JPH03117833U - - Google Patents
Info
- Publication number
- JPH03117833U JPH03117833U JP2671190U JP2671190U JPH03117833U JP H03117833 U JPH03117833 U JP H03117833U JP 2671190 U JP2671190 U JP 2671190U JP 2671190 U JP2671190 U JP 2671190U JP H03117833 U JPH03117833 U JP H03117833U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- integrated circuit
- hybrid integrated
- board
- mounting land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Die Bonding (AREA)
Description
第１図および第２図はそれぞれ本考案の一実施
例および他の実施例の要部平面図、第３図は従来
の混成集積回路の要部平面図である。
１，３……チツプ搭載ランド、２……切欠き、
４……突起、５……半導体チツプ、６……一番ピ
ン電極、７……ワイヤボンデイングランド。
1 and 2 are plan views of essential parts of one embodiment and another embodiment of the present invention, respectively, and FIG. 3 is a plan view of essential parts of a conventional hybrid integrated circuit. 1, 3... Chip mounting land, 2... Notch,
4...Protrusion, 5...Semiconductor chip, 6...First pin electrode, 7...Wire bonding ground.
Claims (1)
ランドに搭載された半導体チツプとを含む混成集
積回路において、前記基板上のチツプ搭載ランド
の外周辺の一部分には、前記チツプの搭載方向を
示す目印となるための、前記チツプの外周図形よ
り稍々大きな相似形からずれた凸起または切欠き
が設けられていることを特徴とする混成集積回路
。 In a hybrid integrated circuit including a hybrid integrated circuit board and a semiconductor chip mounted on a chip mounting land on the board, a mark indicating the mounting direction of the chip is provided on a part of the outer periphery of the chip mounting land on the board. A hybrid integrated circuit characterized in that a protrusion or notch is provided which is slightly larger than the outer peripheral figure of the chip and deviates from a similar shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2671190U JPH03117833U (en) | 1990-03-15 | 1990-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2671190U JPH03117833U (en) | 1990-03-15 | 1990-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03117833U true JPH03117833U (en) | 1991-12-05 |
Family
ID=31529592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2671190U Pending JPH03117833U (en) | 1990-03-15 | 1990-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03117833U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008216820A (en) * | 2007-03-06 | 2008-09-18 | Funai Electric Co Ltd | Liquid crystal panel fixation structure and liquid crystal television |
| JP2009265204A (en) * | 2008-04-23 | 2009-11-12 | Funai Electric Co Ltd | Wall-hung display device |
-
1990
- 1990-03-15 JP JP2671190U patent/JPH03117833U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008216820A (en) * | 2007-03-06 | 2008-09-18 | Funai Electric Co Ltd | Liquid crystal panel fixation structure and liquid crystal television |
| JP2009265204A (en) * | 2008-04-23 | 2009-11-12 | Funai Electric Co Ltd | Wall-hung display device |