JPS6063975U - Lead plate - Google Patents
Lead plateInfo
- Publication number
- JPS6063975U JPS6063975U JP1983156024U JP15602483U JPS6063975U JP S6063975 U JPS6063975 U JP S6063975U JP 1983156024 U JP1983156024 U JP 1983156024U JP 15602483 U JP15602483 U JP 15602483U JP S6063975 U JPS6063975 U JP S6063975U
- Authority
- JP
- Japan
- Prior art keywords
- lead plate
- area
- terminals
- recorded
- cores
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図及び第2図は従来のリード板の形状とその欠点を
示す図、第3図は本考案に係るリード板の形状とその利
点を示す図、第4図は第3図の平面図である。
1は配線基板、2及び4は端子、3は太陽電池素子、5
はリード板、7及び7′は凸状部、8は隙間。Figures 1 and 2 are diagrams showing the shape of a conventional lead plate and its drawbacks, Figure 3 is a diagram showing the shape of a lead plate according to the present invention and its advantages, and Figure 4 is a plan view of Figure 3. It is. 1 is a wiring board, 2 and 4 are terminals, 3 is a solar cell element, 5
is a lead plate, 7 and 7' are convex portions, and 8 is a gap.
Claims (1)
との結合面に核間の面積よりも小さめの−凸状部を膨出
形成してなることを特徴とするリード板。1. A lead plate for connecting terminals, characterized in that a convex portion smaller in area than the area between the cores is formed on a surface of the lead plate that connects with the terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983156024U JPS6063975U (en) | 1983-10-05 | 1983-10-05 | Lead plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983156024U JPS6063975U (en) | 1983-10-05 | 1983-10-05 | Lead plate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6063975U true JPS6063975U (en) | 1985-05-07 |
Family
ID=30344406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983156024U Pending JPS6063975U (en) | 1983-10-05 | 1983-10-05 | Lead plate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6063975U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150065754A (en) * | 2012-09-28 | 2015-06-15 | 선파워 코포레이션 | Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells |
-
1983
- 1983-10-05 JP JP1983156024U patent/JPS6063975U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150065754A (en) * | 2012-09-28 | 2015-06-15 | 선파워 코포레이션 | Methods and structures for forming and improving solder joint thickness and planarity control features for solar cells |
JP2015530758A (en) * | 2012-09-28 | 2015-10-15 | サンパワー コーポレイション | Method for forming and improving solder joint thickness and planarity control mechanisms for solar cells |
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