JPS6033466U - electrical circuit board - Google Patents
electrical circuit boardInfo
- Publication number
- JPS6033466U JPS6033466U JP12501383U JP12501383U JPS6033466U JP S6033466 U JPS6033466 U JP S6033466U JP 12501383 U JP12501383 U JP 12501383U JP 12501383 U JP12501383 U JP 12501383U JP S6033466 U JPS6033466 U JP S6033466U
- Authority
- JP
- Japan
- Prior art keywords
- conductive part
- circuit board
- electrical circuit
- metal layer
- thin metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例に係る電気回路基板の一部平面
図、第２図から第４図は他の実施例に係る電気回路基板
を示したもので、第２図は電気回路基板の縦断面図、第
３図は第２図の表面の平面図、第４図は第２図の裏面の
平面図である。
１・・・絶縁基板、２Ａ、 ２Ｂ、 ２Ｃ・・・導電部
、３Ａ、３Ｂ、３Ｃ・・・内側金属薄層、４Ａ、４Ｂ、
４Ｃ・・・外側金属薄層。Fig. 1 is a partial plan view of an electric circuit board according to an embodiment of the present invention, Figs. 2 to 4 show electric circuit boards according to other embodiments, and Fig. 2 is a partial plan view of an electric circuit board according to an embodiment of the present invention. 3 is a plan view of the front side of FIG. 2, and FIG. 4 is a plan view of the back side of FIG. 2. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2A, 2B, 2C... Conductive part, 3A, 3B, 3C... Inner metal thin layer, 4A, 4B,
4C...outer metal thin layer.
Claims (1)
導電部とを絶縁基板上に対向位置に配置した電気回路基
板において、前記第１の導電部および第２の導電部の少
なくとも一方の導電部を、半田付は性の良好な金属材料
を用いた内側金属薄層で形成され、少なくともその内側
金属薄層の他の導電部と対向する側にマイグレーション
が発生しにくい金属材料を用いた外側金属薄層で被った
ことを特徴とする電気回路基板。In an electric circuit board in which a first conductive part and a second conductive part having a potential difference with the first conductive part are disposed at opposing positions on an insulating substrate, the first conductive part and the second conductive part At least one conductive part is formed of an inner thin metal layer using a metal material with good solderability, and at least the side of the inner thin metal layer facing the other conductive part is made of a metal material that does not easily migrate. An electric circuit board characterized in that it is covered with an outer thin metal layer using.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12501383U JPS6033466U (en) | 1983-08-13 | 1983-08-13 | electrical circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12501383U JPS6033466U (en) | 1983-08-13 | 1983-08-13 | electrical circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6033466U true JPS6033466U (en) | 1985-03-07 |
Family
ID=30284784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12501383U Pending JPS6033466U (en) | 1983-08-13 | 1983-08-13 | electrical circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033466U (en) |
-
1983
- 1983-08-13 JP JP12501383U patent/JPS6033466U/en active Pending
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