JPS6355551U - - Google Patents
Info
- Publication number
- JPS6355551U JPS6355551U JP1986148957U JP14895786U JPS6355551U JP S6355551 U JPS6355551 U JP S6355551U JP 1986148957 U JP1986148957 U JP 1986148957U JP 14895786 U JP14895786 U JP 14895786U JP S6355551 U JPS6355551 U JP S6355551U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- conductor layer
- solder
- mount element
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例による面実装素子の平
面図、第２図及び第３図はそれぞれ異なる実施例
の平面図、第４図は本考案の実施例による面実装
素子の側面断面図、第５図及び第６図は従来にお
ける面実装素子の構造図を示す。
１……面実装素子、２……本体、３……リード
部、４，１０……接続端子部、５……切り欠き部
、６……孔部、７……半田、８……導体層、９…
…基板。
FIG. 1 is a plan view of a surface mount device according to an embodiment of the present invention, FIGS. 2 and 3 are plan views of different embodiments, and FIG. 4 is a side sectional view of a surface mount device according to an embodiment of the present invention. , FIG. 5, and FIG. 6 show structural diagrams of conventional surface-mounted devices. DESCRIPTION OF SYMBOLS 1... Surface mount element, 2... Main body, 3... Lead part, 4, 10... Connection terminal part, 5... Notch part, 6... Hole part, 7... Solder, 8... Conductor layer ,9...
…substrate.
Claims (1)
に載置され、半田付けされる面実装素子において
、半田によつて前記導体層と接合される前記面実
装素子の接続端子部に切り欠き部または孔部を設
けたことを特徴とする面実装素子の端子構造。 In a surface mount element that is placed and soldered after supplying solder to a predetermined position on a conductor layer of a board, a notch is provided in a connection terminal portion of the surface mount element that is joined to the conductor layer by solder. Or a terminal structure for a surface mount device characterized by having a hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986148957U JPS6355551U (en) | 1986-09-29 | 1986-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986148957U JPS6355551U (en) | 1986-09-29 | 1986-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355551U true JPS6355551U (en) | 1988-04-14 |
Family
ID=31063708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986148957U Pending JPS6355551U (en) | 1986-09-29 | 1986-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355551U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017138555A1 (en) * | 2016-02-12 | 2017-08-17 | 株式会社村田製作所 | Electronic component having lead wire |
| JP2019186321A (en) * | 2018-04-05 | 2019-10-24 | ローム株式会社 | Semiconductor device |
| JP2022186450A (en) * | 2021-06-04 | 2022-12-15 | ニチコン株式会社 | Chip shape electronic component |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596865B2 (en) * | 1975-05-22 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | 5-((2-halogeno-1-hydroxy)alkyl) carbostyril |
-
1986
- 1986-09-29 JP JP1986148957U patent/JPS6355551U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS596865B2 (en) * | 1975-05-22 | 1984-02-15 | オオツカセイヤク カブシキガイシヤ | 5-((2-halogeno-1-hydroxy)alkyl) carbostyril |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017138555A1 (en) * | 2016-02-12 | 2017-08-17 | 株式会社村田製作所 | Electronic component having lead wire |
| CN108369865A (en) * | 2016-02-12 | 2018-08-03 | 株式会社村田制作所 | Electronic unit with lead |
| JPWO2017138555A1 (en) * | 2016-02-12 | 2018-09-20 | 株式会社村田製作所 | Electronic components with lead wires |
| CN108369865B (en) * | 2016-02-12 | 2019-10-15 | 株式会社村田制作所 | Electronic components with leads |
| JP2019186321A (en) * | 2018-04-05 | 2019-10-24 | ローム株式会社 | Semiconductor device |
| JP2022186450A (en) * | 2021-06-04 | 2022-12-15 | ニチコン株式会社 | Chip shape electronic component |