JPH0350339U - - Google Patents
Info
- Publication number
- JPH0350339U JPH0350339U JP11066189U JP11066189U JPH0350339U JP H0350339 U JPH0350339 U JP H0350339U JP 11066189 U JP11066189 U JP 11066189U JP 11066189 U JP11066189 U JP 11066189U JP H0350339 U JPH0350339 U JP H0350339U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- high frequency
- circuit
- board
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
Description
第１図は本考案の一実施例による高周波混成集
積回路の斜視図、第２図は第１図のＡ−Ａ′線の
断面図、第３図は従来の高周波混成集積回路の斜
視図、第４図は第３図のＢ−Ｂ′線の断面図であ
る。
１……放熱フイン、２……基板、３……放熱ブ
ロツク、４……半導体チツプ、５……ピン。なお
図中同一符号は同一又は相当部分を示す。
FIG. 1 is a perspective view of a high frequency hybrid integrated circuit according to an embodiment of the present invention, FIG. 2 is a sectional view taken along line A-A' in FIG. 1, and FIG. 3 is a perspective view of a conventional high frequency hybrid integrated circuit. FIG. 4 is a sectional view taken along line B-B' in FIG. 3. 1... Heat dissipation fin, 2... Board, 3... Heat dissipation block, 4... Semiconductor chip, 5... Pin. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
有する基板を基にした高周波混成集積回路におい
て、 上記基板の回路パターン面上に設けられ、外部
の回路と接続するピンと、 上記基板の接地パターン面に接着され、基板を
被う表面積が大なる断面Ｌ字型形状である放熱フ
インと、 上記基板の回路パターン面上の一部に取り付け
られ、該放熱フインに接着される断面Ｌ字型形状
の放熱ブロツクと、 該放熱ブロツクの上面に設けられた半導体チツ
プとから構成されたことを特徴とする高周波混成
集積回路。[Claims for Utility Model Registration] In a high frequency hybrid integrated circuit based on a substrate having a circuit pattern on the top surface and a ground pattern on the back surface, a pin provided on the circuit pattern surface of the substrate and connected to an external circuit; A heat dissipation fin that is bonded to the ground pattern surface of the board and has an L-shaped cross section and has a large surface area covering the board; A high frequency hybrid integrated circuit comprising a heat dissipation block having an L-shaped cross section and a semiconductor chip provided on the top surface of the heat dissipation block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11066189U JPH0350339U (en) | 1989-09-20 | 1989-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11066189U JPH0350339U (en) | 1989-09-20 | 1989-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0350339U true JPH0350339U (en) | 1991-05-16 |
Family
ID=31659185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11066189U Pending JPH0350339U (en) | 1989-09-20 | 1989-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350339U (en) |
-
1989
- 1989-09-20 JP JP11066189U patent/JPH0350339U/ja active Pending