JPS5929008U - thick film wiring board - Google Patents

thick film wiring board

Info

Publication number
JPS5929008U
JPS5929008U JP12523182U JP12523182U JPS5929008U JP S5929008 U JPS5929008 U JP S5929008U JP 12523182 U JP12523182 U JP 12523182U JP 12523182 U JP12523182 U JP 12523182U JP S5929008 U JPS5929008 U JP S5929008U
Authority
JP
Japan
Prior art keywords
thick film
wiring board
film wiring
recess
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12523182U
Other languages
Japanese (ja)
Inventor
久下　亨
公一 伊藤
小野　晃二
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP12523182U priority Critical patent/JPS5929008U/en
Publication of JPS5929008U publication Critical patent/JPS5929008U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図および第２図は葎来の厚膜配線基板を示すもので
、第１図はそのスパイラルコイルが形成された部分を示
す平面図、第２図はそのＡ−Ａ線断面図、第３図は本考
案に係る厚膜配線基板の一実施例を第２図に対応した部
分について示す断面図である。 １０・・・厚膜配線基板、１１・・・基板、１２・・・
凹部、□１３・・・配線パターン。Figures 1 and 2 show a thick-film wiring board made by Fura. Figure 1 is a plan view showing the part where the spiral coil is formed, Figure 2 is a cross-sectional view taken along line A-A, FIG. 3 is a sectional view showing a portion corresponding to FIG. 2 of an embodiment of the thick film wiring board according to the present invention. 10...Thick film wiring board, 11...Substrate, 12...
Recess, □13... wiring pattern.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）絶縁基板上に、パターンに対応した凹部を形成し
、該凹部内に導電性のペーストを充填して厚膜素子を形
成したことを特徴とする厚膜配線基板。 ・　　（２）　　上記厚膜素子は、スパイラルコイルで
ある実用新案登録請求の範囲第（１）項記載の厚膜配線
基板。(1) A thick film wiring board characterized in that a recess corresponding to a pattern is formed on an insulating substrate, and a conductive paste is filled in the recess to form a thick film element. (2) The thick film wiring board according to claim (1), wherein the thick film element is a spiral coil.
JP12523182U 1982-08-19 1982-08-19 thick film wiring board Pending JPS5929008U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12523182U JPS5929008U (en) 1982-08-19 1982-08-19 thick film wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12523182U JPS5929008U (en) 1982-08-19 1982-08-19 thick film wiring board

Publications (1)

Publication Number Publication Date
JPS5929008U true JPS5929008U (en) 1984-02-23

Family

ID=30285202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12523182U Pending JPS5929008U (en) 1982-08-19 1982-08-19 thick film wiring board

Country Status (1)

Country Link
JP (1) JPS5929008U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274880A (en) * 1985-09-30 1987-04-06 Mitsubishi Heavy Ind Ltd Folding guide in folding machine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6274880A (en) * 1985-09-30 1987-04-06 Mitsubishi Heavy Ind Ltd Folding guide in folding machine

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