JPS62188180U - - Google Patents
Info
- Publication number
- JPS62188180U JPS62188180U JP7534786U JP7534786U JPS62188180U JP S62188180 U JPS62188180 U JP S62188180U JP 7534786 U JP7534786 U JP 7534786U JP 7534786 U JP7534786 U JP 7534786U JP S62188180 U JPS62188180 U JP S62188180U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- insulating film
- conductive pattern
- pattern made
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Description
第１図ないし第４図は本考案の一実施例に係り
、第１図はフレキシブル印刷配線板の断面図、第
２図は第１の基板の斜視図、第３図ａ，ｂは第２
の基板の製造工程を示す断面図、第４図は第１の
基板と第２の基板の圧着工程を示す説明図、第５
図は本考案の他の実施例に係るフレキシブル印刷
配線板の断面図である。
１……第１の基板、２，５……絶縁フイルム、
３，６……導電パターン、４……第２の基板、７
……接着層。
1 to 4 relate to one embodiment of the present invention, in which FIG. 1 is a sectional view of a flexible printed wiring board, FIG. 2 is a perspective view of a first board, and FIGS.
FIG. 4 is an explanatory diagram showing the process of bonding the first and second substrates; FIG.
The figure is a sectional view of a flexible printed wiring board according to another embodiment of the present invention. 1... First substrate, 2, 5... Insulating film,
3, 6... Conductive pattern, 4... Second substrate, 7
...Adhesive layer.
Claims (1)
ーンを印刷形成した第１の基板と、絶縁フイルム
上に金属箔からなる導電パターンを設けるととも
に前記第１の基板に比べて小面積の第２の基板と
を、接着手段を介して積層・一体化したことを特
徴とするフレキシブル印刷配線板。 A first substrate having a conductive pattern made of conductive ink printed on an insulating film, and a second substrate having a conductive pattern made of metal foil on the insulating film and having a smaller area than the first substrate. , a flexible printed wiring board characterized by being laminated and integrated through adhesive means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7534786U JPH0429590Y2 (en) | 1986-05-21 | 1986-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7534786U JPH0429590Y2 (en) | 1986-05-21 | 1986-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62188180U true JPS62188180U (en) | 1987-11-30 |
| JPH0429590Y2 JPH0429590Y2 (en) | 1992-07-17 |
Family
ID=30921403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7534786U Expired JPH0429590Y2 (en) | 1986-05-21 | 1986-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0429590Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01305598A (en) * | 1988-06-03 | 1989-12-08 | Mitsui Toatsu Chem Inc | Multilayer printed circuit board |
-
1986
- 1986-05-21 JP JP7534786U patent/JPH0429590Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01305598A (en) * | 1988-06-03 | 1989-12-08 | Mitsui Toatsu Chem Inc | Multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0429590Y2 (en) | 1992-07-17 |
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