JPS63114095U - - Google Patents

Info

Publication number
JPS63114095U
JPS63114095U JP1987005766U JP576687U JPS63114095U JP S63114095 U JPS63114095 U JP S63114095U JP 1987005766 U JP1987005766 U JP 1987005766U JP 576687 U JP576687 U JP 576687U JP S63114095 U JPS63114095 U JP S63114095U
Authority
JP
Japan
Prior art keywords
integrated circuit
shield plate
chip
interposed
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987005766U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987005766U priority Critical patent/JPS63114095U/ja
Publication of JPS63114095U publication Critical patent/JPS63114095U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図はこの考案の実施例を示し、
第１図はＩＣの拡大断面図、第２図はＩＣの平面
図、第３図から第６図は従来の例を示し、第３図
はアースパターンを形成したプリント基板に取付
けられたＩＣの平面図、第４図は第３図の―
線拡大断面図、第５図はシールド板を有するＩＣ
の平面図、第６図は第５図の―線拡大断面図
である。 ６……アースピン、７……チツプ、１１……シ
ールド板、１２……パツケージ基板、１４……接
着剤。 Figures 1 and 2 show an embodiment of this invention,
Fig. 1 is an enlarged sectional view of an IC, Fig. 2 is a plan view of the IC, Figs. 3 to 6 show conventional examples, and Fig. 3 shows an IC mounted on a printed circuit board with a ground pattern formed thereon. Plan view, Figure 4 is the same as Figure 3.
An enlarged line cross-sectional view, Figure 5 is an IC with a shield plate.
FIG. 6 is an enlarged sectional view taken along the line -- in FIG. 6... Earth pin, 7... Chip, 11... Shield plate, 12... Package board, 14... Adhesive.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路のパツケージ基板とチツプとの間に導
電性のシールド板を介在させ、かつこのシールド
板を集積回路のアースピンに導通させたことを特
徴とする集積回路のチツプのシールド構造。 A shield structure for an integrated circuit chip, characterized in that a conductive shield plate is interposed between the integrated circuit package substrate and the chip, and the shield plate is electrically connected to a ground pin of the integrated circuit.
JP1987005766U 1987-01-19 1987-01-19 Pending JPS63114095U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987005766U JPS63114095U (en) 1987-01-19 1987-01-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987005766U JPS63114095U (en) 1987-01-19 1987-01-19

Publications (1)

Publication Number Publication Date
JPS63114095U true JPS63114095U (en) 1988-07-22

Family

ID=30787656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987005766U Pending JPS63114095U (en) 1987-01-19 1987-01-19

Country Status (1)

Country Link
JP (1) JPS63114095U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297954A (en) * 1989-02-14 1990-12-10 Mitsubishi Electric Corp Shield structure of integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02297954A (en) * 1989-02-14 1990-12-10 Mitsubishi Electric Corp Shield structure of integrated circuit

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