JPH02102758U - - Google Patents
Info
- Publication number
- JPH02102758U JPH02102758U JP1160689U JP1160689U JPH02102758U JP H02102758 U JPH02102758 U JP H02102758U JP 1160689 U JP1160689 U JP 1160689U JP 1160689 U JP1160689 U JP 1160689U JP H02102758 U JPH02102758 U JP H02102758U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- thin plate
- curved surface
- curved
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図はこの考案の一実施例を示す外観図、第
２図はこの考案の一実施例による印刷配線板の断
面図、第３図はこの考案を実施した場合の追尾角
度図、第４図は従来の場合の追尾角度図、第５図
、第６図はそれぞれこの考案の他の実施例を示す
外観図、第７図は従来の印刷配線板の外観図であ
る。
図中、１は印刷配線板、２は導体パターン、１
１，１４は薄板基板、１２は接着面を有するシー
ト、１３は曲面加工した絶縁樹脂部、２１，２２
は導体パターンである。なお、図中同一符号は同
一又は相当部分を示す。
Fig. 1 is an external view showing an embodiment of this invention, Fig. 2 is a sectional view of a printed wiring board according to an embodiment of this invention, Fig. 3 is a tracking angle diagram when this invention is implemented, Fig. 4 The figure is a tracking angle diagram of a conventional case, FIGS. 5 and 6 are external views showing other embodiments of this invention, and FIG. 7 is an external view of a conventional printed wiring board. In the figure, 1 is a printed wiring board, 2 is a conductor pattern, 1
1 and 14 are thin plate substrates, 12 is a sheet having an adhesive surface, 13 is an insulating resin portion with a curved surface, 21 and 22
is a conductor pattern. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
基板を積層してなる曲面を有する印刷配線板。 A printed wiring board with a curved surface, which is made by laminating a thin plate substrate having a conductor portion on a curved resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1160689U JPH02102758U (en) | 1989-02-01 | 1989-02-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1160689U JPH02102758U (en) | 1989-02-01 | 1989-02-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02102758U true JPH02102758U (en) | 1990-08-15 |
Family
ID=31220308
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1160689U Pending JPH02102758U (en) | 1989-02-01 | 1989-02-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02102758U (en) |
-
1989
- 1989-02-01 JP JP1160689U patent/JPH02102758U/ja active Pending
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