JPH01121969U - - Google Patents
Info
- Publication number
- JPH01121969U JPH01121969U JP1988017201U JP1720188U JPH01121969U JP H01121969 U JPH01121969 U JP H01121969U JP 1988017201 U JP1988017201 U JP 1988017201U JP 1720188 U JP1720188 U JP 1720188U JP H01121969 U JPH01121969 U JP H01121969U
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- metal substrate
- conductive circuit
- circuit
- aluminum nitride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Details Of Resistors (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の断面図である。
１……ＳＵＳ３０４製回路基板、２……窒化ア
ルミニウム絶縁層、３……導電回路、４……はん
だ、５……外付用回路素子。
FIG. 1 is a sectional view of an embodiment of the present invention. 1... Circuit board made of SUS304, 2... Aluminum nitride insulating layer, 3... Conductive circuit, 4... Solder, 5... External circuit element.
Claims (1)
か一方に被覆された窒化アルミニウムより成る絶
縁層と、該絶縁層上に形成された導電回路と、該
導電回路に装着された複数の回路素子とを有する
ことを特徴とする混成集積回路装置。 A metal substrate, an insulating layer made of aluminum nitride coated on one or both sides of the metal substrate, a conductive circuit formed on the insulating layer, and a plurality of circuit elements attached to the conductive circuit. A hybrid integrated circuit device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017201U JPH01121969U (en) | 1988-02-10 | 1988-02-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988017201U JPH01121969U (en) | 1988-02-10 | 1988-02-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01121969U true JPH01121969U (en) | 1989-08-18 |
Family
ID=31230771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988017201U Pending JPH01121969U (en) | 1988-02-10 | 1988-02-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01121969U (en) |
-
1988
- 1988-02-10 JP JP1988017201U patent/JPH01121969U/ja active Pending