |
| JPS6163498A (en) * | 1984-09-05 | 1986-04-01 | 株式会社東芝 | Integrated circuit card |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2533408Y2 (en) | 1997-04-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |