JPH0345679U - - Google Patents
Info
- Publication number
- JPH0345679U JPH0345679U JP10581189U JP10581189U JPH0345679U JP H0345679 U JPH0345679 U JP H0345679U JP 10581189 U JP10581189 U JP 10581189U JP 10581189 U JP10581189 U JP 10581189U JP H0345679 U JPH0345679 U JP H0345679U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid circuit
- substrate
- metal plate
- comes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例に係るハイブリツド
回路基板の側断面図、第２図は本考案の他の実施
例に係るハイブリツド回路基板の側断面図、第３
図は従来のハイブリツド回路基板の構造を示す側
面図である。
符号の説明、１１，１５……ハイブリツド回路
基板、１２……セラミツク基板、１２ａ……貫通
孔、１３……金属板、１３ａ……凸部、１３ｂ…
…フイン、１４……接着層。
FIG. 1 is a side sectional view of a hybrid circuit board according to one embodiment of the present invention, FIG. 2 is a side sectional view of a hybrid circuit board according to another embodiment of the present invention, and FIG.
The figure is a side view showing the structure of a conventional hybrid circuit board. Explanation of symbols, 11, 15...Hybrid circuit board, 12...Ceramic board, 12a...Through hole, 13...Metal plate, 13a...Protrusion, 13b...
...fin, 14...adhesive layer.
Claims (1)
リツド回路基板の構造において、上記基板の裏面
側に、上記電子部品を構成する発熱素子に一部分
が接触する金属板を添設したことを特徴とするハ
イブリツド回路基板の構造。 A structure of a hybrid circuit board in which a plurality of electronic components are mounted on a substrate, characterized in that a metal plate is attached to the back side of the substrate, a part of which comes into contact with a heating element constituting the electronic component. Structure of hybrid circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10581189U JPH0345679U (en) | 1989-09-08 | 1989-09-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10581189U JPH0345679U (en) | 1989-09-08 | 1989-09-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0345679U true JPH0345679U (en) | 1991-04-26 |
Family
ID=31654567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10581189U Pending JPH0345679U (en) | 1989-09-08 | 1989-09-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0345679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036050A (en) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Process for producing multilayer circuit board |
-
1989
- 1989-09-08 JP JP10581189U patent/JPH0345679U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036050A (en) * | 2005-07-28 | 2007-02-08 | Shin Kobe Electric Mach Co Ltd | Process for producing multilayer circuit board |