JPS59101459U - Terminal structure of thick film wiring board - Google Patents

Terminal structure of thick film wiring board

Info

Publication number
JPS59101459U
JPS59101459U JP20179082U JP20179082U JPS59101459U JP S59101459 U JPS59101459 U JP S59101459U JP 20179082 U JP20179082 U JP 20179082U JP 20179082 U JP20179082 U JP 20179082U JP S59101459 U JPS59101459 U JP S59101459U
Authority
JP
Japan
Prior art keywords
thick film
wiring board
terminal structure
film wiring
film layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20179082U
Other languages
Japanese (ja)
Inventor
棚橋　万起
八段　英明
純夫 堀池
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Priority to JP20179082U priority Critical patent/JPS59101459U/en
Publication of JPS59101459U publication Critical patent/JPS59101459U/en
Pending legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図Ａ、　Ｂは従来の端子部構造の平面図、Ｂ−Ｂ断
面図、第２図はこの考案の実施例の端子部構造の平面図
、Ａ−Ａ断面図である。 １・・・基板、３・・・接続用端子、４・・・半導体ペ
レット、６・・・熱伝導率の小さい厚膜層。1A and 1B are a plan view and a sectional view taken along the line BB of a conventional terminal structure, and FIG. 2 is a plan view and a sectional view taken along the line AA of the terminal structure according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Substrate, 3... Connection terminal, 4... Semiconductor pellet, 6... Thick film layer with low thermal conductivity.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 接続用−子の形成される基板位置に熱伝導率の小さい厚
膜層を形成し、この厚膜層の上に導電厚膜層を積層形成
して導体パターン端子部を構成したことを特徴とする厚
膜配線基板の端子部構造。A thick film layer with low thermal conductivity is formed at the position of the substrate where the connecting element is formed, and a conductive thick film layer is laminated on this thick film layer to form the conductor pattern terminal part. Terminal structure of thick film wiring board.
JP20179082U 1982-12-24 1982-12-24 Terminal structure of thick film wiring board Pending JPS59101459U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20179082U JPS59101459U (en) 1982-12-24 1982-12-24 Terminal structure of thick film wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20179082U JPS59101459U (en) 1982-12-24 1982-12-24 Terminal structure of thick film wiring board

Publications (1)

Publication Number Publication Date
JPS59101459U true JPS59101459U (en) 1984-07-09

Family

ID=30427278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20179082U Pending JPS59101459U (en) 1982-12-24 1982-12-24 Terminal structure of thick film wiring board

Country Status (1)

Country Link
JP (1) JPS59101459U (en)

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