JPS61205145U - - Google Patents
Info
- Publication number
- JPS61205145U JPS61205145U JP8981786U JP8981786U JPS61205145U JP S61205145 U JPS61205145 U JP S61205145U JP 8981786 U JP8981786 U JP 8981786U JP 8981786 U JP8981786 U JP 8981786U JP S61205145 U JPS61205145 U JP S61205145U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- integrated circuit
- mounting portions
- registration request
- positions corresponding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
Description
第１図は従来の半導体集積回路パツケージの一
例を示した斜視図、第２図ａおよび第２図ｂは、
本考案の一実施例を示す斜視図および断面図であ
る。
１……基板、２……放熱板、３……集積回路チ
ツプ、２１……基板、２２……放熱板、２３……
半導体集積回路チツプ、２４……導体、２５……
絶縁層。
FIG. 1 is a perspective view showing an example of a conventional semiconductor integrated circuit package, and FIGS. 2a and 2b are
1 is a perspective view and a sectional view showing an embodiment of the present invention. FIG. 1... Board, 2... Heat sink, 3... Integrated circuit chip, 21... Board, 22... Heat sink, 23...
Semiconductor integrated circuit chip, 24... Conductor, 25...
insulation layer.
Claims (1)
付け部分に密着された複数の集積回路チツプと、
前記取付け部分に対応する位置に穴が明けられ前
記放熱板の表面に形成された基板とを含むことを
特徴とする集積回路パツケージ。 a heat sink with a flat surface; a plurality of integrated circuit chips closely attached to the mounting portions on the surface of the heat sink;
An integrated circuit package comprising: a substrate formed on the surface of the heat sink and having holes formed at positions corresponding to the mounting portions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981786U JPS61205145U (en) | 1986-06-12 | 1986-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8981786U JPS61205145U (en) | 1986-06-12 | 1986-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61205145U true JPS61205145U (en) | 1986-12-24 |
Family
ID=30644255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8981786U Pending JPS61205145U (en) | 1986-06-12 | 1986-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61205145U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064914A (en) * | 2010-09-16 | 2012-03-29 | Samsung Electro-Mechanics Co Ltd | Heat dissipation substrate and manufacturing method of the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (en) * | 1974-05-08 | 1975-11-18 |
-
1986
- 1986-06-12 JP JP8981786U patent/JPS61205145U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50143072A (en) * | 1974-05-08 | 1975-11-18 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012064914A (en) * | 2010-09-16 | 2012-03-29 | Samsung Electro-Mechanics Co Ltd | Heat dissipation substrate and manufacturing method of the same |
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