JPH01159397U - - Google Patents
Info
- Publication number
- JPH01159397U JPH01159397U JP5565788U JP5565788U JPH01159397U JP H01159397 U JPH01159397 U JP H01159397U JP 5565788 U JP5565788 U JP 5565788U JP 5565788 U JP5565788 U JP 5565788U JP H01159397 U JPH01159397 U JP H01159397U
- Authority
- JP
- Japan
- Prior art keywords
- circuit pattern
- insulator coating
- printed
- insulating substrate
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図及び第２図は本案の実施例の略断面図で
あり、第３図は従来の一例の略断面図である。
１０……回路パターン、１１……絶縁基板、１
２……ソルダーレジスト（第１の絶縁体被覆）、
１３，１５……第２の絶縁体被覆。
1 and 2 are schematic sectional views of an embodiment of the present invention, and FIG. 3 is a schematic sectional view of a conventional example. 10...Circuit pattern, 11...Insulating substrate, 1
2...Solder resist (first insulator coating),
13, 15...Second insulator coating.
Claims (1)
の絶縁体被覆を設け、更にその上に回路パターン
に沿つて第２の絶縁体被覆を設けた印刷配線基板
。 The first layer is placed on the surface of the insulating substrate on which the circuit pattern is printed.
A printed wiring board comprising: an insulator coating, and a second insulator coating provided thereon along a circuit pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5565788U JPH01159397U (en) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5565788U JPH01159397U (en) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01159397U true JPH01159397U (en) | 1989-11-06 |
Family
ID=31281560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5565788U Pending JPH01159397U (en) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01159397U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020080379A (en) * | 2018-11-13 | 2020-05-28 | マイクロクラフト株式会社 | Device and method for forming film |
-
1988
- 1988-04-25 JP JP5565788U patent/JPH01159397U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020080379A (en) * | 2018-11-13 | 2020-05-28 | マイクロクラフト株式会社 | Device and method for forming film |