JPS6397578U - - Google Patents
Info
- Publication number
- JPS6397578U JPS6397578U JP19393186U JP19393186U JPS6397578U JP S6397578 U JPS6397578 U JP S6397578U JP 19393186 U JP19393186 U JP 19393186U JP 19393186 U JP19393186 U JP 19393186U JP S6397578 U JPS6397578 U JP S6397578U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- spaced apart
- position spaced
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011111 cardboard Substances 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図及び第２図は本考案の実施例を示す部分
断面図及び表板を外した状態での上面図、第３図
は従来例を示す部分断面側面図、第４図はＩＳＯ
規格によるＩＣカードの寸法を示す模式図、第５
図はＩＣカードの湾曲状態を示す模式図である。
１１…カード基板、１３…ＩＣチツプ、１４…
フイルム基板、１５…導電路、１７…電極。
Figures 1 and 2 are a partial sectional view and a top view with the top plate removed, showing an embodiment of the present invention, Figure 3 is a partial sectional side view showing a conventional example, and Figure 4 is an ISO
Schematic diagram showing the dimensions of an IC card according to the standard, No. 5
The figure is a schematic diagram showing a curved state of the IC card. 11... Card board, 13... IC chip, 14...
Film substrate, 15...conductive path, 17...electrode.
Claims (1)
線より離間した位置に埋設されたＩＣチツプ、該
ＩＣチツプとは離間した位置において上記基板表
面に露出するように配された電極、該電極と上記
ＩＣチツプとを電気的に接続するように上記基板
内に埋設されたフレキシブルな導電路を備えたこ
とを特徴とするＩＣカード。 A card substrate, an IC chip buried in a position spaced apart from the center line of each of the long and short sides of the board, an electrode arranged to be exposed on the surface of the board at a position spaced apart from the IC chip, and the electrode and An IC card characterized by comprising a flexible conductive path embedded in the substrate so as to electrically connect with the IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19393186U JPS6397578U (en) | 1986-12-17 | 1986-12-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19393186U JPS6397578U (en) | 1986-12-17 | 1986-12-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6397578U true JPS6397578U (en) | 1988-06-24 |
Family
ID=31150423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19393186U Pending JPS6397578U (en) | 1986-12-17 | 1986-12-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6397578U (en) |
-
1986
- 1986-12-17 JP JP19393186U patent/JPS6397578U/ja active Pending