JPH032674U - - Google Patents
Info
- Publication number
- JPH032674U JPH032674U JP6297689U JP6297689U JPH032674U JP H032674 U JPH032674 U JP H032674U JP 6297689 U JP6297689 U JP 6297689U JP 6297689 U JP6297689 U JP 6297689U JP H032674 U JPH032674 U JP H032674U
- Authority
- JP
- Japan
- Prior art keywords
- layers
- insulating material
- metal substrate
- conductor circuit
- material layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例に係る多層プリント
配線板の構造を示す段面図である。
１１……金属基板、１２，１４……絶縁層（絶
縁材料層）、１３，１５……導電回路（導電回路
層）、１６……バイアホール。
FIG. 1 is a step-by-step diagram showing the structure of a multilayer printed wiring board according to an embodiment of the present invention. 11... Metal substrate, 12, 14... Insulating layer (insulating material layer), 13, 15... Conductive circuit (conductive circuit layer), 16... Via hole.
Claims (1)
れた絶縁材料層並びに導体回路層を備え、上記多
層に形成された絶縁材料層並びに導体回路層が上
記金属基板の溶融点以下の温度で焼成れているこ
とを特徴とする多層プリント配線板。 Insulating material layers and conductor circuit layers alternately formed in multiple layers by printing on a metal substrate, and the insulating material layers and conductor circuit layers formed in the multilayers are fired at a temperature below the melting point of the metal substrate. A multilayer printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6297689U JPH032674U (en) | 1989-05-30 | 1989-05-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6297689U JPH032674U (en) | 1989-05-30 | 1989-05-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH032674U true JPH032674U (en) | 1991-01-11 |
Family
ID=31592615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6297689U Pending JPH032674U (en) | 1989-05-30 | 1989-05-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH032674U (en) |
-
1989
- 1989-05-30 JP JP6297689U patent/JPH032674U/ja active Pending
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